Manufacturing Operations Co Op Placement 2027 in United States

NVIDIA has transformed computer graphics, PC gaming, and accelerated computing for more than 25 years through exceptional technology and the people who build it. In semiconductor manufacturing, our role is to enable the ecosystem, not compete within it. We partner with fabs, equipment manufacturers, and software providers to make inspection, metrology, and manufacturing intelligence dramatically faster on the NVIDIA platform. Our team builds the software that makes this possible: models, adaptation and evaluation workflows, and deployable inference capabilities that partners integrate into their own tools. We work in environments where labeled data is limited and proprietary, distributions shift across tools and fabs, production budgets are tight, and software must operate inside air-gapped facilities. We’re seeking a Principal Systems Software Engineer for Semiconductor Inspection in Santa Clara. This is a hands-on architect role: you will define the approach, build it, evaluate it, and demonstrate the results. You will work across computer vision, time-series modeling, multimodal AI, anomaly detection, model adaptation, evaluation, and production inference. Success means technology that a fab or equipment vendor can integrate, operate, and trust—not only a successful internal demonstration. What you’ll be doing: Define and prototype AI system architectures spanning optical and e-beam inspection, wafer and mask inspection, metrology, defect review, equipment signals, and process data. Advance world foundation model capabilities for semiconductor manufacturing, including vision, time-series and multimodal representation learning, model adaptation, domain transfer, and data-scarce defect understanding. Develop workflows for defect detection, classification, localization, segmentation, nuisance filtering, ADC, AD

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We're seeking a System Software Engineer to join our First-Party Hardware team. In this role, you will design, build, integrate, and validate low-level system software for the manageability and health of OpenAI's first-party AI hardware systems. You will work across BMC, Linux, firmware interfaces, automation infra, boot and recovery, hardware diagnostics, telemetry, host and platform drivers, network software interfaces, and manufacturing and fleet readiness. A major part of this role is owning the acceptance path for partner-delivered system software: defining requirements, reviewing code and artifacts, reproducing builds, building tests, pushing fixes, and producing the evidence needed for launch decisions. This role is hands-on and high-ownership. You will write and review low-level software, debug issues across hardware and software boundaries, build infra and automation to test and manage devices in lab, guide partner deliverables, build validation evidence, and help carry platforms from bring-up through production deployment. Location: San Francisco, CA (Hybrid: 3 days/week onsite) Relocation assistance available. In this role, you will: Design, develop, and maintain low-level firmware and system software for first-party AI hardware manageability, including BMC software, Redfish services, gNMI telemetry, firmware update and recovery flows, BIOS/UEFI interactions, platform drivers, and hardware diagnostics. Own integration and acceptance of partner and ve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Wet Etch Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our wet etching equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. This requisition is part of our talent pipeline for future opportunities. While we may not be actively hiring for this role today, we’re always looking to connect with gr

Chief Engineer - Patriot Advanced Capability (PAC-3) Company: The Boeing Company Boeing Defense, Space & Security (BDS) is searching for an inspiring and visionary Chief Engineer to lead groundbreaking engineering transformation for the PAC-3 Acceleration Efforts in Huntsville, AL . This pivotal role offers a unique opportunity to be at the forefront of accelerating production rates by driving innovative design for manufacturability and testability, optimizing production systems, and pioneering advanced engineering solutions that empower high-rate manufacturing success. As production demands soar, you will be the catalyst transforming engineering processes and production capabilities—ensuring we not only meet ambitious acceleration targets but also uphold Boeing’s renowned standards of quality and technical excellence. The Chief Engineer will serve as a strategic technical leader, spearheading engineering changes essential to unlocking higher production rates. You will collaborate seamlessly with engineering, manufacturing, quality, supply chain, and production teams to enhance product designs and processes geared toward efficiency, scalability, and continuous improvement. Position Responsibilities: Lead and champion engineering transformation initiatives to significantly accelerate PAC-3 production rates Drive and embed design for manufacturability (DFM), design for testability (DFT), and design for assembly (DFA) practices that enable smooth, high-rate production Partner closely with manufacturing and production teams to innovate and implement enhancements in production systems, tooling,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Life at Intel: https://jobs.intel.com/en/life-at-intel As a Yield Development Engineer, you will be at the forefront of advancing Intel's cutting-edge process technologies within our Logic Technology Development (LTD) organization. This pivotal role involves identifying root cause yield limiters and driving solutions that enhance manufacturability and yield across technology nodes. You will work within a dynamic, fast-paced environment to ensure the successful introduction of new products, process improvements, and robust methodologies to meet manufacturing goals. Your expertise will directly contribute to Intel's ability to deliver world-class semiconductor solutions and advance the future of computing. About Intel Foundry At Intel, the Foundry Technology Development (TD) unit is the driving force behind Moore's Law, enabling us to create groundbreaking technology that enriches lives globally. With over 15,000 dedicated employees, Foundry TD spearheads innovative research, develops next-generation processes and packaging technologies, and manages high-volume manufacturing in state-of-the-art facilities. Within Intel Foundry TD, our Logic Technology Development (LTD) organization is at the forefront of creating and refining each process technology node, paving the way for tomorrow's computing solutions. Your responsibilities as a Product Yield Development Eng

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Construction Engineering department is responsible for the design and construction efforts for high-tech, large-scale projects for Micron in the US. Current high-profile projects include the design and construction of two high-volume manufacturing fabs in Boise, ID1 and ID2, and a third fab in Clay, New York. We are seeking an experienced Chemical Systems Engineer to oversee the third-party design of chemical delivery and handling systems for high-tech large-scale construction projects. The Chemical Systems Engineer will manage external design firms, ensuring that chemical systems meet stringent project specifications, safety standards, and regulatory requirements. This role requires deep technical expertise in chemical systems, strong project management skills, and effective collaboration with multidisciplinary teams to deliver safe, efficient, and compliant systems for semiconductor manufacturing. Job Responsibilities: Manage third-party design firms in developing chemical delivery and handling systems, including storage, distribution, and hazardous waste management. Coordinate with external and internal stakeholders—including contractors, vendors, procurement, finance, construction and design teams—to ensure alignment with facility needs and project schedules. Ensure seamless integration of third-party designs with facility systems using Building Information Modeling (BIM) tools like Revit and Navisworks. Review capacity plan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Vision Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand leading-edge manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. Position Overview As a PCVD Process Engineer , you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a state-of-the-art fabrication environment, partnering with teams to improve yield, quality, reliability, and productivity. This role offers an outstanding opportunity to apply engineering fundamentals, build technical expertise, and develop a career in advanced semi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Idaho Semiconductor Manufacturing (Triton) LLC Identify, diagnose and resolve DRAM (Dynamic Random Access Memory) process integration related problems; Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step; Lead / participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction; Support SPC/FDC/RMS/APC. Employer will accept a Master’s degree in Mechanical Engineering, Electrical Science, Material Science, Physics, Chemical Engineering, or related field. Position requires: 1. Validate and qualify processes, tools, and materials for product introduction 2. Manage and audit material suppliers to meet quality, cost, and risk objectives 3. Support internal and external audits 4. Sustain fab healthiness with daily monitoring 5. Drive effective process technology improvement that enables best-in-class yield, quality and cost As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that b

Entry-Level Electrical / Wire Harness Assembly Technician Company: Boeing is currently seeking Entry-Level Electrical / Wire Harness Assembly Technicians in Mesa, AZ . Fabricate, assemble, modify, repair, test development, production and prototype wire harnesses and electrical assemblies. Utilize the Boeing Quality management system to identify and document nonconforming detail parts, assemblies and processes. Work with support teams including engineering, material management, and quality to improve manufacturing processes. Fabricate, assemble, modify, repair, test development, production and prototype wire harnesses and electrical assemblies. Construct wire harnesses and panels by cutting, sorting, color-coding, measuring, stripping, crimping, soldering, routing, and inspecting various lengths, types, and gauges of wire, heat-shrink, and other related materials including use of ruler, scale, and other measurement devices to interpret lengths. Operate tools and equipment such as wire strippers, crimpers, solder iron, wire identification and cutting machines, heat guns, and associated tools. Ensure all assemblies and detail parts are free of Foreign Object Debris (FOD) and non-conformance issues. Complete and maintain all required training and certifications needed to do your job efficiently. Maintain safety procedures and reports unsafe conditions to safety officials or manufacturing supervision. Knowledgeable and able to interpret blueprints, sketches, specifications and written or verbal instructions. Knowledgeable and skilled in electrical (wire harness) materials, fabrication and assembly methods and common shop practices. Knowledgeable and able to apply basic mathematics. Tr

