Group Head Gm Paytm Ads Mumbai in United States

What You Will Achieve A Senior Scientist (R 4 ) position is available in the Upstream Process Development group within the Bioprocess R&D organization. The successful applicant will join a team of scientists and engineers focused on developing and optimizing manufacturing processes for recombinant proteins and other modalities for early- and late-phase human clinical trials. In this role, the candidate will be responsible for designing and executing laboratory experiments in bench-top bioreactors and associated scale-down equipment with the goal of developing robust, scalable, and high productivity processes. The work will also involve collaborating with pilot, clinical, and commercial production facilities to ensure accurate technology transfer, successful large-scale production and associated regulatory filing activities. The candidate may also be involved in cutting edge technology development projects that seek to improve production processes and control strategies leveraging various process analytical technologies. How You Will Achieve It Design and execute

Why Sony Interactive Entertainment? Sony Interactive Entertainment isn’t just the Best Place to Play — it’s also the Best Place to Work. Sony Interactive Entertainment (SIE) is the company behind the PlayStation brand. As a subsidiary of Sony Group Corporation, we’re part of a proud legacy of innovation and excellence. SIE is a dynamic technology company, delivering cutting-edge hardware and network services to more than 100 million people and an entertainment leader, home to some of the most beloved and recognizable intellectual properties (IP) in the world. Our role at SIE is to create and nurture the experiences under the PlayStation brand, a name synonymous with entertainment excellence and creativity. Reporting to the Director of Global Vulnerability Management, you will serve as a Senior Security Research Engineer and technical lead within SIE’s Global Vulnerability Management team. You will lead complex work that advances our Threat Exposure Management capability and supports our transition to a Continuous Threat Exposure Management operating model, while remaining directly engaged in vulnerability research, analysis, security validation, prioritization, and remediation support. You will partner across Information Security, engineering, technology, and business teams to improve how SIE discovers, prioritizes, validates, and mobilizes action on security risks. You will translate annual TEM goals into defined workstreams, delivery plans, success measures, and repeatable operating practices that improve visibility, decision-making, remediation outcomes, and program scale. Responsibilities Lead complex Global Vulnerability Management workstreams that advance SIE’s Threat Exposure Management capability and transition toward a Continuous Threat Exposure Management operating model across discovery, prioritization, validation, and mobilization. Translate annual TEM goals into defined delivery plans, milestones, success measures, dependencies, and repeatable operating

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity We are seeking a system validation engineering intern to help drive server blade and rack validation efforts for next-generation AI infrastructure hardware systems. This role focuses on post-silicon system validation across the full lifecycle of server hardware systems, ensuring functional and performance meets product objectives. You will help drive end-to-end blade and rack validation including development, execution, and debug while collaborating across silicon, firmware, systems, and platform teams. The Blade and Rack Validation team is responsible for ensuring system readiness and quality at scale. The team works cross-functionally with firmware, silicon, and system engineering teams to validate complex AI compute platforms. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You’ll Do Help drive and execute post-silicon validation goals of AI compute blades and racks including testcase planning, development, and automation Help drive validation testcase execution and system debug against program achievements and report validation progress and risks. Drive provisioning and integration of system components (SoC FW, BMC, RMC, OS) for rack-level readiness Triage test failures, collect debug data, and collaborate on root cause analysis. Track validation coverage and continuously improve test processes and infrastructure. What You’ll Bring Working towards a Bachelor's

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our AI Engineering Campus in Austin plays an important role in building the hardware platforms that support the next generation of AI systems. The Opportunity As a Systems Engineering Intern, you will contribute to projects that combine hardware, firmware, and software engineering for advanced AI compute platforms. You will work with experienced engineers on subsystem design, laboratory testing, system validation, automation, and performance analysis. The internship provides hands-on experience with modern hardware development and system-level engineering. You will own clearly defined technical tasks with guidance from the team and document your methods, results, and conclusions. What You Will Do Support the design and testing of CPU and high-speed input and output subsystems for advanced compute platforms. Run laboratory tests and measurements to help evaluate performance, power, signal behavior, and reliability. Contribute to system-level validation by creating scripts and tools that streamline testing, data collection, and analysis. Explore emerging input and output technologies, including PCIe 6.0 and 800G Ethernet, and learn how they support advanced computing workloads. Assist with investigations into platform power, cooling, and energy efficiency, including liquid-cooling systems for high-performance processors. Use power meters, oscilloscopes, logic analyzers, or comparable lab equipment under appropriate supervision. Analyze test results, identify unexpected behavior, and work with engineers to reproduce and investigate issues. Collaborate across hardware, firmware, software, m

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our AI Engineering Campus in Austin plays an important role in building the hardware platforms that support the next generation of AI systems. The Opportunity We are looking for a recent graduate or early-career engineer to join the Hardware Platform Development team as a Graduate Systems Engineer. You will contribute to the design, integration, validation, and performance analysis of advanced AI compute platforms. You will work with experienced hardware, firmware, software, mechanical, thermal, and systems engineers throughout the development lifecycle. The role combines subsystem engineering, hands-on laboratory work, test automation, data analysis, troubleshooting, and clear technical documentation. Start: September, 2027 Location: Austin, Texas, USA What You Will Do Contribute to the design, integration, and testing of CPU and high-speed input and output subsystems for advanced compute platforms. Take ownership of defined engineering tasks from requirements and test planning through execution, analysis, and technical review. Develop system-level validation plans, procedures, scripts, and tools that improve test coverage, repeatability, data collection, and analysis. Evaluate platform performance, power, signal behavior, reliability, and interoperability using laboratory measurements and system data. Investigate emerging input and output technologies, including PCIe 6.0 and 800G Ethernet, and assess their use in advanced computing systems. Support platform power, cooling, and energy-efficiency investigations, including liquid-cooling systems for high-performance processor

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity As a Graduate Performance Engineer, you will contribute to the design, integration, bring-up, and validation of complex server- and rack-level performance of elaborate, large-scale systems. You will work alongside experienced engineers, software developer, and cross-functional partners while building practical skills in component, system and scale up/out performance optimization and design. Start: September, 2027 Location: Austin, Texas, USA What You’ll Do Support the design, peer review, bring-up, and debug of complex server- and rack-level systems. Assist with modeling, design and evaluation of the complete software and hardware stack identifying performance bottlenecks, possible solutions and testing those outcomes. Collaborate with many different teams across both hardware and software development and testing. What You’ll Bring A bachelor’s or master’s degree in electrical engineering, computer engineering, or a related discipline, completed before the role’s start date. Equivalent relevant education or practical experience will also be considered. Foundational knowledge of software development, hardware architecture and general understanding of performance implications. Hands-on experience gained through coursework, laboratories, internships, research, student projects, or personal projects. Ability to analyze technical problems, document your work, communicate clearly, and collaborate effectively. Curiosity, sound engineering judgment, a

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our AI Engineering Campus in Austin plays an important role in building the hardware platforms that support the next generation of AI systems. The Opportunity We are looking for a recent graduate or early-career engineer to join the Mech/Thermal Platform team as a Graduate Mechanical Engineer. You will contribute to the mechanical design, thermal validation, and verification of advanced AI hardware and data center systems. You will work with experienced mechanical, thermal, hardware, and systems engineers throughout the development lifecycle. The role combines 3D computer-aided design, prototype evaluation, lab testing, data analysis, troubleshooting, and clear engineering documentation. What You Will Do Create and update mechanical parts, assemblies, and drawings using Creo or comparable 3D CAD software. Take ownership of defined mechanical design tasks from requirements and concepts through detailed design, review, release, and verification. Apply mechanical design, materials, manufacturing, heat transfer, and thermodynamics principles to engineering decisions. Develop mechanical and thermal test plans and procedures for prototypes and development systems. Set up and operate laboratory equipment, collect accurate data, analyze results, and document conclusions. Evaluate prototypes and identify mechanical, thermal, assembly, or manufacturability issues. Support design verification, troubleshooting, root-cause analysis, and implementation of verified design improvements. Maintain accurate engineering documentation, including design notes, drawings, test procedures, results, and change r

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity As a Mechanical Engineering Intern, you will contribute to the mechanical design and thermal validation of advanced AI hardware. Working alongside experienced mechanical and thermal engineers, you will gain hands-on experience with 3D computer-aided design (CAD), laboratory setup, test development, prototype evaluation, and engineering documentation. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You’ll Do Contribute to mechanical design activities using Creo or comparable 3D CAD software, including part modeling, assemblies, drawings, and design updates under the guidance of experienced engineers. Work with the thermal engineering team to develop test procedures and help set up laboratory capabilities for evaluating AI hardware. Support thermal and mechanical testing using appropriate laboratory equipment; collect, organize, and analyze test data. Assist the mechanical and thermal design teams with prototype evaluation, troubleshooting, design verification, and documentation of findings. Collaborate with cross-functional engineering partners, communicate progress and issues clearly, and follow applicable laboratory and safety procedures. What You’ll Bring Current enrollment in a bachelor's, master's, or doctoral program in mechanical engineering or a related discipline during the internship. Students in other disciplines with relevant mechanical engineering exper

