Intel Foundry Ltd Product Yield Engineer in Oregon

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Job Details: Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation. Key Responsibilities Design, develop, and debug Fill components of Process Design Kits (PDKs), Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. Automate workflows to enhance efficiency, accuracy, and deployment across design teams. Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment.

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Job Details: Job Description: Contributes to module process development, process integration flows, and equipment configuration for manufacturing modules. Supports yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. Electrcial characterization of transistors and analysis of data to help yield or improved process conditions. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Contributes to continuous improvement efforts in high volume manufacturing environments. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum qualifications: Must be pursuing a PhD degree in a hard science discipline such as Electrical Engineering, Physics, Materials Science.

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv

Job Details: Job Description: This position is part of Intel Datacenter Group's Office of Strategic Intelligence and Analysis, which focuses on delivering high-quality insights and business intelligence solutions to support the company's strategic goals. The team works across functional areas, leveraging analytics and business intelligence to drive impactful decision-making and operational efficiency. Join a group that values collaboration, customer-centricity, and cutting-edge data approaches to shape Intel's success in a rapidly evolving market. Position Overview As a Business Intelligence Analyst, you will play a pivotal role in transforming complex business data into actionable insights that drive decision-making in product roadmap decisions and improve business practices. You will collaborate with diverse stakeholders to translate market trends into actionable business strategy, craft compelling data stories, and deliver strategic recommendations that influence senior leadership product decisions. Your expertise in data analysis and visualization will empower the organization to navigate dynamic industry landscapes and achieve meaningful business impact. Key Responsibilities • Gather, clean, and analyze business data from various sources to identify patterns and actionable insights in support of business product decisionmakers. • Translate complex datasets into compelling narratives and visualizations, including interactive dashboards, to enhance data storytelling. • Pro

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv

Job Details: Job Description: The Role and Impact: Join Intel's Module Development Engineering team as a manager, where you will lead a group of talented engineers in crafting innovative solutions for next-generation technology development in wafer processing, assembly/test, and module repair factories. As a key driver of Intel's technological advancement, you will play a pivotal role in ensuring the successful development, transfer, and implementation of cutting-edge technologies that enable Intel's leadership in power performance, structural efficiency, and cost optimization. With a focus on driving results and fostering collaboration across multiple organizational boundaries, this role offers an opportunity to make a significant impact on Intel's global manufacturing capabilities and future technological roadmap. Key Responsibilities: - Lead a team of module development engineers to develop, implement, and transfer advanced technology solutions. - Define and oversee technology roadmaps for the module, ensuring alignment with Intel's strategic goals. - Manage resources, set priorities, and foster collaboration across teams to meet project schedules and maximize operational outcomes. - Partner with integration, device, and yield engineering teams to develop robust process solutions that deliver power performance and area leadership. - Build and maintain partnerships with supplier executive management to nurture unique industry ideas and research innovations. - Coach and mentor engineering teams in pathfinding and technology road mapping for advanced technology development. - Develop long-term strategies for module engineering capabilities to support emerging technological requirements. - Ensure accountability and drive team results by setting clear goals, performance benchmarks,

Job Details: Job Description: Logic Technology Development (LTD) is looking for an experienced individual interested in becoming a Process Integration and Yield Technician. As a Process Integration and Yield Technician, you will assist engineering with route creation, modification, and troubleshooting of the flow of material through our factory using in-house software. In this role your primary responsibilities may include (but are not limited to): Provide assistance to engineering in collecting and recording data during the development of next-generation technology. You will use database report analysis in order to assist with route modification and out-of-control material disposition. Helping with the execution of experiments during development. - You will Utilize a practical application of science, math, and engineering to a wide range of problems. Willing but not limited to work in a lab environment. In addition, the candidate must be willing to: Work in compressed work week schedule consisting of three twelve-hour days in a row with one additional day every other week. Lift 25 lbs. repeatedly while sometimes being on their feet for an extended period. Periodically gowning up to go into the factory to assist with wafer movement activities. A successful candidate should also exhibit the following behavioral traits: Effective communication skills and flexibility to work well in a diverse team environment, multitasking skills and the ability to adjust to rapidly changing priorities, critical thinking and analytical problem-solving skills and strong attention to detail, proactive mindset, able to work and think independently with little or no supervision. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualificatio

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve