Jobs in United States

Assembler in United States

135 active opportunities · Updated October 2026

Explore current assembler jobs across United States. Filter by work mode, employment type, experience, department, date posted and distance.

H
📍 California, United States of America, United States
✓ Quality checkedCompany trend +103.7%

$107.4K – $155.7K/yr

Product Design Engineer - HPIQ Description - About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering analysis and test results to guide design decisions Evaluate materials, manufacturing processes, and design tradeoffs to develop robust and scalable solutions Work cross-functionally with hardware, software, industrial design, and other engineering teams to bring concepts from ideation through development Conceptualize, design, and build prototypes that quickly validate ideas Participate in design reviews, clearly communicating design decisions, technical analysis, and tradeoffs to both technical and

I
📍 Arizona, Phoenix, United States
✓ Quality checkedCompany trend +315.4%

Job Details: Job Description: As one of the world's largest semiconductor manufacturers, Intel is committed to advancing every aspect of semiconductor technology, from process development and manufacturing to advanced packaging and reliability characterization. Employees within Intel Foundry are part of a global network spanning technology development, manufacturing, assembly, test, and quality organizations across both front-end silicon and advanced packaging facilities. You will join the Foundry Lab Network (FLN), a key organization within Foundry Quality, Reliability, and Labs (FQRL), located at Intel's growing Chandler, Arizona site. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations. FLN is actively expanding its laboratory capabilities and capacity to support Intel Foundry's roadmap, enabling faster technology qualification and accelerating development cycles through Quick Turn Monitoring (QTM) solutions that significantly reduce time-to-data. As the Stress Test and Reliability (STaR) Back-End Laboratory Manager, you will play a critical leadership role within FLN. You will partner closely with Packaging Technology Development, Quality and Reliability, and Failure Analysis teams to establish and enhance laboratory capabilities that support qualification and certification of next-generation packaging technologies and products. This position offers a unique combination of people leadership, technical problem solving, and organizational strategy. You will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operati

SQLAuditingRecruitment
I
📍 Oregon, Hillsboro, United States
✓ Quality checkedCompany trend +315.4%

Job Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. What we do: Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy to exceed the aspirations of our global customers. We are seeking a visionary Principal Engineer to lead the charge in Intel's foundry revolution, serving as a strategic technical architect and executive partner in guiding our most critical customers through the entire product development lifecycle. In this leadership capacity, you will orchestrate multidisciplinary strategies spanning device engineering, product integration, and yield analysis to steer customers from critical design tape-out and pre-silicon evaluation through to NPI silicon qualification. Furthermore, you will define t

AIAuditingSupply ChainRecruitment
O
📍 San Francisco, California, United States· Full-time
✓ Quality checkedCompany trend -80.2%

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a Product Manufacturing Engineer to drive manufacturing strategy and execution for next-generation AI hardware within the Silicon & Systems team, with a particular focus on PCBA manufacturing, assembly, process development, and production readiness. You will work closely with design engineering, systems engineering, operations, TPMs, contract manufacturers, suppliers, and other external partners to ensure new hardware products successfully transition from concept and prototype builds through NPI and high-volume production. You’ll own critical manufacturing initiatives, identify and resolve production risks, and help establish the processes and controls required to deliver complex hardware at scale. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Drive manufacturing and quality initiatives to ensure product success from concept and early development through NPI, production launch, and scale. Lead manufacturing process development for next-generation AI hardware systems, partnering closely with design engineering, systems engineering, operations, TPMs, suppliers, and manufacturing partners. Own PCBA manufacturing development and production readiness, including assembly processes, process validation, manufacturing test, rework, yield improvement, and successful transition into volume production. Establish NPI manufact

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M
📍 San Francisco, California, United States· Full-time
✓ Quality checkedCompany trend -100%

What you’ll do Act as the in-house electrical lead for Midjourney Medical: own the electrical architecture of the scanner and the technical direction for all board-level design. Own complex board design end-to-end: architecture, schematic capture, layout (high-speed digital, analog/mixed-signal, power), DFM/DFT, fabrication and assembly vendor management, bring-up, and revision control. Write firmware for embedded targets (MCU/SoC): drivers, real-time control loops, safety-relevant logic, bootloaders, and field update paths. Audit and update HDL (FPGA) code for high-throughput data acquisition, timing/synchronization, triggering, and pre-processing of ultrasound and sensor data streams. Define electrical interfaces and data contracts with software, recon/ML and mechanical teams: timing budgets, clocking/sync, signal integrity, connectors/harnessing, and failure modes. Establish electrical engineering rigor: design reviews, schematic/layout review checklists, bring-up procedures, test fixtures, and documentation suitable for a regulated medical device program (DHF, traceability, change control). Mentor and grow the electrical function; select and manage external design partners where leverage is high. What we’re looking for Deep experience designing complex boards from blank page to stable revision, including high-speed digital and analog/mixed-signal domains. Strong schematic and layout skills (Altium/KiCad or equivalent) with real signal integrity, power integrity, grounding, and EMI/EMC instincts. Solid embedded firmware background in C/C++ (and Python for tooling): peripherals, DMA, interrupts, real-time constraints, and debugging on hardware. Practical HDL experience (VHDL/Verilog/SystemVerilog) for data acquisition, timing, and streaming interfaces. Track record of owning bring-up and debug on real hardware: scopes, logic analyzers, and disciplined root-cause analysis. Technical leadership: clear trade-offs, strong written documentation, and the ability to set

PythonGitAIC++
O
📍 San Francisco, California, United States· Full-time
✓ Quality checkedCompany trend -80.2%

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking an Actuator Gear Design Engineer to lead the development of custom gears and gear stages for advanced robotic systems. You will own actuator development from early architecture and concept generation through prototype validation and system integration, partnering closely with mechanical, electrical, controls, firmware, and reliability teams. You will partner with external suppliers and internal manufacturing to create full gearbox assemblies. This role focuses on the design, integration, and validation of precision gearing, including broader knowledge around motor electromagnetics, transmission types, sensing, structural components, and thermal architectures. You will help drive actuator development across the full engineering lifecycle while establishing scalable design, test, and integration practices for future robotic platforms. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will: Lead the architecture, design, and integration of custom robotic actuator gearing. Define actuator requirements and system-level trade studies around torque density, bandwidth, efficiency, thermal performance, back drivability, inertia, reliability, manufacturability, and cost. Design precision electromechanical assemblies with strong attention to tolerances, alignment, load paths, thermal expansion, sealing, wear, and serviceability. Drive actuator integration into robotic systems, partnering closely with controls, firmware, electrical, and robotics software teams to optimize closed-lo

AWSRestAIGo
O
📍 San Francisco, California, United States· Full-time
✓ Quality checkedCompany trend -80.2%

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

RedisAWSRestAI
O
📍 San Francisco, California, United States· Full-time
✓ Quality checkedCompany trend -80.2%

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m

AWSRestAIRust
O
📍 San Francisco, California, United States· Full-time
✓ Quality checkedCompany trend -80.2%

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a Mechanical Engineer to lead the engineering, characterization, and productionization of flexible and compliant components in robotic platforms. You will partner closely with cross-functional teams to translate material concepts into engineered subsystems that meet functional, durability, and manufacturing requirements. This role focuses on understanding how soft materials behave in dynamic mechanical systems — including fatigue, creep, hysteresis, wear, and environmental degradation — and designing assemblies that perform consistently at scale. You will work with materials such as elastomers, foams, thermoplastic polyurethanes (TPUs), engineered fabrics, knitted and woven textiles, cables, and other flexible load-bearing or transmission elements, integrating them with rigid hardware, sensors, and actuators using fabrication methods such as bonding, molding, lamination, and sewn assemblies. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will Design and integrate compliant or flexible materials into mechanical subsystems and rigid hardware interfaces. Leverage FEA tools to characterize material behavior under operational loads, including tension, compression, abrasion, fatigue, and environmental exposure. Develop test methods and validation protocols to evaluate durability, performance, and failure modes of soft components. Collaborate with cross-functional teams to transition early prototypes into manufacturable designs. Source and evaluate materials in collaboratio

AWSRestAIGo
C
📍 Fredericksburg, United States
✓ High-confidence listingCompany trend +340.2%
Quick readStrong listing-quality and freshness signals

We’re building a world of health around every individual — shaping a more connected, convenient and compassionate health experience. At CVS Health®, you’ll be surrounded by passionate colleagues who care deeply, innovate with purpose, hold ourselves accountable and prioritize safety and quality in everything we do. Join us and be part of something bigger – helping to simplify health care one person, one family and one community at a time. Job Purpose and Summary: The OTCHS colleague will perform a variety of assigned work tasks. You will pick pieces of merchandise into a tote or box for customer orders. You will be responsible maintaining high levels of accuracy and performance to meet the needs to our customers while utilizing safe work practices. You may work in other areas or functions of the warehouse and cross trained in OTCHS functions, as needed. Primary Job Duties & Responsibilities: 1. Pick Customer Orders - 40% Read customer orders by the appropriate pick method for your DC, which will include, the item locations, descriptions, and quality needed. Select the needed pieces of merchandise and place in the box for the customer. Pack items into box and seal. Move boxes or totes of merchandise (up to 30-50 pounds regularly) utilizing safe lifting technique On occasion, will also perform Box making assembling cardboard boxes to ship items to customers. 2

B
📍 Oklahoma City, OK, United States
✓ High-confidence listingCompany trend +515.8%
Quick readStrong listing-quality and freshness signals

Wire Harness Installation Engineer (Associate, Experienced, or Lead) Company: The Boeing Company Boeing Defense, Space, & Security (BDS) is looking for a Wire Harness Installation Engineer (Associate, Experienced, or Lead) to join our team in Oklahoma City, OK . This position will provide engineering support across the Boeing portfolio of products, to include – but not limited to – Boeing Military Aircraft and Military Derivative Aircraft (AEW&C, AWACS, C-32/C-40, E-4B, VC-25A, KC-767, B-1B, B-2, B-52 and others). Our teams are currently hiring for a broad range of experience levels including Associate, Experienced, or Lead Level Engineers. Position Responsibilities Associate (Level 2) Develops and maintains wire harness installation engineering drawings Supports analysis and design reviews Develops and maintains electrical product detail, assembly and installation designs (e.g., equipment racks, power panels, cable routing and geometry, antennas) Provides engineering design disposition on discrepancies (e.g., rejection tags, production action requests, shop revision requests) Follows documented processes, specifications and procedures that support the design and manufacture of electrical commodities Supports the development of statements of work. Assists in the technical review of supplier capabilities to facilitate source selection Analyzes functional and physical input used in the development of integrated design and system architecture. Works under general supervision.</spa

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B
📍 Oklahoma City, OK, United States
✓ High-confidence listingCompany trend +515.8%
Quick readStrong listing-quality and freshness signals

Wire Harness Design Engineer (Associate, Experienced or Lead) Company: The Boeing Company Boeing Defense, Space, & Security (BDS) is looking for a Wire Harness Design Engineer (Associate, Experienced or Lead) to join our team in Oklahoma City, OK . This position will provide engineering support across the Boeing portfolio of products, to include – but not limited to – Boeing Military Aircraft and Military Derivative Aircraft (AEW&C, AWACS, C-32/C-40, E-4B, VC-25A, KC-767, B-1B, B-2, B-52 and others). Our teams are currently hiring for a broad range of experience levels including Associate, Experienced, or Lead level Engineers. Associate (Level 2) Develops and maintains cable/wire harness detail and assembly design Supports analysis and design reviews Develops and maintains electrical product detail, assembly and installation designs (e.g., equipment racks, power panels, cable routing and geometry, antennas) Provides engineering design disposition on discrepancies (e.g., rejection tags, production action requests, shop revision requests) Follows documented processes, specifications and procedures that support the design and manufacture of electrical commodities Supports the development of statements of work. Assists in the technical review of supplier capabilities to facilitate source selection Analyzes functional and physical input used in the development of integrated design and system architecture. Works under general supervision. Experienced (Level 3) <

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B
📍 Huntsville, United States
✓ High-confidence listingCompany trend +515.8%
Quick readStrong listing-quality and freshness signals

Chief Engineer - Patriot Advanced Capability (PAC-3) Company: The Boeing Company Boeing Defense, Space & Security (BDS) is searching for an inspiring and visionary Chief Engineer to lead groundbreaking engineering transformation for the PAC-3 Acceleration Efforts in Huntsville, AL . This pivotal role offers a unique opportunity to be at the forefront of accelerating production rates by driving innovative design for manufacturability and testability, optimizing production systems, and pioneering advanced engineering solutions that empower high-rate manufacturing success. As production demands soar, you will be the catalyst transforming engineering processes and production capabilities—ensuring we not only meet ambitious acceleration targets but also uphold Boeing’s renowned standards of quality and technical excellence. The Chief Engineer will serve as a strategic technical leader, spearheading engineering changes essential to unlocking higher production rates. You will collaborate seamlessly with engineering, manufacturing, quality, supply chain, and production teams to enhance product designs and processes geared toward efficiency, scalability, and continuous improvement. Position Responsibilities: Lead and champion engineering transformation initiatives to significantly accelerate PAC-3 production rates Drive and embed design for manufacturability (DFM), design for testability (DFT), and design for assembly (DFA) practices that enable smooth, high-rate production Partner closely with manufacturing and production teams to innovate and implement enhancements in production systems, tooling,

Supply ChainRecruitment
B
📍 Skaneateles, NY, United States
✓ High-confidence listingCompany trend +350%
Quick readStrong listing-quality and freshness signals

This is where your work makes a difference. At Baxter, we believe every person—regardless of who they are or where they are from—deserves a chance to live a healthy life. It was our founding belief in 1931 and continues to be our guiding principle. We are redefining healthcare delivery to make a greater impact today, tomorrow, and beyond. Our Baxter colleagues are united by our Mission to Save and Sustain Lives. Together, our community is driven by a culture of courage, trust, and collaboration. Every individual is empowered to take ownership and make a meaningful impact. We strive for efficient and effective operations, and we hold each other accountable for delivering exceptional results. Here, you will find more than just a job—you will find purpose and pride. Associate, Packaging Your Role at Baxter This is where your work helps create life-sustaining products. As a Packaging Associate at Baxter, you will support the production of high-quality medical devices by performing packaging and final assembly activities for our Blood Pressure Cuffs product line. In this role, you will help ensure products are packaged accurately, safely, and in compliance with quality and regulatory standards before reaching our customers. Working as part of a collaborative manufacturing team, you will contribute to efficient production operations, maintain inventory and material flow, support continuous improvement initiatives, and help uphold Baxter's commitment to quality, safety, and patient care. What You'll Be Doing Package cuffs and other finished products coming from the production line according to established work instructions. Package, label, and prepare component parts and assemblies for shipment while ensuring product protection and completeness. <l

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B
📍 Round Lake, Illinois, United States
✓ High-confidence listingCompany trend +350%
Quick readStrong listing-quality and freshness signals

This is where your work makes a difference. At Baxter, we believe every person—regardless of who they are or where they are from—deserves a chance to live a healthy life. It was our founding belief in 1931 and continues to be our guiding principle. We are redefining healthcare delivery to make a greater impact today, tomorrow, and beyond. Our Baxter colleagues are united by our Mission to Save and Sustain Lives. Together, our community is driven by a culture of courage, trust, and collaboration. Every individual is empowered to take ownership and make a meaningful impact. We strive for efficient and effective operations, and we hold each other accountable for delivering exceptional results. Here, you will find more than just a job—you will find purpose and pride. Your role at Baxter: This position performs downstream activities that are required to successfully complete a production. This involves initiation of paperwork not generated by the documentation center, verification of components per the appropriate Bill of Materials, set-up, challenge & verification of label dispensers, verification of weighing/measuring devices for current calibration status, and set-up and verification of batch board and seal integrity stations. Some areas require assembling equipment including the operation of blending, grinding, and some molding. What you'll be doing: Monitor product exposure times and document process flow as required Periodically performs all Operator I/Operator II functions Pull required processing samples, document, package and distribute Set-up/Tear down room and keep production area supplies up to date Perform all line clearances Replace labels on dispensers, take appropriate samples and verify as well as troubleshoot any label dispenser prob

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