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Given heightened expectations from regulators and a goal to build a strong and consistent global control environment, Citi continues to enhance its business governance framework and has created the Enterprise Data group. Enterprise Data is a critical component of Citi’s first line of defense for wholesale and counterparty credit risk management and works with Independent Risk teams to ensure best-in-class risk and controls, as well as client responsiveness. Key responsibilities of the group include credit analysis, documentation, risk identification, exposure monitoring and stress testing. Enterprise Data coordinates with credit management groups across institutional client businesses to ensure full alignment on business and regulatory goals, as well as consistency and best practices. The Counterparty Credit Risk (CCR) project execution team within Enterprise Data is responsible for building tools to: Provide in-depth quantitative or qualitative analysis to solve business problems and develop new, innovative solutions Build tools to help measure, monitor and control counterparty risk for institutional clients and Portfolios and businesses, with a focus on counter-party and collateral risk to ensure the risks are being properly measured and controlled in accordance with the Firm’s risk policies. Responsibilities: As a Product Developer working in CCR project team, individual will be expected to Lead strategic BAU and Regulatory projects primarily impacting Counterparty Credit Risk exposure measures for traded product markets business Develop and enhance tools for the measurement, monitoring and reporting of counterparty exposure including Stress testing - Net Stressed Exposure (NSE), Potential Future Exposure (PFE), Settlement Risk, Intraday risk and participate in project management of strategic risk infrastructure development.</

Build the infrastructure that keeps every NVIDIA chip aligned from first spec to final shipment. NVIDIA's Silicon Co-Design Group sits at the convergence of architecture, silicon, systems, and manufacturing. The System–Manufacturing Architecture (SMAC) team coordinates between system specifications and manufacturing test specifications from pre-silicon POR through production release across GPU, SoC, and CPU programs. When that alignment drifts, silicon faces the consequences: escapes, yield loss, and performance loss. We're hiring a Senior Manufacturing & System Co-Design Workflow Engineer to lead the methodology and infrastructure that maintains holistic, systematic alignment, at scale across the full portfolio. The strongest candidates in this role design the workflow before being asked to fix a program, and build the checks and automation that confirm alignment holds long after they've moved on to the next problem. What you’ll be doing: SMAC Workflow Methodology: Define manufacturing spec types, including schema and semantics, derived from system PORs and features. Own the methodology that governs how specification work gets structured, versioned, and validated across the program lifecycle. Production Python Pipelines & Automated Checks: Develop production-grade Python pipelines and automated checks that catch specification drift between system POR and manufacturing test programs ,ATE, SLT, BLT, L10&#43;, before silicon exposes the discrepancy. The goal is that misalignments surface in the workflow, not on the tester. E2E Program Integration & TPM Attestation: Wire SMAC work into the end-to-end program spine, milestones, gates, and artifacts, and define explicit TPM-driven attestation when checks lag. Alignment can't be assumed; it must be proven at every stage. Agent-Ready Tooling & CI Infrastructure: Integrate tooling into an agent-ready

Define the physical limits of what a chip can do, then break them! NVIDIA's Silicon Co-Design Group sits at the crossroads of architecture, silicon, systems, and manufacturing, where first principles thinking translates directly into product outcomes at scale. As GPU power density and thermal limits approach physical boundaries, the gap between system architecture needs and manufacturable, testable capabilities widens with every generation, and this role exists to close it. You wouldn't be maintaining existing solutions, you'd be identifying where physical constraints will erode NVIDIA's competitive edge before anyone else sees it coming, then building the cross-domain responses that ensure the next generation leapfrogs those limits entirely. The problems here don't have known answers yet: Every generation of NVIDIA silicon pushes closer to the limits of physics. The Co-Design Architect role isn't about optimizing within known bounds; it's about redrawing those bounds entirely. If you want your work to shape what's physically possible in the world's most demanding computing products, this is where that work happens. What you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. Cross-Domain Solution Development: Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards. Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting an