Edge Infrastructure Engineer in United States

Why Sony Interactive Entertainment? Sony Interactive Entertainment isn’t just the Best Place to Play — it’s also the Best Place to Work. Sony Interactive Entertainment (SIE) is the company behind the PlayStation brand. As a subsidiary of Sony Group Corporation, we’re part of a proud legacy of innovation and excellence. SIE is a dynamic technology company, delivering cutting-edge hardware and network services to more than 100 million people and an entertainment leader, home to some of the most beloved and recognizable intellectual properties (IP) in the world. Our role at SIE is to create and nurture the experiences under the PlayStation brand, a name synonymous with entertainment excellence and creativity. Reporting to the Director of Global Vulnerability Management, you will serve as a Senior Security Research Engineer and technical lead within SIE’s Global Vulnerability Management team. You will lead complex work that advances our Threat Exposure Management capability and supports our transition to a Continuous Threat Exposure Management operating model, while remaining directly engaged in vulnerability research, analysis, security validation, prioritization, and remediation support. You will partner across Information Security, engineering, technology, and business teams to improve how SIE discovers, prioritizes, validates, and mobilizes action on security risks. You will translate annual TEM goals into defined workstreams, delivery plans, success measures, and repeatable operating practices that improve visibility, decision-making, remediation outcomes, and program scale. Responsibilities Lead complex Global Vulnerability Management workstreams that advance SIE’s Threat Exposure Management capability and transition toward a Continuous Threat Exposure Management operating model across discovery, prioritization, validation, and mobilization. Translate annual TEM goals into defined delivery plans, milestones, success measures, dependencies, and repeatable operating

Job Details: Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation. Key Responsibilities Design, develop, and debug Fill components of Process Design Kits (PDKs), Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. Automate workflows to enhance efficiency, accuracy, and deployment across design teams. Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment.

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a SoC Power Thermal Performance Validation and Optimization Engineer, you will play an essential role in ensuring Intel's products achieve optimal power, thermal, and performance benchmarks at the system-on-chip (SoC) level. In this position, you will develop and execute validation methodologies, optimize hardware/software solutions, and perform SoC-level debugging to address power, thermal, and performance challenges. Your contribution will directly impact Intel's ability to deliver competitive, high-performing products to market. Business Group This role is part of Intel's Data Center Group (DCG), which focuses on designing innovative solutions to power the next generation of computing platforms for data centers. As a member of the PTP PreSi Correlation Solution team, you will contribute to shaping the development and validation processes for cutting-edge technologies, ensuring Intel meets and exceeds industry standards for performance and efficiency. Key Responsibilities: Develop and execute SoC-level power, thermal, and performance validation and

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

We’re building a world of health around every individual — shaping a more connected, convenient and compassionate health experience. At CVS Health®, you’ll be surrounded by passionate colleagues who care deeply, innovate with purpose, hold ourselves accountable and prioritize safety and quality in everything we do. Join us and be part of something bigger – helping to simplify health care one person, one family and one community at a time. Position Summary The Senior Manager of Pickup Innovations and Execution drives forward the strategic innovation of cutting-edge point of sale solutions for pharmacy pick up processes. This role will oversee the current execution of an enhanced and seamless patient experience while managing the POS platform for enterprise offerings and services. As a Sr Manager, you will lead and oversee the prioritization and implementation of pickup functionality with key stakeholders across the enterprise to ensure compliance, regulatory, and growth opportunities are being integrated during the pickup process. You will drive the patient and customer experience through innovating workflows, patient prompting/notifications, and the overall design/functionality of the point-of-sale system. You will also oversee peripheral processes that include Waiting Bin inventories for financial reconciliation, Reconstitution execution, and Drive Thru/Fill Master maintenance with our outside vendors. Key Responsibilities: Lead implementation of Rx POS innovation and enhancements, ensuring alignment with business goals, financial objectives, and customer/colleague priorities. Oversee day to day Rx POS execution including system support, reporting, and customer ser

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Propulsion Engineer (Experienced or Senior) Company: The Boeing Company Boeing Defense, Space & Security (BDS) is seeking a Propulsion Engineer to contribute to the development and qualification of a new propulsion system for a cutting-edge fixed-wing program in the St. Louis, MO , area. In this role, you will be an integral part of a larger Flight Sciences team consisting of propulsion, aerodynamics, and guidance, navigation and controls. As part of the propulsion team you will contribute to inlet development, engine integration and controls, testing, and qualification efforts. Come join the Boeing team as we develop next generation airplanes that will make aviation history Our teams are currently hiring for a broad range of experience levels including; Experienced and Senior Level Propulsion Engineer. Position Responsibilities: Defines requirements for propulsion systems within a model-based engineering environment Defines, coordinates and controls the functional and physical interfaces between the propulsion system and the vehicle Configures or designs propulsion sub-systems and components to meet all vehicle design and performance specifications Contributes to or leads a range of testing, analysis, modeling, and simulation activities aimed at predicting and validating system performance Defines and performs verification tests for propulsion sub-systems and components Review, processing and approval of engine and component qualification documentation Assist with propulsion ground and flight test planning Propulsion vendor management and coordination This position is expected to be 100% onsite. The selected candidate will b

Lead Systems Integrator Company: The Boeing Company Boeing Defense, Space & Security (BDS) is seeking a Lead Systems Integrator (Level 4) to support an Air Dominance Fixed Wing Proprietary Program in St. Louis, MO . Step into a fast-paced, cutting-edge program where your expertise will drive the design, integration, and testing of advanced, cloud-based systems that empower mission planning, debrief, and tactical Command & Control (C2) solutions for fixed-wing platforms. In this role, you will lead the development, analysis, and integration of innovative engineering solutions for critical Ground System capabilities and ensure seamless support for ground systems from initial design through to final delivery. You will partner closely with the team’s test lead as well as the overall chief integrator who oversees all activities related to design, integration, and test. You will work with a high-performing, cross-functional team in an agile environment, driving next-generation capabilities from design through delivery. This role offers the chance to innovate with open-architecture, model-based designs and collaborate across disciplines to support critical defense missions. You champion best practices, processes, and standards for the integration team, mentor systems and electrical engineers, and coach solution leads on execution. If you’re passionate about advancing mission-critical systems and thrive in a collaborative, fast-moving environment, this is your opportunity to make a significant impact. Position Responsibilities Lead team of systems and electrical engineers in behavior modeling and requirements decomposition for system, sub-system, and software design

We are seeking a highly motivated and experienced Lead Java Developer to join our Credit Risk Technology team. This is a hands-on leadership role where you will be instrumental in designing, developing, and deploying robust, high-performance, and large-scale software solutions for Counterparty Credit Risk Management. You will be at the forefront of firm-wide initiatives, leveraging best-in-class software stacks and cutting-edge AI tools to solve complex challenges. You will lead a team of talented engineers, providing technical guidance, fostering innovation, and ensuring the delivery of high-quality, scalable, and resilient software. The ideal candidate is passionate about modern software development practices, proficient with contemporary tech stacks, and eager to utilize artificial intelligence to manage Citi’s exposure to financial institutions, governments, and corporates. This role offers the opportunity to make a significant impact by contributing to critical systems that provide an integrated view of trades, collateral, and market data from numerous sources. Key Responsibilities: Technical Leadership & Hands-On Development: Lead by example, actively contributing to the design, architecture, and hands-on development of critical software components for Counterparty Credit Risk Management leveraging AI tools such as Devin and Co-Pilot Drive technical excellence, ensuring best practices in coding, testing, and deployment are followed for high-performance and large-scale applications. Conduct code reviews, provide constructive feedback, and mentor team members in advanced development techniques. Team Leadership & Management: Supervise work of a team of software engineers Foster a collaborative, innovative, and inclusive team environment focused on tackling challenging firm-wide initiatives. Allocate resources effectively to meet project deadlines an

Director - Application Development Ready to turn bold ideas into real-world impact? At Genpact, we don’t just adapt to change, we lead it. AI and digital innovation are transforming the way businesses work, and we’re at the forefront of it. Genpact’s AI Gigafactory , our industry-first accelerator, exemplifies how we scale advanced technology solutions to help global enterprises work smarter, grow faster, and transform at scale. Whether tackling complex challenges through large-scale models or agentic AI , our breakthrough solutions tackle companies’ most complex challenges. If you thrive in a fast-moving, innovation-driven environment, love building and deploying cutting-edge AI solutions, and want to push the boundaries of what’s possible, this is your moment. Genpact (NYSE: G) is an agentic and advanced technology solutions company. We leverage process intelligence and artificial intelligence to deliver measurable outcomes. With a strong partner ecosystem and decades of client trust, we provide innovative solutions that transform how businesses run. Powered by a team with an active learning mindset and client centricity at its core, we deliver lasting value for the world’s leading enterprises. Get to know us at genpact.com and on LinkedIn , YouTube , X , and Facebook . Job Description Responsibilities: Demonstrate expertise in core ServiceNow modules such as ITSM, ITOM, CRM,

Define the physical limits of what a chip can do, then break them! NVIDIA's Silicon Co-Design Group sits at the crossroads of architecture, silicon, systems, and manufacturing, where first principles thinking translates directly into product outcomes at scale. As GPU power density and thermal limits approach physical boundaries, the gap between system architecture needs and manufacturable, testable capabilities widens with every generation, and this role exists to close it. You wouldn't be maintaining existing solutions, you'd be identifying where physical constraints will erode NVIDIA's competitive edge before anyone else sees it coming, then building the cross-domain responses that ensure the next generation leapfrogs those limits entirely. The problems here don't have known answers yet: Every generation of NVIDIA silicon pushes closer to the limits of physics. The Co-Design Architect role isn't about optimizing within known bounds; it's about redrawing those bounds entirely. If you want your work to shape what's physically possible in the world's most demanding computing products, this is where that work happens. What you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. Cross-Domain Solution Development: Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards. Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting an

We anticipate the application window for this opening will close on - 30 Sep 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72&#43; million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life At Medtronic, we bring bold ideas forward with speed and decisiveness to put patients first in everything we do. This position is remote to enhance our competitive edge and expand our cross-functional collaboration efforts. This role will require 75% of travel to enhance collaboration and ensure successful completion of projects. In this exciting role as a Principal Field Clinical Specialist, you will provide day-to-day field clinical study support, technical and education support, and site management, coordination and training for the Mitral and Tricuspid Therapies clinical programs. This role will promote clinical programs through education of current and new investigators, new technologies and case support to achieve safe patient outcomes and company objectives . The M&T Structural Heart Business is one of the fastest growing businesses in the medical device industry and expanding rapidly to serve patients globally. The Structural Heart and Aortic integrated operating unit offers <