Become a part of our caring community The Lead Technology Leadership Professional is responsible for all aspects of software or hardware product delivery and performance. The Lead Technology Leadership Professional works on problems of diverse scope and complexity ranging from moderate to substantial. The Lead Technology Leadership Professional works with design engineering and test team to drive products from design completion to volume production release. Performs various engineering tests to verify and validate product designs. Supports product evaluation and qualification on leading edge technology components. Ensures that production schedules are followed and product(s) meet specifications and quality requirements. Interacts with product engineering, quality, manufacturing and marketing teams to analyze and provide technical support to help resolve customers' product related problems/issues. Advises executives to develop functional strategies (often segment specific) on matters of significance. Exercises independent judgment and decision making on complex issues regarding job duties and related tasks, and works under minimal supervision, Uses independent judgment requiring analysis of variable factors and determining the best course of action. Use your skills to make an impact Required Qualifications Bachelor's degree 2 or more years of project leadership experience Experience with the technologies in use in the application(s) or infrastructure Experience with unit testing and mocking Ability to manage multiple tasks and deadlines with attention to detail. Ability to communicate effectively and deliver presentations to senior leaders Advanced experience leading special projects and producing metrics, measurements and trend reports Must be passionate about

Role Summary Pfizer Commercial Oncology is introducing the world to the next era of cancer care. With a growing portfolio of novel therapies, industry-leading R&D, and a goal of delivering eight breakthroughs by 2030 across major cancer types, we're translating cutting-edge science into market-shaping impact. Here, you'll partner with exceptional colleagues across scientific, medical, and manufacturing teams, backed by advanced digital and AI-enabled infrastructure and the authority to accelerate medicines from discovery to delivery. Guided by our values of courage, excellence, equity, and joy, you'll have the opportunity to stretch your skills and build a career that evolves with you—across teams, roles, and the Pfizer enterprise. Join us to make history — for patients, for their families, for the future. The Senior Oncology Account Specialist (SOAS) will have a variety of responsibilities, ranging from promoting Pfizer’s product portfolio to health care providers and specialists, to educating members of the healthcare community regarding the appropriate use of Pfizer products, to calling on accounts and organized customers to help improve patients’ experience with Pfizer products, as well as the overall quality of patient care delivered. The SOAS plays a critical role in increasing Pfizer’s brand with high-value target customers by linking an insightful assessment of the account and/or business landscape with a strong understanding of Pfizer’s products and resources. BASIC QUALIFICATIONS BA/BS Degree from an accredited institution BA/BS Degree from an accredited institution OR an associate’s degree with 8+ years of experience; OR a high school diploma (or equivalent) with 10+ years of relevant experience. Ability to travel domestically and stay overnight as necessary Valid US driver’s license and driving record in compliance with company

What You Will Achieve A Senior Scientist (R 4 ) position is available in the Upstream Process Development group within the Bioprocess R&D organization. The successful applicant will join a team of scientists and engineers focused on developing and optimizing manufacturing processes for recombinant proteins and other modalities for early- and late-phase human clinical trials. In this role, the candidate will be responsible for designing and executing laboratory experiments in bench-top bioreactors and associated scale-down equipment with the goal of developing robust, scalable, and high productivity processes. The work will also involve collaborating with pilot, clinical, and commercial production facilities to ensure accurate technology transfer, successful large-scale production and associated regulatory filing activities. The candidate may also be involved in cutting edge technology development projects that seek to improve production processes and control strategies leveraging various process analytical technologies. How You Will Achieve It Design and execute