Technology Development Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global leader in DRAM innovation, developing memory technologies that enable the next generation of computing, artificial intelligence, and data-driven applications. Within the Technology Development organization, the Process Integration team drives the development of future DRAM architectures by coordinating device, materials, and process innovations across multiple engineering fields. Team members work in a highly collaborative R&D environment to solve complex technical challenges and accelerate technology scaling. As a Process Integration Engineer Intern, you will contribute to the development of next-generation DRAM memory technologies through multi-functional collaboration involving process integration, device engineering, materials development, and process architecture. This role requires strong technical expertise, analytical problem-solving skills, and the ability to coordinate activities across multiple engineering organizations to achieve technology achievements and product objectives. Responsibilities Define technology achievements, design rules, structural requirements, and electrical specifications for next-generation DRAM technologies while supporting achievement of program targets and timelines. Collaborate with process development, simulation, process architecture, circuit design, and quality teams to ensure alignment with product and technology requirements. Develop and maintain documentation related to process integration plans, technical risks, issue resolution,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. Position Overview: As a Process Engineer on the APTD Bonding team, you will be responsible for starting up, developing, and optimizing processes to improve product quality and reliability. This entails working on process yield and productivity improvement, cost reduction, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose, and resolve assembly process-related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Responsibilities: Develop new or modified process formulations, define equipment requirements and specifications, and review processing techniques and methods Identify, diagnose, and resolve assembly process related problems Coordinate and complete process, equipment, and material evaluati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department overview The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of cutting‑edge memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Job summary As a Principal Engineer within APTD, you will play a key role in driving innovation through strategic, industry‑informed leadership. Based at the Boise campus, you will shape advanced packaging technology roadmaps and investment priorities by applying deep technical expertise alongside rigorous cost and value analysis, enabling well‑balanced trade‑off decisions across performance, scalability, and total cost of ownership. Working in a highly collaborative, dynamic environment, you will influence solutions aligned with Micron’s business objectives, contributing directly to increased revenue, long‑term strategic success, and the development of leading‑edge packaging technologies. Responsibilities Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value. Collaborate continuously with internal and external partners to ensure seamless technology integ

Job Details: Job Description: The Role and Impact As a Lab Engineer, you will play a critical role in supporting day-to-day laboratory operations while contributing to the testing and development of innovative technologies. You will be responsible for setting up, maintaining, and troubleshooting lab equipment, ensuring smooth operational workflow, and assisting with technical experiments to drive impactful results. Your contributions will directly support project delivery and quality assurance, helping shape the future of Intel's cutting-edge solutions. Business group You will be part of a dynamic and collaborative team within Intel's technology development organization, dedicated to advancing semiconductor innovation and driving industry-leading solutions. This group focuses on enabling critical lab processes, fostering innovation, and ensuring alignment with Intel's broader goals to deliver world-class products. By joining this team, you will be contributing to Intel's commitment to technological excellence and global impact. Key Responsibilities - Configure, calibrate, and maintain laboratory equipment to meet operational and safety standards. - Execute and document technical procedures such as equipment testing, sample preparation, and data collection. - Assist in the design and implementation of experiments to support project initiatives. - Maintain accurate records of lab activities, ensuring compliance with established processes and protocols. - Collaborate with cross-functional teams to troubleshoot equipment issues and enhance operational efficiency. - Uphold laboratory safety standards, identifying and mitigating potential risks. Qualifications: Minimum Qualifications - Bachelors degree in relevant field with 0-1 years of hands-on experience in domain with demonstrate

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Mask Development team within Micron’s Technology Development organization delivers reticle solutions that help enable the next generation of memory and storage products. We work at the intersection of advanced lithography, materials science, and precision manufacturing to solve complex patterning challenges. If you enjoy collaborating with technical experts, driving innovation, and making a direct impact on product quality and technology advancement, you’ll find exciting opportunities here! As a Resolution Enhancement Techniques (RET) Engineer, you will help develop and optimize RET and Optical Proximity Correction (OPC) solutions that enable high-fidelity wafer patterning for advanced memory technologies. Depending on experience and qualifications, candidates may be considered for Principal, MTS, or SMTS-level roles. This position partners closely with teams across technology development and manufacturing to improve reticle solutions, enhance tapeout methodologies, and solve critical patterning challenges that support Micron’s technology roadmap. Responsibilities: Develop and implement RET and OPC solutions to improve pattern fidelity, manufacturability, and yield Optimize lithography methodologies, software capabilities, and tapeout processes to improve performance and efficiency Analyze patterning issues, identify root causes, and drive corrective actions across R&D and manufacturing environments Lead complex mask development and lithography optimiza

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Taiwan Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM. Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung and Taoyuan that together comprise the company’s DRAM Center of Perfection. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles. Job Description The AMHS Shift Technical Engineer is responsible for maintaining and sustaining the OHT (Overhead Transport), OHS system(Overhead Shuttle), Normal Stockers, Tower Stockers, BWS (Bare Wafer Stockers), Sorters, N2 purge tools, Carriers, Carrier/Wafer Packing Tools, and ASRS. Responsibilities and Tasks 1. Work with supplier for regular AMHS maintenance (PM). 2. Work with IT and vendor as automation on duty help desk for production trouble shooting (include Micron system and AMHS system, AMHS H/W). 3. Automation project support 4. Regular report update 5. Using AI Other Requirement&#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Taiwan Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles. Job Description The F16N PEE PVD Manager is accountable for establishing and continuously improving the performance of the Section critical metrics to achieve Best-In-Class performance. This includes to achieve HVM performances in Safety, TTMCY, Maxout , CT and Cost. Your responsibilities also include establish collaboration between OMT and differnece divison and areas. As Section Leader, you will also partake in the selection, development and sustainability of a high value workforce, as well as technical and leadership development. The PVD Section Manager is also responsible for working with Technology d e ep learning , Operation efficiency and especial focus on big rock as Max Out, cost down, TTMCY and quality mindset. Responsibilities and Tasks Department Management Dri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Taiwan Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles. Job Description The F16N PEE IMP Manager is accountable for establishing and continuously improving the performance of the Section critical metrics to achieve Best-In-Class performance. This includes to achieve HVM performances in Safety, TTMCY, Maxout , CT and Cost. Your responsibilities also include establish collaboration between OMT and differnece divison and areas. As Section Leader, you will also partake in the selection, development and sustainability of a high value workforce, as well as technical and leadership development. The PEE Section Manager is also responsible for working with Technology d e ep learning , Operation efficiency and especial focus on big rock as Max Out, cost down, TTMCY and quality mindset. Responsibilities and Tasks Department Management

Job Details: Job Description: As one of the world's largest semiconductor manufacturers, Intel is committed to advancing every aspect of semiconductor technology, from process development and manufacturing to advanced packaging and reliability characterization. Employees within Intel Foundry are part of a global network spanning technology development, manufacturing, assembly, test, and quality organizations across both front-end silicon and advanced packaging facilities. You will join the Foundry Lab Network (FLN), a key organization within Foundry Quality, Reliability, and Labs (FQRL), located at Intel's growing Chandler, Arizona site. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations. FLN is actively expanding its laboratory capabilities and capacity to support Intel Foundry's roadmap, enabling faster technology qualification and accelerating development cycles through Quick Turn Monitoring (QTM) solutions that significantly reduce time-to-data. As the Stress Test and Reliability (STaR) Back-End Laboratory Manager, you will play a critical leadership role within FLN. You will partner closely with Packaging Technology Development, Quality and Reliability, and Failure Analysis teams to establish and enhance laboratory capabilities that support qualification and certification of next-generation packaging technologies and products. This position offers a unique combination of people leadership, technical problem solving, and organizational strategy. You will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operati

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Metrology Overlay Process Development Engineer you will be primarily responsible for starting up, developing, and optimizing the overlay metrology processes used for DRAM photolithography process flows. Overlay metrology is a critical need within the semiconductor industry, and in this position your responsibilities will include, but are not limited to: · Driving the understanding of new metrology technology and measurement techniques to ensure that our overlay measurement capabilities meet the precision, accuracy, and throughput required to meet our device overlay roadmaps · Partnering with metrology equipment vendors on continuous improvement of software/hardware and development of overlay techniques to support lithography process characterization, process optimization, and process control · Optimizing and maintaining the calibration of metrology systems that support our technology development · Working closely with process development and process integration engineers to optimize measurements for multiple device process flows and layer stacks · Developing applications on next generation processes and technologies within Fab 4 and qualification for tech

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The CVD Central Process and Equipment Engineering (CPEE) High Volume Manufacturing organization is seeking a highly motivated engineer to drive manufacturing excellence, equipment performance, and network-wide productivity across Micron's global semiconductor fabrication facilities. This role is responsible for developing and executing manufacturing strategies that improve equipment capability, factory output, cost competitiveness, and technology readiness while leveraging advanced analytics, digital manufacturing solutions, and AI-enabled tools to accelerate decision making and operational improvements. The successful candidate will work closely with global manufacturing teams, technology development organizations, and strategic equipment suppliers to define long-term equipment and manufacturing roadmaps, identify future capability requirements, and accelerate deployment of innovative solutions across the Micron network. This position provides a unique opportunity to influence manufacturing strategy, shape supplier development priorities, and drive competitive advantage through advanced equipment and manufacturing solutions. Strategic Manufacturing & Supplier Leadership Develop and drive long-term manufacturing and equipment capability roadmaps to support future technology requirements, capacity expansion, and factory competitiveness. Partner with strategic equipment suppliers to define and influence next-generation hardware, software, automation, and process capab

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. By collaborating closely with our global R&D teams, materials suppliers, and manufacturing teams, we ensure the efficient development, transfer, and implementation of new technology nodes to maintain Micron's leadership in the industry. As a Principal Wet Process Engineer, you will be primarily responsible for developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management. You will also be required to resolve assembly process-related problems by applying failure analysis, FMEA, 8D, or SPC/FDC methodology. Additional responsibilities include leading and participating in yield improvement and cost reduction activities and handling new process baseline qualifications. You may conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes. We are seeking experienced engineers for Principal and MTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications. Role Responsibilities: Identify, diagnose, and resolve assembly p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The 3D DRAM Technology Development organization is responsible for advancing next-generation memory technologies that enable future computing innovations. Engineers within this team work in a brand new 300mm R&D facility, collaborating across process development, characterization, reliability, design, and simulation fields to drive memory scaling and manufacturability. As a 3D DRAM Process Integration Engineer Intern, you will support the development of next-generation DRAM technologies with a focus on device performance, reliability, and manufacturability. This role involves working on advanced memory structures, including charge storage devices and thin-film transistors, while partnering with multi-functional engineering teams to solve challenging integration and circuit-related issues. The ideal candidate will have a strong foundation in semiconductor device fabrication, materials science, and device physics, combined with data-driven problem-solving skills and a passion for technology innovation. Responsibilities Contribute to the development of next-generation DRAM technologies, including advanced memory device components such as charge storage structures and thin-film transistors. Design, complete, and analyze experiments within the R&D fabrication environment to support technology development objectives. Collaborate with process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where breakthrough patterning technologies become manufacturing-ready solutions. Our team is shaping the future of memory by evaluating and enabling next-generation lithography technologies, including EUV and High NA EUV. We work closely with technology development, manufacturing, equipment suppliers, and industry partners to drive innovation and deliver scalable solutions for future memory products. As a Lithography Pathfinding Process Development Engineer, you will help define how advanced patterning technologies support Micron’s long-term roadmap. You will lead pathfinding activities, evaluate emerging lithography solutions, and develop implementation strategies that influence future technology decisions. This role is part of Micron’s Technical Leadership Program (TLP), offering the opportunity to grow as a technical leader, mentor others, and drive industry-changing innovation. Responsibilities: Define and lead pathfinding activities for advanced patterning technologies, including EUV and High NA EUV, and identify roadmap applications where they provide value Develop and optimize EUV lithography modules within Technology Development, partnering with process integration and adjacent process teams to meet manufacturing requirements Collaborate with defect inspection teams and mask suppliers to establish inspection and quality strategies for EUV masks Partner with manufacturing sites to align equipment, materials, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products! We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions! In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will own physical implementation and top-level integration of large digital designs in our NAND products. Drive blocks and full-chip partitions through synthesis handoff, floorplan, place-and-route, and timing/DRC/LVS closure. Perform hierarchical design planning and top-level assembly. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Leading all aspects of and managing the layout process including floor-planning, placement, and routing