Layout Designer in United States

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

ABOUT BASETEN Baseten powers mission-critical inference for the world's most dynamic AI companies, like Cursor, Notion, OpenEvidence, Abridge, Clay, Gamma and Writer. By uniting applied AI research, flexible infrastructure, and seamless developer tooling, we enable companies operating at the frontier of AI to bring cutting-edge models into production. We're growing quickly and recently raised our $1.5B Series F , led by Altimeter Capital, Conviction Partners, and Spark Capital. Join us and help build the platform engineers turn to to ship AI products. THE ROLE We're looking for a Web Designer / Design Engineer to own baseten.co day to day, from concept through production. You'll design and build landing pages, bring product launches to life, run experiments, improve conversion, and keep raising the quality bar on the site. This is a high-ownership role on the brand design team, sitting between brand design and frontend engineering. We want the website to be one of the best expressions of the Baseten brand and one of the best developer-focused sites on the internet, which means treating it as a product that's constantly evolving rather than something we redesign every few years. You'll have a lot of autonomy to ship, while partnering closely with brand, product marketing, engineering, and leadership on bigger launches. RESPONSIBILITIES Own the design and frontend implementation of the Baseten marketing site. Ship landing pages, product pages, launches, and campaigns from concept through production. Improve the site continuously, finding and acting on opportunities to make it better rather than waiting for a redesign cycle. Partner with growth and product marketing to test messaging, layouts, and conversion improvements without sacrificing craft. Build polished interactions, motion, and details that make the site feel distinctly Baseten. Build and evolve the components, patterns, and design systems that let the team move quickly without lowering the bar. Turn complex

Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. Job Purpose The Senior Manufacturing Engineer serves as the senior technical authority for assembly process and equipment design within the Industrialization team. This position designs the assembly lines, fixtures, and material flow systems that convert KARNO prototype and development builds into repeatable, scalable production operations — and then systematically removes waste, labor content, and variation from those operations. Working closely with industrialization leadership, design engineering, production, quality, and supply chain, the Senior Manufacturing Engineer owns the most complex assembly value streams end to end: line and station design, fixture and tooling design, material presentation and handling, process qualification, and continuous waste reduction. This position sets the technical standard for how assembly processes are designed and documented at Hyliion, provides mentorship and design review for other manufacturing engineers, and is accountable for measurable improvement in cycle time, first-pass yield, labor content, and ergonomics across the assembly areas. AI at Hyliion At Hyliion, AI is core to how we work. We equip every team member with leading AI tools and count on you to use them — to move faster, solve harder problems, and help us realize the full potential of KARNO technology for the world. Duties and Responsibilities Assembly Line and Cell Design : Design assembly lines, cells, and workstations for KARNO core, module, and subassembly operations. Establish work sequencing, balance work content to takt, define station layouts and footprints, and design lines that accommodate planned rate increases rather t

We are seeking a detail-oriented PCB Layout Engineer to maintain electronic component libraries and develop printed circuit board layouts. This role works closely with electrical engineering, mechanical engineering, procurement, and NPI to ensure component data and PCB designs are accurate, consistent, and ready for production. This position is in Austin, Texas. Key Responsibilities Create, verify, and maintain schematic symbols, PCB footprints, and associated 3D models. Validate component pin assignments, dimensions, land patterns, and library attributes against manufacturer documentation. Maintain library naming conventions, revision control, and component approval processes. Develop PCB layouts from approved schematics, including component placement, routing, stackup coordination, and design rule setup. Collaborate with engineers to address electrical, mechanical, thermal, and manufacturing requirements. Run design rule checks, resolve layout issues, and participate in design reviews. Prepare fabrication and assembly deliverables, including Gerber or ODB++ files, drill files, drawings, and pick-and-place data. Coordinate with PCB fabricators and assembly suppliers to resolve manufacturing questions. Support engineering changes and maintain accurate release documentation. Work with procurement and engineering to identify obsolete components and evaluate suitable alternatives. Required Qualifications Experience with setting up PCB design and electronic component library management. Proficiency in Cadence Allegro/OrCAD. Ability to interpret schematics, component datasheets, and mechanical drawings. Working knowledge of PCB fabrication, assembly processes, and design for manufacturability. Familiarity with relevant IPC standards for PCB design and component land patterns. Strong attention to detail, documentation skills, and ability to manage competing priorities. Experience with multilayer, high-density, mixed-signal, and high-speed PCB designs. Familiarity w

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP

What you’ll do Act as the in-house electrical lead for Midjourney Medical: own the electrical architecture of the scanner and the technical direction for all board-level design. Own complex board design end-to-end: architecture, schematic capture, layout (high-speed digital, analog/mixed-signal, power), DFM/DFT, fabrication and assembly vendor management, bring-up, and revision control. Write firmware for embedded targets (MCU/SoC): drivers, real-time control loops, safety-relevant logic, bootloaders, and field update paths. Audit and update HDL (FPGA) code for high-throughput data acquisition, timing/synchronization, triggering, and pre-processing of ultrasound and sensor data streams. Define electrical interfaces and data contracts with software, recon/ML and mechanical teams: timing budgets, clocking/sync, signal integrity, connectors/harnessing, and failure modes. Establish electrical engineering rigor: design reviews, schematic/layout review checklists, bring-up procedures, test fixtures, and documentation suitable for a regulated medical device program (DHF, traceability, change control). Mentor and grow the electrical function; select and manage external design partners where leverage is high. What we’re looking for Deep experience designing complex boards from blank page to stable revision, including high-speed digital and analog/mixed-signal domains. Strong schematic and layout skills (Altium/KiCad or equivalent) with real signal integrity, power integrity, grounding, and EMI/EMC instincts. Solid embedded firmware background in C/C++ (and Python for tooling): peripherals, DMA, interrupts, real-time constraints, and debugging on hardware. Practical HDL experience (VHDL/Verilog/SystemVerilog) for data acquisition, timing, and streaming interfaces. Track record of owning bring-up and debug on real hardware: scopes, logic analyzers, and disciplined root-cause analysis. Technical leadership: clear trade-offs, strong written documentation, and the ability to set

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: The Role and Impact As a GPU Platform Hardware Design Engineer, you will play a pivotal role in designing and developing high-quality GPU hardware platforms that drive innovation in high-performance computing, graphics, and visualization technologies. You will lead the design process from initial feasibility studies through board layout, tapeout, and platform power-on, ensuring robust functionality and compatibility with industry standards. Your expertise in platform-level requirements, electrical engineering applications, and system bring-up will directly contribute to delivering cutting-edge GPU systems that accelerate Intel's leadership in computing. Business group The Data Center Group (DCG) is dedicated to advancing Intel's role in powering the digital world with leading-edge technologies. Focused on delivering innovative solutions for data center and cloud environments, DCG supports high-performance computing and graphics to enable capabilities such as AI, machine learning, and advanced visualizations. As part of the GPU IP Engineering team within DCG, you'll contribute to developing GPU systems that meet the evolving demands of the industry while supporting Intel's broader mission to create world-changing technology. Key Responsibilities - Design, develop, and evaluate electronic components, PCBs, and integrated circuits for GPU hardware platforms. - Translate platform-level requirements into detailed specifications and ensure adherence throughout the design process. - Define component placement and trace routing rules to optimize board layouts for performance, power, and signal integrity. - Conduct feasibility studies, board layout, tapeout, and platform power-on activities. - Perform functionality tests and utilize tools to verify platform configurations and compatibility. - Research, develop, and validate firmware, hardwa

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures. Key Responsibilities Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunit

About the Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We're looking for an experienced Electrical Engineer to help develop the next generation of robotic systems at OpenAI. This role spans the full lifecycle of hardware development, from early concept exploration and prototyping through circuit design, component selection, PCB layout, bring-up, integration, and deployment. Engineers in this role are expected to independently drive significant hardware efforts from initial concept through deployment. You will translate ambiguous goals into concrete engineering plans, make key technical decisions, coordinate closely with cross-functional partners, and own execution through the iterations required to deliver a successful system. Many of the systems we build are still being defined. You will work closely with mechanical, firmware, software, controls, and research teams to evaluate new ideas, develop novel hardware, and integrate it into robotic platforms. Success in this role requires strong engineering judgment, comfort operating in ambiguous spaces, and the ability to balance rapid experimentation with the discipline required to build reliable and scalable systems. The ideal candidate enjoys building things from first principles and is equally comfortable evaluating a new technology, debugging a prototype on the bench, reviewing PCB layout details, and driving system integration efforts. You should be able to move quickly when appropriate, but also know when investing in robustness, simplicity, or infrastructure will create leverage for future development. This role is

Where Performance Meets Purpose Join a team that values excellence and innovation, at a company known for its iconic golf brands. At Acushnet Company, your background and experience contribute to creating the best products for dedicated golfers worldwide. Here, your performance has purpose. What You Will Be Doing The Senior Industrial Engineer plays a vital role in advancing manufacturing and distribution excellence by driving efficiency, innovation, and continuous improvement across operations. This position applies industrial engineering principles to optimize production processes, facility layouts, material handling systems, and labor utilization while supporting East Coast manufacturing and distribution teams. The role leads projects involving equipment installation, relocation, and workflow redesign; develops labor and capacity models for global golf ball manufacturing; and identifies opportunities for cost reduction, productivity gains, and operational improvements. Through data-driven analysis, reporting, and cross-functional collaboration, the Senior Industrial Engineer helps ensure safe, efficient, and scalable operations that support long-term business growth. What You Bring Bachelor’s degree in Industrial Engineering or a related Engineering discipline required Minimum of 5 years of Industrial Engineering experience Proficient in the use of computers and engineering software Ability to sit, stand, walk, crawl, and climb for extended periods as needed Proficiency with AutoCAD and Microsoft Office applications Experience with facility layout design and optimization Strong knowledge of capacity planning and capacity analysis Experience with Lean manufacturing, process simp

Manufacturing Engineer (Associate or Experienced) Company: The Boeing Company Boeing Defense, Space & Security (BDS) Laser and Electro-Optical Systems (LEOS) site is seeking an Experienced Manufacturing Engineer for our advanced development and production manufacturing team located in Albuquerque, NM. The Boeing Laser and Electro-Optical systems (LEOS) group works to develop and implement next-generation technologies and products serving a variety of commercial and military customers. Our team focuses on rapid prototyping and precision production of advanced laser and electro-optical systems that satisfy challenging product performance requirements built in accordance with aerospace (AS9100) quality standards. Position Responsibilities: Design, develop and optimize manufacturing processes and tooling approaches for complex electro-optical aerospace parts and assemblies Collaborate with design engineers to ensure manufacturability and cost-effective production Review engineering drawings and provide comments to responsible engineer Participate in Integrated Product Teams (IPTs) to integrate technical solutions across multiple disciplines Participate in supplier selection and evaluation to ensure adherence to quality and delivery standards Write content for work instructions, travelers, and standard shop procedures Utilize electronic work instruction, material control and non-conformance management systems as needed to support production Ensure compliance with aerospace industry quality standards (e.g., AS9100, J-STD) Ensure the manufacturing work instructions and special processes follow safety and environmental regulations Assist in shop layout and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr