Design Engineer in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where innovation meets excellence. We are advancing memory and storage technologies through collaborative engineering and creative problem-solving. Our team works at the forefront of semiconductor design, developing solutions that shape the future of memory products in a fast-paced, learning-focused environment. As a Design Verification Engineer, you will help develop next-generation memory technologies by verifying and optimizing digital and analog circuit designs. In this role, you will work closely with global multi-functional teams across the product lifecycle to deliver high-quality, manufacturable memory solutions that meet performance, reliability, cost, and customer requirements. Your work will directly contribute to bringing advanced memory products from concept to production. Responsibilities: Verify circuit functionality, reliability, power, and compliance with product specifications Drive verification planning, coverage closure, circuit debug, and design improvements Perform circuit modeling and simulation using industry-standard tools Support silicon validation, reticle experiments, and tape-out activities Partner with engineering, manufacturing, and product teams to deliver manufacturable designs Minimum Qualifications: Bachelor’s degree in Electrical Engineering or a related field 4+ years of semiconductor design, verifi

Wire Harness Design Engineer (Associate, Experienced or Lead) Company: The Boeing Company Boeing Defense, Space, & Security (BDS) is looking for a Wire Harness Design Engineer (Associate, Experienced or Lead) to join our team in Oklahoma City, OK . This position will provide engineering support across the Boeing portfolio of products, to include – but not limited to – Boeing Military Aircraft and Military Derivative Aircraft (AEW&C, AWACS, C-32/C-40, E-4B, VC-25A, KC-767, B-1B, B-2, B-52 and others). Our teams are currently hiring for a broad range of experience levels including Associate, Experienced, or Lead level Engineers. Associate (Level 2) Develops and maintains cable/wire harness detail and assembly design Supports analysis and design reviews Develops and maintains electrical product detail, assembly and installation designs (e.g., equipment racks, power panels, cable routing and geometry, antennas) Provides engineering design disposition on discrepancies (e.g., rejection tags, production action requests, shop revision requests) Follows documented processes, specifications and procedures that support the design and manufacture of electrical commodities Supports the development of statements of work. Assists in the technical review of supplier capabilities to facilitate source selection Analyzes functional and physical input used in the development of integrated design and system architecture. Works under general supervision. Experienced (Level 3) <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Electronic & Electrical System Design Engineer (Associate or Mid-Level) Company: The Boeing Company The Boeing Test and Evaluation (BT&E) organization is seeking an Electronic & Electrical System Design Engineer for the B-1 Bomber Avionics Integrated Support Facility (AISF) at Tinker Air Force Base, OK . The AISF Laboratory Operations Team is responsible for maintaining, configuring, and upgrading avionics hardware and special test equipment used to support development and testing of operational flight software. Other areas of responsibility include engineering and hardware sustainment that extends to multiple air force bases and labs across the United States. The AISF lab team plays a key role supporting the B-1 platform requirements in areas of avionics and weapons integration, by making changes in the lab first to ensure the software and hardware design are ready prior to ground and flight test. This engineering position is part of a small highly collaborative design team working multiple lab changes to satisfy customer requirements and ultimately the airmen who use the weapon system. This position is part of the Laboratory Operations team, comprising engineers, technicians, and cybersecurity professionals. BT&E is currently hiring for a broad range of experience levels including Associate or Mid-Level Electronic & Electrical System Design Engineers. Travel: This position will require occasional domestic travel up to 10% to support program objectives. Position Responsibilities: Design lab changes for new test articles and integration that support platform upgrades Design lab changes to existing systems to reso

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

Experienced or Senior Digital Design Engineer Company: The Boeing Company Boeing Defense, Space & Security (BDS) seeks a Digital Design Engineer to join our team in Huntsville, AL and play a vital role in the Patriot Advanced Capability-3 (PAC-3) program, one of the world's most advanced air and missile defense systems. This is your opportunity to work in a dynamic environment where your skills will directly contribute to protecting critical assets and ensuring mission success. If you are passionate about defense technology and want to make a real impact, we want to hear from you! Position Responsibilities: Design high speed digital circuits and perform signal integrity analysis Focus on electronic systems and electrical design, simulation and verification/validation testing of high-speed printed circuit boards (PCB) throughout full product development cycle Providing design guidelines and support for system architecture design, board layout, product bring-up, debug, validation, and factory builds This position requires obtaining a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim U.S. secret clearance Pre Start and final U.S. secret clearance Post Start is required. Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement 3 or more years of related work experience Experience in digital circuit design Preferred Qualificatio

