Solution Consultant Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Join us as a Staff Verification Architect and shape modular, scalable verification solutions for next-generation HBM DRAM products across multiple customer platforms! You will be part of a highly multi-functional team of technical domain experts. You will collaborate closely with Design Engineering, Product Engineering, Business Units, and external customer teams to ensure our future HBM roadmap is successful. You will apply your thorough understanding of testbench architecture, custom and SoC verification methodologies, and 2.5D & 3D package integration to analyze bottlenecks and propose innovative solutions targeting scalability, quality, and verification cycle time. Responsibilities: Deliver high-quality, on-time verification plans and architecture collateral across IP-level and SoC-level verification, and develop turnkey solutions for future designs based on look-ahead information from customers and the architecture team Drive co-verification through direct customer interactions, and mentor early-career engineers to strengthen team capability and tech

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Monitor and react to wafer quality indicators and quality events highlighted by Fab Process, Product Engineering, and Site QA teams. Proactively contain any deviated or non-conforming material from shipping out to both internal and external customers. Create technical product risk assessment reports on deviated or non-conforming material in your areas of ownership, decide on additional QA data collection requirements, and recommend final disposition of the product. Coordinate Global MRB (Material Review Board) meetings with PQRA, PE, Site QA, and Supply Chain, Finance teams to assess product quality and reliability risk and finalize disposition balancing supply chain and Q&R risks. Monitor Outgoing Quality Control (OQC) from BEOL processes and coordinate with BE Assembly and Test teams to disposition deviations assigned to FE Fabs. Assess risk, define Q&R data collection requirements, and approve planned deviations as part of Global Conversion/Change Management business process. Create SBL QRA hold criteria, maintain, and update criteria on regular cadence. Coordinate with Site QA team to identify root- cause for RMAs & deviations and drive corrective and preventive actions using systematic problem-solving methodologies such as 8D, 5 Whys, and/or Fishbone. Collaborate with Site QA team to formalize Customer Communication for all Automotive RMA’s, CSPL Inline and Electrical specification CpK performances. Lead projects to drive global compliance to manufacturing quality standards and support Automotive Zero Defects program. Design and develop automa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a strong, well rounded leader who works well cross functionality to shape and execute our strategic efforts around M&A, Venture Capital, and Corporate Business Development activities: Responsibilities Drive M&A and Venture Capital strategy in partnership with senior corporate and subsidiary leadership, including opportunity identification and prioritization. Lead sourcing, evaluation, and due‑diligence efforts for M&A, VC, and partnership opportunities, assessing strategic fit, financial value, and integration requirements. Manage cross‑functional teams through diligence, deal execution, operational assessment, and post‑deal integration planning. Build and maintain strong relationships with target company executives while regularly scanning markets for new business and technology opportunities. Prepare acquisition proposals, validate financial models, and deliver strategic recommendations and presentations to executives and key collaborators. Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiven

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Validation Execution Lead end‑to‑end Validation Run execution in a high‑pressure, fast‑paced environment , ensuring on‑schedule starts/completions , risk‑aware re‑plans , and efficient IQP/ETV material usage . Own time‑bound data crunching pipelines (automated log parsing, metrics aggregation, anomaly ranking) and deliver decision‑ready summary reports and sightings by agreed Cycle Time . Guarantee coverage completeness across MBIST and Native flows; drive Hot/Cold corners , TSV screen/AQLK , async timing boundary coverage, and evidence‑backed closure . Platform Leadership Develop and debug test programs on SM3/Cobra and Advantest V93K ; enforce code quality, reviews, and release discipline. Align hardware configs ( handler, socket, loadboard, probe card ) to test intent and throughput targets. Advanced Analysis, Verilog Simulation & Automation Perform power/thermal characterization ; correlate IDD/thermal data with performance/reliability; author recommendations for content changes and silicon fixes. Architect and execute

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield related brea

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities Validation Execution Assist in executing Validation Runs on IQP/ETV materials under defined timelines, ensuring coverage completeness across MBIST and Native Mode flows. Support time-bound data crunching (log parsing, statistical summaries) and contribute to summary report preparation. Platform & Test Program Support Operate and debug programs on SM3/Cobra (MBIST) and Advantest V93K (Native) . Assist in hardware readiness: handler, socket, loadboard, and probe card setup. Technical Analysis & Simulation Validate high-speed I/O (>11 Gbps) and assist with eye diagram and signal integrity checks. Support Verilog simulation tasks (testbench execution, waveform review) to reproduce sightings and validate fixes. Data & Automation Develop basic scripts in Python for log parsing and data visualization. Maintain documentation in Confluence/Jira and version control in Git/Perforce. Debug & Collaboration Participate

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future. Main Responsibilities: Process Development: Establish and improve process management projects to deliver technology node requirements and scaling for next node for wafer level process conditions and technologies including photolithography, dry etch, CMP, wet process, de

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to accelerate intelligence to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Capital Engineer serves as a key contributor to Global FE Capital Management by driving process governance, continuous improvement, and digital transformation initiatives. The role focuses on strengthening capital planning and management processes, ensuring compliance and operational excellence, implementing AI and automation solutions, and delivering actionable insights through analytics and performance reporting. Working closely with Site Planning teams, Finance, Procurement, Facilities, and digital stakeholders, the engineer will lead cross-functional initiatives that improve efficiency, standardization, productivity, and business outcomes across the capital organization. Roles and Responsibilities 1. Capital Process Governance & Compliance Drive governance and compliance for Global Frontend (FE) capital management processes. Establish, document and maintain process standards, business rules, controls, and operating procedures.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The SSD Engineering team develops the firmware that powers Micron's industry-leading storage solutions. By combining embedded systems expertise, software innovation, and AI-enabled development practices, the team delivers high-performance, reliable SSD products for client, enterprise, and data center applications. As an SSD Firmware Intern, you will work alongside experienced engineers to develop, test, and improve firmware for Micron's SSD products. This role provides hands-on experience in embedded systems, firmware development, debugging, and AI-assisted engineering workflows while contributing to the performance, quality, and reliability of next-generation storage solutions. Responsibilities Collaborate with firmware engineers to develop, test, and enhance SSD firmware features and functionality. Debug and resolve firmware issues to improve product performance, reliability, and quality. Develop and implement test plans to validate firmware functionality and support product qualification activities. Participate in code reviews and contribute to continuous improvements in code quality and development processes. Document firmware features, updates, and technical information for internal and external stakeholders. Minimum Qualifications 0-2 years of relevant experience through internships, research, coursework, academic projects, or software/firmware development activities. Currently pursuing a Bachelor's degree in Electr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions for AI, machine learning, and high-performance computing applications. We are seeking an experienced HBM Architecture Engineer to define and drive the architecture of high-speed analog and mixed-signal IO subsystems for HBM products. This role focuses on PHY IO architecture, timing methodology, analog calibration schemes, and silicon learning frameworks that enable industry-leading bandwidth, power efficiency, and robustness. The successful candidate will collaborate across Design, Product Engineering, Modeling, Verification, Packaging, and System Architecture teams to define architectural requirements, drive technology innovation, and ensure successful translation from concept to silicon. As a technical leader, you will influence future HBM roadmap decisions, develop engineering methodologies, and mentor design teams on architectural principles, calibration strategies, and best practices for high-speed IO design. Key Responsibilities Define and drive next-generation HBM PHY and IO architecture , balancing performance, power, area, reliability, and manufacturability requirements. Architect high-performance transmit and receive paths , including clocking, signaling, equalization, timing alignment, and interface optimization. Define and optimize analog calibration architectures , including impedance calibration, reference v

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking for motivated individuals to join the NVMQRA team working as a reliability test program Engineer. In this position, you will be responsible for design, develop and maintain NAND reliability test programs. You will be working closely with NAND Product Quality Engineer, Product Engineering and Operation teams to evaluate NAND products in all reliability aspects during new product development phase. Your main responsibilities include: Develop reliability stress and testing methodology for NAND product Develop and maintain NAND product reliability and characterization test programs Working with product reliability engineers to define reliability test flows for individual product Provide support to operation team to ensure seamless execution for generated test flow on the tester with live product Provide test program related support for failure validation and characterization. Contribute to burn-in board design and software development The ideal candidate should have a good mix of understanding Flash memory reliability testing requirements and software background in C&#43;&#43;/Python. Understand of Automate Test Equipment and specifically Ambyx is a plus. You are encouraged to apply if you could demonstrate some of the qualities listed below: <

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. We are looking for an Engineer/Senior Engineer in Product Engineering, NAND Functional and Design Validation Infrastructure (FDV-Infrastructure) , experienced in silicon validation, failure analysis, and infrastructure development. Strong focus on automation, data‑driven validation, and leveraging AI to improve test efficiency, coverage, and debug productivity. Key Responsibilities: Design and execute functional and design validation flows for advanced RG NAND devices using silicon platforms Develop and maintain test program infrastructure , including deterministic usage ‑ case tests, random sequence generators and new NAND interface. Implement automation frameworks using C ‑ based programming, Python, and Perl to improve test development and execution efficiency Apply AI/ML ‑assisted techniques (data analytics, pattern recognition, anomaly detection) to: Accelerate failure triage and root ‑ cause analysis workflows I

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Project Title: Development of an AI-Driven Reliability Analytics and Automation Framework for NAND Product Engineering Description This project aims to use an already developed intelligent analytics and automation framework to enhance efficiency, decision-making, and productivity within NAND Reliability Engineering. The intern will leverage data analytics, artificial intelligence (AI), and software automation techniques to process large volumes of reliability and qualification data, identify trends, and generate actionable engineering insights. Key responsibilities include: Analyzing NAND reliability and qualification datasets to identify patterns and improvement opportunities. Presenting technical findings and recommendations to engineering teams. Scope of Work - Execution of MAF/ULR wave tests - Log collection and analyzing - Level-1 Failure Analysis Supporting team NAND Intrinsic Reliability (NIR) Team (Primary) Global Quality & Reliability Engineering (QRE) Team Test Program Development Team Deliverables Technical Documentation User guide, architecture overview, and maintenance documentation. Source code repository with appropriate documentation. Final Presentation Presentation summarizing project objectives, methodology, results, lessons learned, and future enhancement opportuni