Member of Technical Staff (MTS) – Process Development, Thin Films (CVD/Diffusion), NAND — Fab 10N/X, Singapore. Apply via Workday.
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1mo agoMember of Technical Staff (MTS) – Process Development, Cell Film, NAND — Fab 10N/X, Singapore. Apply via Workday.
Distinguished Member of Technical Staff (DMTS) – Process Development, Cell Film, NAND — Fab 10N/X, Singapore. Apply via Workday.
Distinguished Member of Technical Staff (DMTS) – Process Development, Wet, NAND — Fab 10N/X, Singapore. Apply via Workday.
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1mo agoMember of Technical Staff (MTS) – Process Development, WET, NAND — Fab 10N/X, Singapore. Apply via Workday.
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1mo agoMember of Technical Staff (MTS) – Process Development, Dry Etch, NAND — Fab 10N/X, Singapore. Apply via Workday.
FE CPIE PI Principal/Staff Engineer — 2 Locations. Apply via Workday.
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1mo agoMember of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.
Distinguished Member of Technical Staff, NAND Advanced Thin Films Process Development — Fab 10N/X, Singapore. Apply via Workday.
Principal/Sr/Staff BEOL Engineer, DRAM PI — Hiroshima - Fab 15, Japan. Apply via Workday.
FE CPIE PI Principal/Staff Engineer — Boise, ID - ID1. Apply via Workday.
Member of Technical Staff, AI‑Optimized Memory Digital Design Engineer / Microarchitect — 2 Locations. Apply via Workday.
gitai
View job →Member of Technical Staff, AI Engineering — Boise, ID - Main Site. Apply via Workday.
OCT CPEE CMP STAFF/PRINCIPAL ENGINEER — 2 Locations. Apply via Workday.
OCT CPEE CMP STAFF/PRINCIPAL ENGINEER — 4 Locations. Apply via Workday.
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