Early Career Mechanical Design Engineer Company: The Boeing Company Boeing Test & Evaluation (BT&E) is looking for an Early Career Mechanical Design Engineer to support the Environmental Test Design Engineering team in Berkeley, MO. The primary focus of this position is to support St. Louis Environmental Lab testing for local Boeing Defense & Space (BDS) programs. The design team works in partnership with the lab test teams to provide the designs and hardware needed to complete testing. Test capabilities within the Environmental labs include vibrational/structural dynamics, acoustic, airflow systems, fuel flow systems, high temperature flow impingement, and environmental control chambers, where temperature, humidity, and pressure are varied. Mechanical Design Engineers on the team design and modify test articles, fixtures, and support structures that integrate with our lab facilities. Design work ranges from adapters and fixtures to full test rigs and complete aircraft subsystems with their support structures. Responsibilities include designing interfaces to facility infrastructure such as supplied pressure, heating/cooling, power, hydraulics, and a full suite of instrumentation. Design Engineers support fabrication, installation, connection, and acceptance/check-out to deliver test-ready hardware. Boeing St. Louis is building the future ‒ creating innovative solutions that will define the next generation of aerospace. As part of this team, you will have the opportunity to work on the latest military aircraft and weapons programs such as T-7A, F-15, F/A-18, MQ-25, JDAM, SDB, in addition to Phantom Works proprietary efforts. Position Responsibilities: Develop mechanical design criteria from

The SCG Architecture team is hiring a Senior Power Integrity Co-Design Engineer to architect and deliver di/dt mitigation across silicon, package, board, and platform. This role bridges architecture, silicon, and platform — translating product noise targets into shipped specifications, and feeding silicon findings back into the next generation's build. Success in this role requires strong systems thinking and a willingness to accept ambiguity. It also requires the ability to apply AI as a force multiplier while maintaining rigorous engineering judgment. What you'll be doing: Architect voltage-noise mitigation across the full stack — silicon, package, board, platform — and own the codesign trade-offs between them. Co-design noise features with Speed, Power, Reliability, Circuit Design , Power-Arch, ASIC, and platform teams. You're the connective tissue across the codesign web. Work with other team members to define product-level voltage noise targets, drive them to closure, and sign them off at shipment. Build and take ownership of the Sim-to-Si correlation methodology for noise. You know when a model is lying and when silicon is. Model and prototype next-gen noise features — transient sense, droop response, mitigation IP, and codify them so every future program inherits them. Lead show-stopper noise bugs during bringup. The critical issues stop with you. Drive architecture-level codesign tradeoffs across V/F Power Noise Reliability Thermal (Noise-Variation) and (Noise-to-Closure) boundary work, where the highest-leverage innovation lives. What we need to see: BS / MS / PhD in EE, CE, or related (or equivalent experience). 5&#43; years in silicon power integrity, voltage noise, or PDN. Deep expertise in at least one of

Are you ready to contribute to world-class innovation and push the boundaries of what's possible? At NVIDIA, you'll have the opportunity to be part of a team that is driving groundbreaking impacts across various markets. As a Thermal Solutions Development Engineer, you will play a pivotal role in our Silicon Codesign Group, transforming thermal solution concepts into lab-ready builds and beyond. What you will be doing: Build thermal solutions for engineering characterization and validation of next-gen GPU/SOC products, ensuring flawless delivery from concept to lab. Drive end-to-end development and deployment of thermal solutions, collaborating with internal teams and external vendors on build requirements, prototype evaluation, test system integration, and software automation. Improve thermal design processes by incorporating feedback and findings, developing workflow and maintaining our world-class standards. Work closely with system architects, chip and board designers, and software/firmware engineers in a dynamic and high-energy environment to bring industry-defining products to market. Apply AI-enabled approaches and AI tools to accelerate design iteration, test planning, and characterization/validation triage (e.g., requirements/spec summarization, experiment prioritization, log/telemetry summarization, anomaly/outlier detection), improving cycle time, coverage, and traceability while validating outputs against physics, specs, and lab measurements. Partner with AI/tooling teams as the thermal domain SME to define use-cases, success criteria, and evaluation methods; provide feedback to improve tool reliability and usability. What we need to see:

What if the work you did every day could impact the lives of people you know? Or all of humanity? At Illumina, we are expanding access to genomic technology to realize health equity for billions of people around the world. Our efforts enable life-changing discoveries that are transforming human health through the early detection and diagnosis of diseases and new treatment options for patients. Working at Illumina means being part of something bigger than yourself. Every person, in every role, has the opportunity to make a difference. Surrounded by extraordinary people, inspiring leaders, and world changing projects, you will do more and become more than you ever thought possible. We are seeking a Senior Mechanical Engineer to support new product development in genomics instrumentation. This is a highly technical mechanical design role focused on the development of custom mechanisms, precision motion systems, and electromechanical assemblies used in advanced instrumentation. The ideal candidate will be an engineer with experience designing motorized mechanisms and precision motion systems, including a strong understanding of system requirements, motion architecture, controls integration, structural design, and performance validation. The ideal candidate also has experience developing motion solutions from requirements through implementation and understands the engineering principles behind achieving precise, reliable motion in complex systems. Responsibilities Design and develop custom mechanical mechanisms for use in genomics instruments, including motion systems, precision assemblies, and fluidic or sample‑handling components. Integrate mechanical designs with electrical, firmware, and control systems Create and maintain 3D CAD models, engineering drawings, and support

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom