System Design And Integration Engineer Jobs

NOTE: Although this position is in support of our US Government work, this role is located in Tokyo, Japan. A World-Changing Company Palantir builds the world’s leading software for data-driven decisions and operations. By bringing the right data to the people who need it, our platforms empower our partners to develop lifesaving drugs, forecast supply chain disruptions, locate missing children, and more. The Role Forward Deployed Software Engineers (FDSEs) understand our customers’ greatest pain points and design end-to-end solutions to address them. FDSEs solicit constant feedback on their work from both customers and colleagues, improving our products over time with rapid iteration cycles. FDSEs deploy ground breaking technical solutions to solve our customers’ hardest problems. Projects often start with a nebulous question like “Why are we losing customers?” or “How can we more effectively identify instances of money laundering?” FDSEs lead the way in developing a solution, from high-level system design and prototyping to application development and data integration. As an FDSE, you leverage everything around you: Palantir products, open source technologies, and anything you and your team can build to drive real impact. You work with customers around the globe, where you gain rare insight into the world’s most important industries and institutions. We help our customers detect insider trading, improve disaster relief, fight healthcare fraud, and more. Each mission presents different challenges, from the regulatory environment to the nature of the data to the user population. You will work to accommodate all aspects of an environment to drive real technical outcomes for our customers. Whether you aspire to be an entrepreneur or an engineering leader, we believe Palantir is the best place — with the best colleagues — to learn how. You’ll learn how to unpack a problem and understand the costs and consequences of its solution. You’ll learn new technolog

NOTE: Although this position is in support of our US Government work, this role is located in Seoul, South Korea. A World-Changing Company Palantir builds the world’s leading software for data-driven decisions and operations. By bringing the right data to the people who need it, our platforms empower our partners to develop lifesaving drugs, forecast supply chain disruptions, locate missing children, and more. The Role Forward Deployed Software Engineers (FDSEs) understand our customers’ greatest pain points and design end-to-end solutions to address them. FDSEs solicit constant feedback on their work from both customers and colleagues, improving our products over time with rapid iteration cycles. FDSEs deploy ground breaking technical solutions to solve our customers’ hardest problems. Projects often start with a nebulous question like “Why are we losing customers?” or “How can we more effectively identify instances of money laundering?” FDSEs lead the way in developing a solution, from high-level system design and prototyping to application development and data integration. As an FDSE, you leverage everything around you: Palantir products, open source technologies, and anything you and your team can build to drive real impact. You work with customers around the globe, where you gain rare insight into the world’s most important industries and institutions. We help our customers detect insider trading, improve disaster relief, fight healthcare fraud, and more. Each mission presents different challenges, from the regulatory environment to the nature of the data to the user population. You will work to accommodate all aspects of an environment to drive real technical outcomes for our customers. Whether you aspire to be an entrepreneur or an engineering leader, we believe Palantir is the best place — with the best colleagues — to learn how. You’ll learn how to unpack a problem and understand the costs and consequences of its solution. You’ll learn new tec

Job Details: Job Description: Note: This role requires regular onsite presence to perform essential job responsibilities. This position drives technology development and enablement for both high-volume manufacturing and future process technologies. Responsibilities include providing process integration and equipment solutions, conducting feasibility studies to meet device performance requirements, and leading the design and development of advanced manufacturing processes. The role involves material selection, parameter optimization, metrology, equipment engineering, and system design to enable new product architectures and functional requirements. The successful candidate will lead pathfinding activities that support process and hardware development for next-generation manufacturing technologies and will contribute to technology roadmaps that enable future product innovation. The role also includes identifying and implementing equipment and process improvements to enhance manufacturing efficiency, optimize production output, and improve operational performance. Qualifications: Minimum Qualifications Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 6+ years of semiconductor industry experience , primarily in dry etch process development. Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 9+ years of semiconductor industry experience , primarily in dry etch process development. 3+ years of experience collaborating with equipment suppliers (e.g., Lam Research, TEL, Applied Materials, Hit

Lead Electrophysics Engineer Company: The Boeing Company Boeing Defense Space & Security (BDS) is seeking highly motivated Lead Electrophysics Engineer (Level 5) to support various programs located in Huntington Beach, CA, Seal Beach, CA , or El Segundo, CA . As a part of one or more Systems Engineering Integration & Test (SEIT) teams, you will provide technical engineering and program support, while serving as the core point of contact between your payload products and the broader system team. In this role you will serve as the technical owner for a range of RF related payload products, with an emphasis on system performance, integration, supplier technical management, and cross-organizational interface management. Your products will include both experimental and operational systems, extending through all lifecycle phases (early feasibility studies through operation and disposal). An ideal candidate will be highly motivated, with a strong technical background in RF and Radar systems, space environments, and RF payload integration onto air or space platforms. Position Responsibilities: Provide expertise over a broad range of radar related activities, including performance and trade studies of radar systems and architectures Oversee development and implementation of radar signal image processing techniques Perform system engineering and integration of Radar Warning Receivers (RWR) into various systems Developing Concept of Operations for the design and utilization of RF products Perform Mission Design and payload effectiveness analysis Lead technical teams, including subcontractors, to oversee hardware and processing

Electronic System Design and Analysis Engineer (Experienced or Senior) Company: The Boeing Company The Boeing Test Operations and Engineering (TO&E) team in Berkeley , Missouri is seeking an Electronic System Design and Analysis Engineer to join our Instrumentation Installation Design group to support all major programs in the St. Louis area. We are currently hiring for a broad range of experience levels including Experienced and Senior Electronic System Design and Analysis Engineers. Position Responsibilities: Electrical Design & Testing AC and DC power applications Assisting shop with build information Reading electrical drawings/schematics Troubleshooting Electrical component/wiring faults Production Functional and Environmental Acceptance Testing Designing new test sets for various weapon and aircraft electronics Performs system tests to verify operational and functional requirements Supports resolution of product integration issues and production anomalies Researches basic technologies for potential application to company business needs Assists in monitoring suppliers' performance to ensure compliance with requirements Develops or modifies basic hardware and software designs based on defined requirements Assists with the development and documentation of electronic and electrical system requirements This position is expected to be 100% onsite. The selected candidate will be required to work onsite at one of the listed location options. Basic Qualifications (Required Skill/Experience): <

Electronic & Electrical System Design Engineer (Associate or Mid-Level) Company: The Boeing Company The Boeing Test and Evaluation (BT&E) organization is seeking an Electronic & Electrical System Design Engineer for the B-1 Bomber Avionics Integrated Support Facility (AISF) at Tinker Air Force Base, OK . The AISF Laboratory Operations Team is responsible for maintaining, configuring, and upgrading avionics hardware and special test equipment used to support development and testing of operational flight software. Other areas of responsibility include engineering and hardware sustainment that extends to multiple air force bases and labs across the United States. The AISF lab team plays a key role supporting the B-1 platform requirements in areas of avionics and weapons integration, by making changes in the lab first to ensure the software and hardware design are ready prior to ground and flight test. This engineering position is part of a small highly collaborative design team working multiple lab changes to satisfy customer requirements and ultimately the airmen who use the weapon system. This position is part of the Laboratory Operations team, comprising engineers, technicians, and cybersecurity professionals. BT&E is currently hiring for a broad range of experience levels including Associate or Mid-Level Electronic & Electrical System Design Engineers. Travel: This position will require occasional domestic travel up to 10% to support program objectives. Position Responsibilities: Design lab changes for new test articles and integration that support platform upgrades Design lab changes to existing systems to reso

We are looking for an innovative thermal solutions integration Engineer. NVIDIA offers you to be a part of the System Product Engineering group and be responsible for assuring the best quality products to be a sale and deliver to NVIDIA’ s customers. The job provides deep knowledge of NVIDIA systems, a system-level view of our solutions, and a dynamic and positive working environment and offers the candidates the opportunity to take a major role in our testing strategy by leading our thermal solutions integration and testing for the company production. NVIDIA Networking unit has continuously reinvented itself over two decades. Our high-speed buses & network products are leading in the markets with innovative ways to improve speed and bandwidth from one generation to another. Today, we are increasingly known as the place for getting “End-to-End High-Speed Ethernet and InfiniBand Solutions” We're looking to grow our company and build our teams with smart people who can join us at the forefront of technological advancement. If you are passionate about enabling the highest quality Network products that will change the world, we want to hear from you! What You’ll Be Doing: Integration and testing of next-generation, large-scale thermal, pressure, and liquid management solutions. Perform qualification tests for cutting edge cooling and sensing solution. Analyse and summarize thermal performance data and fluid dynamics results to support design reviews and decision-making. Primary onsite focal point for malfunctions in thermal liquid cooling stations. Diagnose and resolve hardware/software issues to maintain continuous development labs activity Maintain and update hardware (manifolds, connectors, sensors) and software versions across all thermal systems according to engineering specifications. Perform initial RCA on thermal system failures. Extract detailed fail reports and corrective/

What you’ll do Be the generalist EE for the scanner system: integration, bring-up, debugging, and making the electrical side of the device reliable and serviceable. Own ultrasound experimentations that feeds the image reconstruction team Design and execute experiment setups for transducer characterization (element sensitivity, bandwidth, cross-talk mapping, beam profile measurements) and ex vivo / phantom clinical testing. Acquire, process, and analyze RF and baseband signals for data quality assessment and benchmarking. Design simple boards and adapters as needed (monitoring, power/safety, interface/conditioning), and take them from prototype through a stable revision. Prototype quickly, then harden what works: wiring/harnessing, grounding, safety interlocks, and reliable integration across subsystems. Own practical test setups and documentation (fixtures, scripts, procedures) that make experiments repeatable and results comparable over time. What we’re looking for Strong hands-on EE background with experience building, debugging, and iterating on real systems in the lab. Solid understanding of signal processing fundamentals — knows what to measure, how to condition and digitize it, and how to evaluate signal quality in the context of an imaging system (SNR, bandwidth, dynamic range, artifacts). Comfortable spanning system integration + occasional design work (schematics/layout reviews or light PCB design) in a fast-moving environment. Ability to work at the boundary between hardware and algorithms: measure reality, communicate constraints, and help close gaps vs simulation. High agency and practicality: able to set up experiments, get trustworthy data, and unblock others on a lean team. Useful experience Analog/mixed-signal, or high-speed data capture experience; strong instincts for instrumentation and noise/debugging. Ultrasound or acoustic sensor handling: hydrophone calibration and field mapping, transducer impedance characterization, element-level sensitivity

Integration meets Innovation At Celigo, we believe integration should empower — not exhaust — innovation. As a modern Integration and Automation Platform (iPaaS), we’re on a mission to simplify how companies integrate, automate, and optimize processes. Powered by game-changing technology like runtime AI and prebuilt, mission-critical integrations, Celigo is redefining how businesses connect their world. Celigo is looking for a Design Engineer to close the gap between design intent and production reality, and to build the systems that make that gap permanently smaller. This is the first Design Engineer seat at Celigo, which means real ownership from day one and the chance to shape what this function becomes as it grows. The role sits within the UX organization and operates as a peer across Product Design, Design Systems, Content Design, and User Research and Insights, with strong collaboration across Engineering and Product Management. This is not a pure front-end engineering role, and it is not a pure UX Product Designer role. It is a craft role that requires depth on both sides of the design and engineering boundary: the eye of a strong UX Designer for visual hierarchy, interaction quality, and usability, and the hands of an engineer who writes production-grade TypeScript and React and goes deep on the UI layer rather than wide across the stack. Above all, this is an enablement role. Your success is measured partly by how much faster and better the whole UX team works, not by your personal output alone. You own results, not a step in the process. What would you do if hired? Maintain and evolve our production-ready React component library, the code expression of the Celigo design system, so that what gets designed and what users actually experience stop drifting apart. Prototype complex interactions and animation behaviors in code so the team can decide faster. You ship the smallest working version that settles the question, gather real feedback, then make it better

