Staff Quality Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As Staff Engineer in Micron’s High Bandwidth Memory (HBM) Component Validation team, you will contribute as Subject Matter Expert (SME) and contribute to define new standards on validation development for advanced HBM products and ensure stable, scalable validation testing infrastructure with zero code-related escapes across MBIST, Native test modes and high speed memory validation. You own optimizing test flows, and lead technical problem solving for next generation HBM products. You’ll drive validation development deliverables and mentor junior engineers. Why Join Us You’ll gain hands-on experience with cutting-edge HBM technologies and validation platforms, working alongside global experts. This role offers opportunities to learn advanced validation techniques, drive and deliver product readiness, technology solutions and innovations, and grow into technical leadership roles. Responsibilities Test program development SME: Drive and develop and maintain test programs for HBM component validation Deliver timely test program releases aligned with validation milestones and drive code quality, reviews, and release best-practices Drive test time optimization and parallelism improvements Drive test stab

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: T

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Operations Central Team (OCT) Diffusion/Implant Manufacturing Alignment Senior Engineer/Staff Engineer will drive tool and process optimization, global manufacturing alignment, and preventive maintenance standardization across the Micron network. This role will collaborate with equipment and process engineering teams to improve tool utilization, develop safe shutdown and recovery procedures, deploy equipment and process BKMs, and sustain global standards through systems such as SEAL. The position requires strong technical experience in the Diffusion or Implant area, problem-solving capability, effective cross-functional communication, and the ability to support AI-assisted data analysis and workflow improvement. Take on an outstanding opportunity at Micron, where new ideas meet outstanding quality. As an OCT Diffusion/ Implant MFG Alignment Sr Engineer/ Staff Engineer in Hiroshima, you will maintain and improve our innovative manufacturing systems and methods. Collaborate with a group that shares your passion for detail and your aim to achieve international excellence! Responsibilities: Improve tool utilization to meet world-class standards by refining processes that eliminate underutilized tools and enable cost savings through strategic cold/warm shutdowns. Develop globally aligned warm shutdown procedures that ensure safety and flawless recovery to production. Standardize practices and proven methods (BKMs) across process areas by establishing global alignment tea

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are looking for an experienced Water Senior/Staff Engineer, Global Facilities, North Asia to join our ambitious team at Micron. This is an excellent opportunity to lead water and wastewater system composition for design and construction projects at a world-class technology company. This is also an opportunity to lead using AI for improvement of daily work efficiency and effectiveness by using generative AI, AI assistant and other AI tools. Responsibilities and Tasks: Lead the development for design and construction projects and integrate critical operational and maintenance aspects. Offer technical assistance and knowledge, guaranteeing seamless alignment of business processes for operational and maintenance initiatives. Represent regional facility O&M alignment initiatives, collaborating closely with the central team on critical metrics. Drive improvement in utilities quality through variation reduction and ensure alignment on common methodologies like SPC, conformance, SIPP’s, MOC, and 8D problem solving. Improve and minimize energy consumption for UPW/WWT systems, and pinpoint cost-saving initiatives throughout the network. Assess and ensure effective PM and predictive maintenance programs, procedures, and checklists. Regularly communicate with site engineering and O&M teams on status and performance, analyzing and benchmarking equipment performance. Develop and deploy training and certification programs, driving improvement th

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop and deploy transformative, model‑based solutions to improve frontend yield, quality, and technology ramp performance. Apply virtual structure modeling, process simulation/emulation, and advanced analytics to understand sophisticated lithography‑film‑etch interactions and prescribe actionable process solutions. Leverage AI and data‑driven techniques to accelerate yield learning, process window characterization, and integration optimization. Collaborate with PIE, Process/Equipment, Metrology, and SMAI , and other cross‑functional partners to design, validate, and deploy solutions into manufacturing. Drive solution deployment across sites, including technology transfer and ramp support. Maintain strong engagement in research and development , continuously evaluating emerging modeling, simulation, and AI methodologies for semiconductor manufacturing. Contribute to knowledge sharing, technical mentoring, and capability building within the FE engineering community. Requirements / Qualifications Education Master’s or PhD in Electrical Engineering, Computer Engineering, Industrial & Systems Engineering, Mechanical Engineering, Chemical Engineering, Materials Engineering, Applied Statistics, Applied Mathematics, Operations Research , or other relevant engineering/science fields. Experience More than 5 years of working experien

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownership, Process efficiency, Quality defense line and Yield improvement initiatives. Partner with suppliers to develop the process and equipment roadmap to meet Micron’s technology roadmap. Prioritize and lead multiple projects based on Fab and corporate objectives. Communicate and respond to issues in a timely manner, with a cadence appropriate to the priority of the issue. Keep collaborators and team members informed of project status, progress, and roadblocks/opportunities. Requirements: Bachelor’s degree in engineering. Min. 5 years of experience working as a CMP Process/Equipment Senior Engineer. Strong people and collaboration skills to lead globally sites on BKM alignments. Self-motivated: Able to work independently with minimal supervision. Dependability and able to work effectively in cross-functional teams. Good organization skills and able to plan and prioritize. Excellent verbal, listening and written communications skills. Strong attention to details. The ability to interface with suppliers professionally. Willin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Frontend Central Product Integration Engineering (PIE) team delivers best‑in‑class yield, quality, and cycle time through innovation and strong cross‑functional teamwork. Supporting diverse DRAM and NAND technologies across global development and manufacturing sites (Boise, Japan, and fabs in the U.S., Taiwan, Japan, and Singapore), the team identifies, aligns, and deploys best‑known methods across the network. As a Frontend Central Process Integration Senior Engineer, you will develop and optimize processes to drive rapid product maturity. Join us today and make a difference! Responsibilities and Tasks Drive rapid product maturity, improving yield (bits per wafer), repair density, and DPM through fast learning cycles. Apply deep process integration knowledge across FEOL, MOL, CELL, and BEOL to identify optimal solutions; design and circuit knowledge is a plus. Partner with Yield Engineering, Device, RDA, and Metrology teams to resolve key yield issues and build strong inline visibility for fast ramp and excursion prevention. Identify and standardize best‑known methods and business processes across DRAM and NAND sites. Travel to Micron sites as needed for onsite collaboration. Minimum Qualifications Bachelor’s degree in Engineering or a related field 5+ years of experience in process integration, product design, or equivalent technical roles Demonstrated ability to collaborate optimally with global, cross‑functional teams Proven t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron's world-class team as a Global Facilities North Asia Regional Chemical Engineer! This outstanding opportunity allows you to lead business process alignment in design, construction project composition, management, schedule, cost control, testing & commissioning, and operational and maintenance programs for chemical & slurry systems across our manufacturing sites. Your role will be pivotal in ensuring our facilities run flawlessly, maintaining our competitive edge in the industry. Key Responsibilities Project Design and Construct and develop regional greenfield projects aligned with global standards. Collaborate with central sustainability, cost, construction, and line planning teams. Offer engineering assistance for site projects and sustainability efforts. Review and approve site capacity expansion and capital expenditures. Make decisions based on business needs for Facilities Reliability Improvement project capital expenditures. Reliability Support site system improvement projects, including system reliability improvements, quality enhancement, and equipment end-of-life replacements. Coordinate regional efforts and identify strategic program alignment opportunities (e.g., BCP, Critical Spec, Quality Defense Line). Offer engineering assistance for significant SIPP evaluations. Share lessons learned from regional events and influence the development of glob

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As the Global Facilities Regional Engineering Electrical Engineer you will be responsible for providing technical support, expertise, and lead business process alignment on construction project design, management, schedule, cost control, testing & commissioning, operational and maintenance programs for the facility Electrical systems at all manufacturing sites in your location / region. As a global team member residing in your current site/geography, you will represent all facility design standard alignment, construction project management, O&M BKM alignment initiatives. You will also support the Global Facilities Central Engineering Team, Construction Team , Line Planning Team and O&M Team in providing critical design standard alignment, supplier quality improvement, operational and maintenance input and support construction projects. Critical metrics include construction project management, schedule, cost control, safety

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff DFT Design Engineer, you will work on design, simulation, and validation of next generation High Bandwidth Memory (HBM) architectures and circuit blocks. The HBM DFT Design Engineer is responsible for defining, designing, and integrating Design for Test (DFT) architectures for next generation High Bandwidth Memory (HBM) products. This role ensures robust test coverage across wafer, die, stack, and system in package (SiP) test stages while balancing performance, power, area, and manufacturing cost. The engineer works in a multi-functional manner with HBM build, verification, product engineering, test enablement, packaging, and external partners to deliver manufacturable, high quality HBM solutions. Responsibilities will include, but are not limited to: Define and implement HBM DFT architectures, including scan, MBIST, JTAG, boundary scan, TSV test, redundancy test, and at‑speed test structures. Develop DFT solutions for both base die and DRAM die, considering stacked‑die and cube‑level test requirements. Design and integrate test access mechanisms to support wafer probe, cube test, and SiP/system test flows. Collaborate with Product Engineering and Test Enablement teams to align DFT features with manufacturing test flows and cost targets. Support yield learning, failure analysis, and debug by enabling observability and controllability in silicon. Work closely with logic, analog, layout, verification, and physical design teams to ensure DFT is

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering. Lead the PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance. Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach. Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary. Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals. Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles. Travel to Micron Fab locations as necessary for face-to-face work. About Micron Technology, Inc. We are an industry leader in innovative memory

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Identify, diagnose and resolve assembly process related problems • Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step • Lead / participate in continuous yield improvement and cost reduction activities • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction • Support SPC/FDC/RMS/APC • Support site to site portability • Manage / audit material suppliers to achieve quality, cost and risk management objectives • Support internal and external audits Requirement: 1 years of experience in semiconductor manufacturing, packaging, or assembly processes. Ability to work in a cleanroom environment and flexibility to support on-call rotations or shifts when critical production issues arise. Strong analytical thinking, proactive problem-solving mindset, and a high degree of self-motivation. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses infor

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead and drive global Product Integration initiatives to improve yield, quality, and benchmark performance across technology nodes and products. Centralize and synthesize project information (design requirements, test challenges, yield learning) from multiple global teams and drive execution to closure. Drive yield breakthroughs by understanding the end‑to‑end test flow , product design and operation, packaging interactions, and manufacturing processes while balancing yield vs. reliability requirements. Foster technical innovation by characterizing device failure modes using deep knowledge of device architecture, physics, packaging interaction, and available test/process knobs . Define and drive strategies to ensure Packaging Technology and Chip‑Package Interaction are developed and qualified ahead of product qualification . Lead cross‑functional and cross‑site taskforces (Product, Test, Yield, Design, Fab, Packaging, Quality, TD) to resolve yield and quality challenges in a timely manner. Promote network Best‑Known‑Method (BKM) development, standardization, and business process creation or re‑engineering to improve productivity and efficiency. Maintain strong working relationships with stakeholders in Fab, Technology Development, Product Engineering, Test Engineering, Quality, and Packaging teams . Communicate project status, risks, an

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post- fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologi