3d Animator in United States

Product Design Engineer - HPIQ Description - About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering analysis and test results to guide design decisions Evaluate materials, manufacturing processes, and design tradeoffs to develop robust and scalable solutions Work cross-functionally with hardware, software, industrial design, and other engineering teams to bring concepts from ideation through development Conceptualize, design, and build prototypes that quickly validate ideas Participate in design reviews, clearly communicating design decisions, technical analysis, and tradeoffs to both technical and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Sr Design Engineer, you will work on design, simulation, and validation of next ‑ generation High ‑ Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co ‑ optimization with GPUs/accelerators. This role sits at the intersection of DRAM design and high ‑ performance computing, enabling future AI/ML, HPC, and advanced graphics products. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

What if the work you did every day could impact the lives of people you know? Or all of humanity? At Illumina, we are expanding access to genomic technology to realize health equity for billions of people around the world. Our efforts enable life-changing discoveries that are transforming human health through the early detection and diagnosis of diseases and new treatment options for patients. Working at Illumina means being part of something bigger than yourself. Every person, in every role, has the opportunity to make a difference. Surrounded by extraordinary people, inspiring leaders, and world changing projects, you will do more and become more than you ever thought possible. We are seeking a Senior Mechanical Engineer to support new product development in genomics instrumentation. This is a highly technical mechanical design role focused on the development of custom mechanisms, precision motion systems, and electromechanical assemblies used in advanced instrumentation. The ideal candidate will be an engineer with experience designing motorized mechanisms and precision motion systems, including a strong understanding of system requirements, motion architecture, controls integration, structural design, and performance validation. The ideal candidate also has experience developing motion solutions from requirements through implementation and understands the engineering principles behind achieving precise, reliable motion in complex systems. Responsibilities Design and develop custom mechanical mechanisms for use in genomics instruments, including motion systems, precision assemblies, and fluidic or sample‑handling components. Integrate mechanical designs with electrical, firmware, and control systems Create and maintain 3D CAD models, engineering drawings, and support

Air Proprietary Tooling Engineer (Entry-Level or Associate) Company: The Boeing Company The Boeing Defense, Space & Security (BDS) team is seeking motivated Tooling Engineers located in Berkeley, MO . This role will support design, development, installation, and sustainment of production tooling and assembly aids used across manufacturing and maintenance programs. The role partners with manufacturing, quality, suppliers, and design engineering to deliver safe, compliant, and cost-effective tooling solutions that enable efficient production. At The Boeing Company, our mission is to connect, protect, and explore our world and beyond. Position Responsibilities Develop and qualify production tooling, jigs, fixtures, and assembly aids from concept through production release Translate manufacturing and design requirements into tooling specifications, drawings, 3D CAD models, and bill of materials Perform tolerance stack-up, fit checks, and tooling validation through analysis, prototyping, and hands-on trials Support tooling fabrication and inspection, including supplier management, fabrication oversight, and acceptance criteria verification Lead root-cause analyses for tooling-related manufacturing issues and implement corrective actions and continuous improvement Create and maintain tooling documentation: process plans, safety assessments, work instructions, inspection plans, and change records Collaborate with multidisciplinary teams—manufacturing, quality, stress, systems, and supply chain—to ensure tooling meets program schedule, safety, and quality goals Ensure compliance with company and regulatory standards, maintain configuration control and toolin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. Job Purpose The Mechanical Engineer is responsible for end-to-end hardware ownership of components and sub-systems for the KARNO generator, taking designs from CAD through prototype, test, and validation. Working across mechanical, electrical, software, and performance teams, this role designs and troubleshoots complex thermal and mechanical systems that must perform reliably across extreme operating environments and a wide range of fuels. The position exists to advance the development of Hyliion's fuel-agnostic power generation technology through hands-on, test-driven engineering and disciplined design execution. Duties and Responsibilities Own hardware components and sub-systems end-to-end—from concept through durability, manufacturability, serviceability, cost, weight, and validation—taking designs from CAD to hardware running on a test stand. Design components and sub-systems that must survive extreme thermal environments, perform across a wide range of fuels (20+), and push the boundaries of metal additive manufacturing. Create 3D models in NX and generate 2D prints with full GD&T per ASME Y14.5. Perform design checking and print review to ensure tolerances, processes, and material specifications align with Hyliion's GD&T standards (ASME Y14.5). Conduct fluid and thermal systems design and optimization. Perform structural and thermal FEA (ANSYS or equivalent). Install, calibrate, and read instrumentation for pressure, temperature, flow, strain, and acceleration in lab environments. Execute prototype build, test, and validation cycles early and often to identify and resolve issues in the lab rather than the field. Collaborate cross-functionally

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

About the Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a PCB Layout Engineer to design high-density electronics for next-generation robotic systems. You will own PCB layout from floor planning through fabrication release, working closely with electrical, SI/PI, mechanical, and manufacturing teams. This role is based in San Francisco and requires in-person presence four days per week. In this role, you will: Own PCB layout, component placement, routing, and fabrication release for complex robotic systems. Collaborate with SI/PI engineers to refine layouts based on simulation results. Implement high-speed routing, controlled impedance, power distribution, decoupling, grounding, EMI/EMC, thermal, and mechanical-integration requirements. Work directly with fabricators and assembly partners to define stack-ups, establish design rules, drive DFM/DFA/DFT reviews, and close findings before release. Prepare fabrication and assembly documentation, including drawings, ODB++, drill files, stack-up tables, and manufacturing notes. Inspect newly received PCBAs and participate in board-level manufacturing failure analysis. Contribute to reusable design constraints and layout workflows, and maintain component-library assets such as symbols, footprints, and 3D models. You might thrive in this role if you: Have 6+ years of experience designing complex, multilayer PCBs. Are fluent in Cadence Allegro PCB Designer and Constraint Manager. Have strong HDI design experience, including fine-pitch BGAs, microvias, blind and buried vias, via-in-pad, and sequential lamination.

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which the GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As a Developer Technology Engineer you will be at the forefront of innovation, working with leading industry partners and exciting OSS projects to accelerate RTX & DGX SoC performance for agentic use. This role offers an outstanding opportunity to collaborate with world-class talent and make a significant contribution to the next era of enterprise and consumer AI. What you'll be doing: Own key engagements with our fast-paced developer ecosystem partners, optimizing their applications to deliver outstanding end-to-end performance on RTX and DGX SoCs. Take ownership of performance optimization for compute-intensive CPU, AI, and 3D graphics workloads, working with domain experts to identify bottlenecks and implement effective solutions. Work across system software, GPU driver, architecture, and NVIDIA Research teams to influence next-generation, high-performance SoC platforms by bringing real-world workflows and actionable insights from partner and customer needs. Provide technical guidance and mentorship to junior engineers while contributing to an inclusive and high-performing team environment. What we need to see: BS or MS degree in Computer Science, Engineering, Mathematics or related degree (or equivalent experience) 5+ years of respective work experience as software developer Proficiency in C/C++, Python, software

We're looking for a Senior Mechanical Engineer for Midjourney Medical — from precision electromechanical assemblies up to the large-scale structures and mechanisms that hold everything together and make it move. This role spans the full range of scale: one week you might be refining a compact transducer mount, the next you're architecting a structural frame or designing the motion system that positions hardware within it. This is a hands-on role on a small cross-functional team. You'll take problems from whiteboard sketch to working hardware yourself — designing in CAD, prototyping in the shop, testing, iterating, and integrating with research teams, electrical and software engineers along the way. We move fast and expect you to drive your own work: identifying what needs to happen next, making sound engineering calls without waiting for permission, and shipping hardware that works. What you'll do Own parts of the mechanical systems end to end — structures, mechanisms, and electromechanical integration Design large-scale structures: frames, weldments, enclosures, and support systems, with attention to stiffness, weight, manufacturability, and serviceability Design mechanisms: linkages, motion stages, actuation systems for precise, reliable positioning and articulation Integrate transducers, electronics, cabling, and thermal management into large physical systems Perform engineering analysis (tolerance stack-ups, structural/FEA, mechanism kinematics) to de-risk designs before committing to hardware Build and test relentlessly — 3D printing, rapid prototyping, and hands-on fabrication are core to how you'll validate designs Select parts and materials for system-level integration, balancing performance, cost, and lead time Drive projects independently from concept through validation, and collaborate closely with a small cross-disciplinary team to hit project goals What we're looking for Bachelor's degree in Mechanical Engineering or a related field 5+ years of experien

The mission of The New York Times is to seek the truth and help people understand the world. That means independent journalism is at the heart of all we do as a company. It’s why we have a world-renowned newsroom that sends journalists to report on the ground from nearly 160 countries. It’s why we focus deeply on how our readers will experience our journalism, from print to audio to a world-class digital and app destination. And it’s why our business strategy centers on making journalism so good that it’s worth paying for. The New York Times Graphics team is looking for a reporter with extensive open-source and investigative reporting skills to turn raw evidence into impactful visual stories. You have a track record for uncovering exclusive information off the news. The Graphics team is a leader in using spatial and visual techniques on investigative stories, and we're looking for someone who is passionate about accountability journalism using cutting-edge reporting techniques. Below are a few examples of the kinds of stories that you will be a part of: An exclusive look at the failed columns of the Midtown Manhattan near-collapse A 3-D analysis of why firefighters' lines of sight were limited in the deadly LaGuardia Crash An investigation into the mass graves in Syria An investigation into the causes of a Miami building collapse A spatial investigation into a deadly fire in the Bronx A forensic analysis of an apartment building collapse in the Turkey earthquake Working with journalists on the Graphics team and across the newsroom, you will play an important role in shaping visual reconstructions and investigations that rely on spatial analysis or use 3-D modeling. You will gather and analyze evidence for stories across a wide range of topics for both quick-turn stories as well as longer-term enterprise. You will be expected to take the initiative in leading major storylines, with the goal of uncovering new or exclusive findings across multiple visual story fo

ABOUT BASETEN Baseten powers mission-critical inference for the world's most dynamic AI companies, like Cursor, Notion, OpenEvidence, Abridge, Clay, Gamma and Writer. By uniting applied AI research, flexible infrastructure, and seamless developer tooling, we enable companies operating at the frontier of AI to bring cutting-edge models into production. We're growing quickly and recently raised our $1.5B Series F , led by Altimeter Capital, Conviction Partners, and Spark Capital. Join us and help build the platform engineers turn to to ship AI products. THE ROLE We are seeking a Sales Manager to help lead a team of Account Executives within our Startups segment. This hire will be responsible for building and coaching a team of high-performing sales reps, driving revenue growth, and partnering closely with product and engineering to bring our cutting-edge AI infrastructure to customers. RESPONSIBILITIES Lead and mentor a team of Startups Account Executives to consistently exceed pipeline and revenue goals. Help define and execution on go-to-market strategy for our fastest growing customer segment. Hire and scale the team by recruiting, interviewing, and onboarding top talent Collaborate cross-functionally with Marketing, Product, and Engineering to align customer needs with Baseten’s product roadmap. Be deeply engaged with the product, enabling reps to have highly technical conversations with prospects and customers. Foster a culture of accountability, learning, and collaboration within the sales team. REQUIREMENTS 4+ years of closing sales experience, with 2+ years in management leading high-performing teams. Strong technical acumen, ideally with background in AI infrastructure, cloud infrastructure, or developer platforms. Comfortable operating in the weeds with technical products and guiding reps through complex deals. Proven track record of success in high velocity sales environments. Based in San Francisco or New York City and open to coming in office at least 3 d