Staff Principal Spares Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Summary Department Introduction: Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information to enrich life for all. The Global Procurement team partners across engineering, manufacturing, and supplier ecosystems to ensure scalable, cost-effective, and resilient sourcing strategies that support Micron’s technology roadmap and manufacturing excellence. Position Overview: As a Principal Category Manager for Capital Equipment, you will lead global sourcing strategy and supplier engagement for key semiconductor equipment categories such as Etch, Deposition, CMP, Wet Process, Implant, Photo, and Metrology. You will act as a strategic partner to engineering and operations teams, driving long-term cost, performance, and supply continuity outcomes. This role requires strong commercial leadership, deep market expertise, and the ability to influence executive team members and suppliers to deliver measurable business impact. Responsibilities Define and lead global category strategies for capital equipment, including supplier selection, sourcing models, and long-term roadmap alignment. Conduct market intelligence analysis, including supplier capability mapping, technology trends, pricing models, and cost curves. Lead executive-level supplier engagement, including strategic reviews, performance management, and escalation handling. Negotiate complex, multi-year global agreements covering pricing, capaci

Staff/Principal - Wet Mechanical Operations Engineer — Syracuse, NY - Downtown Office. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: The resp

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND . You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Main Responsibilities: As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts Advance

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job / Role Summary The Staff Engineer owns defined Realtime Defect Analysis (RDA) scope within NAND Technology Development, developing and sustaining advanced defect detection and inspection strategies that accelerate learning, improve yield, and support technology transfer to manufacturing. This role leads defect analysis, inspection recipe and sampling optimization, excursion containment, and cross-functional issue resolution. The position collaborates with Process Integration, Yield, Data Science, Global Manufacturing, and equipment suppliers to strengthen process monitoring, standardize Best Known Methods, and align inspection capability with future NAND technology nodes. Main Responsibilities Own the site-level RDA strategy and annual roadmap aligned with NAND Technology Development nodes. Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects. Establish, track, and report program health metrics, including baseline he

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Principal Engineer - Process Development, CMP, NAND Job / Role Summary The Principal Engineer provides technical leadership for Chemical Mechanical Planarization (CMP) process development supporting advanced 3D NAND and future technology nodes. This role leads process characterization, margin improvement, integration, and transfer readiness, while driving cross-functional alignment with global development, manufacturing, equipment, and supplier teams. The position resolves complex process, yield, defectivity, and manufacturability challenges, influences module and site-level technical direction, and advances robust CMP capability for high-volume production through disciplined experimentation, process control, and technology roadmap execution. Main Responsibilities · Lead CMP process characterization and advanced process development for 3D NAND and future technology nodes. · Define and execute CMP process strategies that improve process margin, robustness, manufacturability, yield, and performance. · Lead complex experiments and data analysis to validate process windows, technology scaling readiness, and integration requirements. · Drive transfer of developed CMP processes to high-volume manufacturing at Fab10N and lead cross-func

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Summary Department Introduction The OCT Material & Filtration Engineering team supports Micron’s global manufacturing network. The team focuses on material quality, risk reduction, and continuous improvement to enable successful technology ramps and sustainable manufacturing performance. We collaborate closely with engineering, quality, procurement, and operations partners around the world. Position Overview As an OCT MTE Material Engineering Staff/Principal Engineer, you will contribute to material quality, filtration strategy, and value‑engineering efforts across multiple sites. In this role, you will help shape global material strategies, strengthen risk controls, and share guidelines that improve safety, quality, speed, and cost. This position offers opportunities to grow technical influence while making a meaningful impact on technology development and high‑volume manufacturing. Responsibilities Support and lead material quality, filtration, risk mitigation, and value‑engineering initiatives across the global network. Partner with global and site teams to define and align material technical requirements and qualifications. Develop, share, and sustain Best Known Methods (BKMs) across manufacturing sites. Collaborate with fabs to build and complete material roadmaps that support technology ramps. Facilitate global peer teams to align priorities, strategies, and execution to manufacturing goals. Plan and manage projects aligned to fab, central, and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and propose yield

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify , diagnose, and propose y

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post- fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Staff/Principal Full-Stack AI Engineer, IPAI, SMAI Job Summary Lead the Future of AI-Powered Manufacturing at Micron Micron is accelerating its transformation toward Autonomous Operations through Artificial Intelligence, advanced analytics, digital twins, robotics, and intelligent automation. As a Staff/Principal Full-Stack AI Engineer , you will be a technical leader driving the strategy, architecture, and delivery of next-generation AI products that power smarter manufacturing across Micron's global network of fabs and assembly/test sites. In this highly influential role, you will own AI solutions end-to-end—from data engineering, machine learning, and agentic AI systems to modern full-stack applications, digital twin platforms, robotics integration, and edge-to-cloud deployment. Working closely with data scientists, software engineers, robotics teams, and manufacturing leaders, you will transform innovative ideas into scalable, production-grade solutions that improve efficiency, increase automation, and enable intelligent decision-making at enterprise scale. This is a unique opportunity to shape the future of AI in semiconductor manufacturing and directly contribute to Micron's vision of autonomous, data-dri

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. As a Product Engineer working directly in support of the NAND Product Development Team Leader, your role involves collaborating with cross-functional teams to propel new product development and spearhead the integration of AI solutions into actionable strategies and plans. In this capacity, you represent the NAND engineering team, engaging with strategic partners such as business units, quality assurance, fabrication, testing, and supply chain to ensure a competitive time-to-market for the newest technology nodes, from silicon to system. This role is highly impactful, offering broad scope and high visibility. It presents an opportunity to contribute to Micron’s next generation of technology and product enablement alongside a dedicated and highly skilled cross-functional team. Key Responsibilities: Negotiate and align NAND requirements with business units and SSD development leads, transforming these requirements into qualification specs that guide NAND develop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is the fastest growing semiconductor company in India offering a wide & attractive range of career opportunities. One of the rapidly growing functions within Micron India is the Non-Volatile Engineering (NVE) System Integration (Solution) Product Engineering team in Hyderabad which is responsible for the integration of new non-volatile products into various system solutions (SSD, UFS, uSD ), end- to-end product challenges being solved for maximum value and streamlin ing of overall development effort, complexity, and risk. We enable parallel NAND and System development through feature optimization and innovative solutions, demonstrating technical expertise o n both sides. Responsibilities: System triage activities through failure analysis on both NAND Component and System-level to identify sources of failure, drive issue-based taskforces to establish solutions & unblock critical system development. Innovations in system triage methodology <span