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. AI adoptation and regular development and use is a must. Leveraging Artificial Intelligence is part of day to day operations Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug sessions, and failure analysis activities. Work closely with internal teams across build, product engineering, and manufacturing to resolve technical challenges. Assist in yield improvement and qualification efforts tied to customer programs. Minimum Qualifications: Bachelor’s or Master

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. AI adoptation and regular development and use is a must. Leveraging Artificial Intelligence is part of day to day operations Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug s

Everpure (NYSE: P) has evolved from storage pioneer to data platform, closing fiscal 2026 with $3.7 billion in revenue, its first billion-dollar quarter, and accelerating growth into FY27. Our strategic agenda spans the companies defining the next era of technology - hyperscalers, AI labs, the AI hardware supply chain, data platform providers, and the broader AI ecosystem. This type of work—work that changes the world—is what the tech industry was founded on. So, if you're ready to seize the endless opportunities and leave your mark, come join us. THE ROLE As a Senior Hardware Design Engineer on the Datastore team, you will architect and launch our next-generation, high-performance solid-state storage solutions from concept to global mass production. Collaborating closely with cross-functional architecture, thermal, and joint development manufacturing (JDM) teams, you will pioneer high-speed hardware that directly reduces total cost of ownership (TCO) and energy consumption for our global customers. Your engineering leadership will fundamentally reshape data storage efficiency, transforming cutting-edge high-speed interfaces into reliable, market-ready enterprise products. WHAT YOU'LL DO Own End-to-End Productization: Lead SSD hardware design activities—including schematic design, component selection, and layout reviews—to successfully transition next-generation storage solutions from initial architecture through to mass production. Drive System Interoperability: Design and execute cross-platform interoperability testing across complex server/storage systems and SSDs to ensure seamless integration and industry-leading reliability. Resolve Complex System Trade-offs: Evaluate and optimize critical system-level tradeoffs across mechanical, thermal, power, and signal integrity (SI) parameters to maximize hardware efficiency. Spearhead Root Cause Analysis: Diagnose and resolve complex hardware issues and field escalations by collaborating with diagnostics engineers and e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug sessions, and failure analysis activities. Work closely with internal teams across build, product engineering, and manufacturing to resolve technical challenges. Assist in yield improvement and qualification efforts tied to customer programs. Minimum Qualifications: Bachelor’s or Master’s degree or equivalent experience in Electrical Engineering, Mechanical Engineering, Materials Science, or related technical field. Hands-on experience in one or more areas: product development, sys

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Opportunity Overview: We are seeking a Lead Software Engineer to join our Integrations team. In this role, you will be designing, developing, and scaling highly available healthcare integration systems supporting prior authorization workflows across providers, payers, and delegated entities. You'll direct a fast-paced, autonomous,agile team of software engineers in the design, development, and operational support of a growing enterprise integration platform. This is an opportunity to drive technical excellence at the intersection of healthcare interoperability and modern distributed systems. What you’ll do: Technical Leadership: Provide technical leadership across architecture, system design, platform scalability, reliability, and operational excellence. Platform Engineering: Design and build scalable, resilient, and high-performing systems that support critical business workflows and enterprise integrations. Integration Solutions: Lead the development and maintenance of secure integrations with internal and external platforms, partners, and third-party systems. Cloud & Automation: Drive cloud infrastructure, deployment automation, and software delivery practices that enable reliable and efficient releases. Distributed Systems: Design and support event-driven and distributed architectures that enable scalable and fault-tolerant processing. Operational Excellence: Establish monitoring, observability, and incident response practices to ensure system reliability, performance, and availability. Quality Engineering: Champion automated testing, quality assurance, and engineering best practices throughout the software development lifecycle. Production Support: Lead the resolution of complex production issues and drive continuous improvement in platform stability and operational efficiency. Cross-Functional Collaboration: Partner with product, operations, data, security, and business stakeholders to deliver solutions aligned with organizational goals. Agile Delive