Hardware Software Codesign Engineer in United States

Citi's Equity Research team is looking for an Associate with strong financial fundamentals, intellectual curiosity and a genuine interest in investing. You’ll develop company expertise, financial modeling skills, and investment insights while covering one of the most dynamic sectors in the global market. Previous experience covering the Technology sector is not required, we welcome candidates from other industries who are excited to learn and transition into areas such as Semis, Networking, Hardware, Quantum and other technology subsectors. Responsibilities Support senior analysts in researching companies across the Technology & Communications sector. Build and maintain financial models, valuation analyses, and earnings forecasts. Analyze company financial statements, industry trends, competitive positioning, and market developments. Assist with writing research reports, earnings previews and recaps, thematic reports, and investment recommendations. Participate in earnings calls, company meetings, industry conferences, and investor events. Monitor news flow, financial results, and industry developments to identify investment opportunities and risks. Prepare presentation materials and research supporting client discussions. Collaborate closely with senior analysts while developing deeper sector expertise and research skills. Contribute to a collaborative team environment while maintaining high standards of accuracy, integrity, and professional Required Qualifications & Skills 2 to 3 years of experience in Equity Research, Investment Banking, Corporate Finance, Asset Management, Valuation, or another financial markets-related role. Strong understanding of financial statements, accounting fundamentals, and corporate finance. Experience building financial models and performing com

Overview: The Insights product is an offering for Guidepoint's institutional investment and corporate clients, now in its 9 th year, that offers teleconferences, surveys, in-person events, and AI-facilitated data and content. The teleconferences live in an online library portal, which covers a wide of industries/topics that enables our clients to make informed decisions. All content features experts from Guidepoint’s proprietary global network and is conceptualized and hosted by former investment professionals (i.e. hedge fund analysts), sell-side equity research analysts, and industry professionals. This is a hybrid position based in our New York City office. What you'll do: Monitor a coverage universe of public companies within the global hardware and semiconductor sector by tracking earnings releases, investor presentations, SEC filings, sell-side research and industry news. Create and moderate teleconferences on timely topics featuring an expert from Guidepoint’s network with the goal of producing actionable insights for clients. Attend industry conferences to host client panels What you have: Bachelor’s degree or Master’s degree Minimum 10 years of sell-side or buy-side analyst experience Must follow bottoms-up, fundamental approach to investment research focusing on individual companies Has covered the Hardware and Semiconductor sector; candidates must be current on company/industry knowledge Ability to work in a fast-paced entrepreneurial environment Outgoing personality with the ability to speak with people at all professional levels Intellectual curiosity and desire to learn Effective time management and organizational skills Demonstrated ability to work both individually and as part of a team What We Offer: The annual salary range for this position is $210,000-$230,000. Additionally, this position is eligible for an annual discretionary bonus based on performance. You will also be eligible for the following benefits: 15

Manufacturing Test Engineer – Server Hardware Graphcore is a globally recognised leader in Artificial Intelligence computing systems. The company designs advanced semiconductors and data centre hardware that provide the specialised processing power needed to drive AI innovation, while delivering the efficiency required to support its broader adoption. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. We are opening a new AI Engineering Campus in Austin, which will play a central role in Graphcore's work building the future of AI computing. Role Overview We are seeking an experienced Manufacturing Test Engineer to support high-volume server manufacturing from board-level test through system-level production test. This role will work closely with an ODM manufacturing partner to define, implement, validate, and optimize the manufacturing test strategy for L6 board-level products , including ICT, MDA, and Board Functional Test , as well as support L10 system-level manufacturing test . The ideal candidate has strong experience in server hardware manufacturing, Linux-based test environments, diagnostic test coverage, fixture requirements, yield improvement, and root cause corrective action processes. This role requires both technical depth and hands-on manufacturing execution experience, with the ability to drive best practices across test development, factory readiness, quality planning, and ongoing production support. Key Responsibilities Manufacturing Test Strategy and Planning Work with ODM partners to define and execute the manufacturing test strategy for L6 board-level production . Develop and review test plans covering: In-Circuit Test, or ICT Manufacturing Defect Analyzer, or MDA Board Functional Test Diagnostic coverage requirements Manufacturing line test flow Fai

About the Team The Stargate team is responsible for building the physical infrastructure that powers large-scale AI systems. We design and deliver next-generation data centers optimized for dense compute clusters, advanced networking, and rapidly evolving hardware platforms. This work sits at the intersection of hardware engineering, systems architecture, and infrastructure execution—translating cutting-edge compute roadmaps into scalable, production-ready environments. Our teams partner across silicon vendors, server and storage OEMs, networking teams, and data center engineering organizations to bring new capacity online quickly, reliably, and at global scale. About the Role We are seeking a CPU & Storage Technical Lead to define and drive the server compute and storage architecture strategy for Stargate infrastructure. In this role, you will own technical direction across CPU platforms, memory configurations, local and disaggregated storage systems, and their integration into large-scale AI clusters. You will evaluate vendor roadmaps, lead platform tradeoff decisions, and ensure compute and storage systems are optimized for training, inference, and supporting services. You will work cross-functionally with hardware engineering, performance modeling, networking, supply chain, and deployment teams, as well as external partners such as AMD, Intel, OEMs, ODMs, and storage vendors. This is a highly strategic role for someone who can operate deeply at the component level while also driving long-range infrastructure decisions. Key Responsibilities Own CPU and storage technical strategy for Stargate compute infrastructure across current and future generations. Evaluate CPU platforms across performance, efficiency, memory bandwidth, PCIe topology, cost, and roadmap alignment. Define storage architectures for AI environments, including boot media, local NVMe, shared storage, caching tiers, metadata services, and high-performance data pipelines. Drive server platform de

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a Rack Power Engineer with deep expertise in high-power conversion and distribution to design, qualify, and support power systems for AI supercomputers. You will own rack power solutions—including power shelves, AC/DC rectifiers, power supply units (PSUs), power management controllers (PMCs), and high-current distribution—from requirements and supplier development through deployment. You will also monitor fleet rack power health, lead debugging and root-cause investigations, and drive improvements into hardware, firmware, and qualification coverage. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own rack power architecture and requirements for high-power AI supercomputing systems, including power budgets, AC input interfaces, DC distribution, redundancy, efficiency, serviceability, and integration with data center infrastructure. Drive the design and supplier development of power shelves, rectifiers, PSUs, PMCs, busbars, connectors, and protection circuits. Review electrical designs and control behavior, and evaluate performance, cost, reliability, and availability trade-offs. Define and execute component, shelf, and rack qualification plans covering load transients, current sharing, hot-swap, startup and shutdown, redundancy failover, fault protection and recovery, thermal limits, and AC disturbances and ride-through

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are seeking a highly skilled Physical Design Engineer with deep expertise in physical design and methodology. This individual contributor role sits within our physical design team and is central to delivering power, performance, and area (PPA) optimized datapath and interconnect solutions for next-generation AI accelerators. You’ll work closely with RTL designers to define and execute on physical design strategies. You will develop tools, flows and methodologies to increase team productivity. Your work will directly impact silicon’s performance and cost efficiency, as well as the team’s execution velocity and quality. In this role, you will: Develop, build and own tools, flows and methodologies for physical implementation Own physical implementation of floorplan blocks from floorplanning to final signoff Collaborate with RTL designers to drive optimal block implementation solutions Analyze and optimize design for timing, power, and area trade-offs, working in collaboration with EDA vendors and ASIC partners Qualifications: BS w/ 4+ or MS with 2+ years or PhD with 0-1 year(s) of relevant industry experience in physical design and methodology development Demonstrated success in taping out complex silicon designs Hands-on experience with block physical implementation and PPA convergence Strong coding experience with python, bazel, TCL Strong experience building physical design tools, flows and methodologies Strong understanding of microarchitecture, RTL design,

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a product manufacturing & quality engineer, who will be responsible for driving technical initiatives related to the manufacturing, quality and reliability of our AI supercomputer hardware systems to ensure product success from concept to launch and through mass production. You’ll have the opportunity to coordinate with functional SMEs and work with a wide range of stakeholders, from design engineering and operations teams, TPMs, external industry vendors and partners to ensure that all products are developed and delivered on time and to the highest quality standards. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees In this role, you will: Own the integrated manufacturing and quality readiness for a product across L6, L10, and L11, with clear gates, milestones, deliverables, owners, and closure criteria. Lead readiness of process flows, tooling, fixtures, assembly operations, test interfaces, and production controls. Review and contribute to work instructions. Translate product requirements into qualification plans, process controls, test requirements and acceptance criteria with design engineering and Area SMEs Coordinate and drive execution of product and process qualification, reliability testing, and validation with the relevant SMEs. Maintain traceable evidence that assigned products and processes meet agreed performance, reliability,

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a Product Manufacturing Engineer to drive manufacturing strategy and execution for next-generation AI hardware within the Silicon & Systems team, with a particular focus on PCBA manufacturing, assembly, process development, and production readiness. You will work closely with design engineering, systems engineering, operations, TPMs, contract manufacturers, suppliers, and other external partners to ensure new hardware products successfully transition from concept and prototype builds through NPI and high-volume production. You’ll own critical manufacturing initiatives, identify and resolve production risks, and help establish the processes and controls required to deliver complex hardware at scale. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Drive manufacturing and quality initiatives to ensure product success from concept and early development through NPI, production launch, and scale. Lead manufacturing process development for next-generation AI hardware systems, partnering closely with design engineering, systems engineering, operations, TPMs, suppliers, and manufacturing partners. Own PCBA manufacturing development and production readiness, including assembly processes, process validation, manufacturing test, rework, yield improvement, and successful transition into volume production. Establish NPI manufact

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for a highly experienced RTL engineer to own critical on- and off-chip interconnect components for our custom AI accelerator platform. You will drive the microarchitecture and RTL implementation of scalable on-chip communication fabrics connecting high-bandwidth compute, memory, and I/O subsystems as well as purpose-built off-chip interfaces and protocols needed to enable custom computing at scale. This is a senior, hands-on engineering role with broad technical ownership. You will drive design from requirements through the full silicon lifecycle, from architecture definition and performance analysis through RTL implementation, verification closure, physical design convergence, bring-up, and production readiness. You will plan and oversee the work of junior engineers and help drive and develop productive engineering relationships with external partners and help manage partner execution. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own the microarchitecture, RTL design, and delivery of major SoC interconnect components, including network-on-chip fabrics, switches, routers, bridges, protocol adapters, arbiters, and traffic-management logic as well as off-chip protocol bridges and interfaces. Drive third party engagements to develop novel networking and interface protocols and silicon IP while ensuring high quality and de

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role As a Supply Chain Program Manager, you will own material readiness and supply chain execution for critical hardware programs spanning custom silicon, systems, memory, storage, networking, and rack infrastructure. You will work cross-functionally with Engineering, Strategic Sourcing, Manufacturing Operations, Finance, Planning, Quality, and external suppliers to develop and execute scalable supply strategies that support aggressive product development and deployment timelines. This role requires deep understanding of hardware supply chains, material planning, NPI execution, supplier management, and operational scaling in constrained and rapidly evolving environments. In this role you will: Material Readiness & Supply Planning - Own end-to-end material readiness across NPI and production phases, including building the necessary framework and processes for enablement. Drive supply planning and execution for long lead-time and constrained commodities including ASICs, HBM, DDR, SSDs, networking, optics, power, thermal, and mechanicals. Build and manage material readiness plans aligned to proto/pre-EVT, EVT, DVT, PVT, and mass production schedules. Monitor supply health, lead times, inventory positions, allocation risk, and capacity constraints. Drive shortage management, allocation mitigation, and recovery planning. Coordinate supply commits, forecast alignment, and supply continuity planning with suppliers and manufacturing partners. Cross-Functional Program Ma

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role As a Hardware Chips Programs Manager at OpenAI, you will help bring our chips hardware roadmap to life, navigating an array of technical and partnership challenges. We’re looking for people excited to push the frontiers of computing by navigating technical explorations and are passionate about building. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Manage the design and implementation planning of our ML acceleration hardware, working across technical, cross-functional and external stakeholders Lead planning and scheduling of chip hardware designs with our strategic partners and vendors Coordinate and marshal internal resources and communication for efficient interaction with partners and vendors. You might thrive in this role if you: Have experience as a technical program manager for data center hardware products (server, GPU, TPU, networking, storage and so on) Know the whole end-to-end system program management from concept, design, production, deployment into the data center Have some experience with System SW programs through NPI Want to help design some of the world’s largest supercomputing systems, working at the edge of complex hardware challenges Enjoy working with and enabling world-class AI Researchers and Engineers Are passionate about the technical program function, and enjoy independently owning and delivering on your tea

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are seeking a Operations Program Manager (OPM) to serve as the single-threaded operational leader for new hardware introductions (NPI) and production ramps across OpenAI’s AI infrastructure systems. This role combines hands-on execution with strategic ownership. You will be responsible for defining the operating model, aligning cross-functional stakeholders, setting the critical path, making informed tradeoffs, escalating decisively, and ensuring hardware programs deliver on schedule, quality, cost, and scalability. Success in this role requires comfort operating in ambiguity, influencing without authority, and driving alignment across internal teams and external partners—while keeping eyes firmly on long-term system scalability and repeatability. In this role, you will: Strategic & Leadership Ownership Act as the single-threaded owner for operational readiness across NPI and ramp, accountable for outcomes from early bring-up through sustained production Translate OpenAI’s infrastructure strategy and engineering objectives into clear operating plans, execution priorities, and decision frameworks Drive alignment across Engineering, Operations, Strategic Sourcing, Finance, Capacity Planning, and Executive stakeholders by framing tradeoffs, risks, and recommendations Proactively identify inflection points where decisions or investments are required to protect long-term scale, reliability, or cost targets Influence operational strategy with manufacturing par