High Performance Workstation Business Development Manager Amd in United States

GitLab is the intelligent orchestration platform for DevSecOps. GitLab enables organizations to increase developer productivity, improve operational efficiency, reduce security and compliance risk, and accelerate digital transformation. More than 50 million registered users and more than 50% of the Fortune 100* trust GitLab to ship better, more secure software faster. The same principles built into our products are reflected in how our team works: we embrace AI as a core productivity multiplier, with all team members expected to incorporate AI into their daily workflows to drive efficiency, innovation, and impact. GitLab is where careers accelerate, innovation flourishes, and every voice is valued. Our high-performance culture is driven by our values and continuous knowledge exchange, enabling our team members to reach their full potential while collaborating with industry leaders to solve complex problems. Co-create the future with us as we build technology that transforms how the world develops software. * Fortune 500® is a registered trademark of Fortune Media IP Limited, used under license. Claim based on GitLab data. Fortune 100 refers to the top 20% ranked companies in the 2025 Fortune 500 list, published in June 2025. Fortune and Fortune Media IP Limited are not affiliated with, and do not endorse products or services of GitLab. An overview of this role As a Senior Team Member Relations Partner, you'll guide managers through complex team member relations matters across GitLab's global organization, including performance management, investigations, and policy compliance. You'll lead sensitive investigations, coach leaders through confidential workplace matters, and partner with Legal and People Business Partners on solutions that support a positive team member experience while reducing organizational risk. This is a senior-level individual contributor role that reports to the Team Member Relations Director. You'll work with a high degree of autonomy on se

GitLab is the intelligent orchestration platform for DevSecOps. GitLab enables organizations to increase developer productivity, improve operational efficiency, reduce security and compliance risk, and accelerate digital transformation. More than 50 million registered users and more than 50% of the Fortune 100* trust GitLab to ship better, more secure software faster. The same principles built into our products are reflected in how our team works: we embrace AI as a core productivity multiplier, with all team members expected to incorporate AI into their daily workflows to drive efficiency, innovation, and impact. GitLab is where careers accelerate, innovation flourishes, and every voice is valued. Our high-performance culture is driven by our values and continuous knowledge exchange, enabling our team members to reach their full potential while collaborating with industry leaders to solve complex problems. Co-create the future with us as we build technology that transforms how the world develops software. * Fortune 500® is a registered trademark of Fortune Media IP Limited, used under license. Claim based on GitLab data. Fortune 100 refers to the top 20% ranked companies in the 2025 Fortune 500 list, published in June 2025. Fortune and Fortune Media IP Limited are not affiliated with, and do not endorse products or services of GitLab. An overview of this role As the Director, Strategic Partnerships, you will own two of GitLab's most important external relationships. This is a single-threaded owner role within the Corporate Development & Strategic Partnerships team, reporting to the VP, Corporate Development & Strategic Partnerships. You will shape partnership strategy from the top down and drive execution from the ground up — this is as much about running the weekly grind of a partnership as it is about setting its direction, turning strategic relationships into durable business outcomes. This role sits close to GitLab's evolving AI strategy and the fu

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

We’re building a world of health around every individual — shaping a more connected, convenient and compassionate health experience. At CVS Health®, you’ll be surrounded by passionate colleagues who care deeply, innovate with purpose, hold ourselves accountable and prioritize safety and quality in everything we do. Join us and be part of something bigger – helping to simplify health care one person, one family and one community at a time. Position Summary The Executive Director, Digital Engineering- Aetna Member Care and Journey Services is a senior technology leader responsible for setting the technical vision, architectural direction, and engineering execution for member centric services. This role leads large-scale engineering teams that build high-performance backend APIs, microservices, and cloud-native systems that power member experiences across digital, agent, provider, and partner channels. The leader ensures exceptional service stability, resiliency, innovation velocity, and alignment with enterprise user experience and operational goals. Key Responsibilities 1. Backend API & Microservices Engineering Leadership • Lead the design, development, and delivery of scalable backend systems, APIs, and microservices powering member-facing capabilities. • Define API contract standards, and integration patterns used across Member Services platforms. • Drive service modernization by adopting cloud‑native architectures, containerization, and event-driven patterns. 2. Service Stability, Observability & Resiliency • Establish standards for availability, resiliency, performance, and disaster recovery across all services. • Implement SLO/SLI/error budget frameworks, health checks, and high‑availability architectures. <p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

We are seeking an experienced Quantitative Developer to join our Markets Quantitative Analytics team, partnering closely with Quantitative Analysts, Traders, and Technology professionals to build the next generation of pricing, risk, and analytics platforms. This is a hands-on technical role for a highly skilled software engineer with a passion for quantitative finance. You will be responsible for designing and delivering high-performance, scalable solutions that support front office trading businesses across asset classes. The role offers the opportunity to work on complex quantitative challenges, modern engineering practices, and large-scale distributed systems while helping shape the strategic direction of Citi's quantitative technology platform. Successful candidates will combine strong software engineering expertise with an understanding of quantitative methodologies and financial markets, translating sophisticated mathematical models into robust, production-grade solutions. Key Responsibilities Design, develop, and maintain high-performance pricing, risk, and analytics libraries used across Global Markets. Partner with Quantitative Analysts to transform research models and prototypes into scalable, production-quality software. Build and optimize quantitative applications using modern C&#43;&#43; and Python, applying strong software architecture and engineering principles. Own the full software development lifecycle, including requirements gathering, design, implementation, testing, deployment, and ongoing support. Drive engineering excellence through CI/CD adoption, automated testing, code reviews, and software quality best practices. Develop and maintain market data platforms and data pipelines supporting analytics, pricing, and risk workflows. Work with infrastructure teams to leverage distributed computing, cloud technologies, and scalable arc

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Ignite your curiosity. Solve the unsolvable. At Leidos, we do more than write code—we decode the unknown. Our San Diego-based research and engineering team takes on some of the nation’s toughest defense challenges using advanced signal processing, ocean remote sensing, and high-performance computing. We’re seeking a Software Engineer / Computer Scientist who enjoys solving complex problems and pushing the limits of performance. In this role, you’ll work alongside a multidisciplinary team of scientists and engineers with expertise in hydrodynamics, physics, acoustics, and signal processing to build impactful software that turns massive, complex data sets into meaningful insight. If you are motivated by innovation, energized by collaboration, and excited to see your work support real-world missions, this could be the right opportunity for you. What You’ll Do Collaborate with scientists and engineers to design, develop, and optimize advanced algorithms for next-generation radar, optical, and infrared sensor systems. Build scalable, high-performance backend systems for scientific computing in distributed environments. Integrate, refactor, and improve scientific codebases to increase efficiency and scalability. Translate and optimize existing code for GPU/CUDA acceleration and parallel or distributed execution. Test, document, maintain, and enhance complex software in Linux/Unix environments. Contribute in a collaborative environment that values technical excellence, creativity, and continuous growth. Required Qualifications Bachelor’s degree in Computer Science, Applied Mathematics, Physics, or a related field with 4&#43; years of backend software development experience, or a Master’s degree with 2&#43; years of experience. Equivalent experience may be considered in place of a degree. U.S. citizenship and the ability to obtain a Top Secret clearance; active Top Secret clea

NVIDIA Architecture Modeling group is looking for Architects, Functional Modeling Engineers, and Simulation experts to join various architecture efforts across GPU/ SOC Architecture teams. A key part of NVIDIA's strength is to innovate in parallel computing fields, delivering the highest performance in the world for high-performance computing. We are constantly looking for ways to improve our SoC and Systems architecture and maintain our leadership. In this position, you will be working with other world-class architects on modeling, analysis and validation of chip & system architectures and features that advance the state of art in performance and efficiency. What you'll be doing: Modeling and analysis of SoC & Systems algorithms and features, across datacenter, automotive, and client products Build and deliver platforms for SOC's that enable left shift for the SW teams aligned with project milestones Work closely with the SOC architects and guide modeling teams to deliver high-quality functional models that involve SOC&#43;GPU use cases Collaborate with our EDA partners to align on customer-facing technologies Develop tests, test plans, and testing infrastructure for new architectures/features and code coverage analysis and reporting Ensure alignment between the various modeling teams at NVIDIA, GPU modeling teams, and modeling teams overseas What we need to see: Master’s or PhD in Computer Science, Electrical Engineering, Computer Engineering, or a related relevant field (or equivalent experience) with 5&#43; years of relevant work experience. Strong programming ability: C&#43;&#43;, C along with a good understanding of build systems (CMAKE, make) , toolchains (GCC, MSVC) and libraries (STL, BOOST) Computer Architecture background with experience in modelling wit

NVIDIA is seeking elite ASIC Verification Engineers to verify the design and implementation of the world’s leading SoC's and GPU's. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. We have crafted a team of extraordinary people stretching around the globe, whose mission is to push the frontiers of what is possible today and define the platform for the future of computing. In this position, you will help to build the high-performance processor elements that implement programmable compute and graphics functionality. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of the industry's leading GPUs You will be responsible for verification of the ASIC design, architecture, golden models and micro-architecture using advanced verification methodologies such as UVM Understand the design and implementation of your unit, define the verification scope, develop the verification infrastructure and verify the correctness of the design Collaborate with architects, designers, and pre and post silicon verification teams to accomplish your tasks What we need to see: Bachelors Degree in EE, CS or CE or equivalent experience 2&#43; years of relevant experience Experience in verification using random stimulus along with functional coverage and assertion-based verification methodologies Background with design and verification tools (VCS or equivalent simulation tools, debug tools like Verdi, GDB) Experience crafting test bench environments for unit and system level verification Strong background in System Verilog or similar HVL Expertise with C/C&#43;&#43; programmin