Manufacturing Operations Co Op Placement 2027 in United States

ROLE SUMMARY Pfizer Commercial Oncology is introducing the world to the next era of cancer care. With a growing portfolio of novel therapies, industry-leading R&D, and a goal of delivering eight breakthroughs by 2030 across major cancer types, we're translating cutting-edge science into market-shaping impact. Here, you'll partner with exceptional colleagues across scientific, medical, and manufacturing teams, backed by advanced digital and AI-enabled infrastructure and the authority to accelerate medicines from discovery to delivery. Guided by our values of courage, excellence, equity, and joy, you'll have the opportunity to stretch your skills and build a career that evolves with you—across teams, roles, and the Pfizer enterprise. Join us to make history — for patients, for their families, for the future. At Pfizer Oncology, we are committed to “Outdo Cancer” by advancing transformative medicines wherever we can make a profound difference in the lives of patients. Today, Pfizer Oncology has an industry leading pipeline that includes the combined legacy Pfizer and Seagen portfolio across breast, genitourinary (GU) including both prostate and bladder, hematology-oncology and thoracic therapeutic areas. The primary purpose of this position will be to provide comprehensive day-to-day administrative support to the US Prostate Franchise Lead and to support the overall Franchise business. The Administrative Assistant will report to the US Prostate Vice President. In this role, the Administrative Assistant will be responsible for (but not limited to) heavy calendar management, coordination of meetings and events, development of agendas and meeting reports, slide development for select meetings, and requests and assembly of briefing materials, arranging travel and expense report preparation. As a working professional, he/she will be expected to handle tasks independently and in a proactive manner. <

Job Requisition ID # 26WD101260 L'affichage de poste en français suivra / The French job posting follows. 26WD101260, Senior Manager, Product Position Overview Autodesk's Technical Advisory organization helps the world's leading architecture, engineering, construction, manufacturing, and media companies get the most from their Autodesk investments. We are transforming this expertise from traditional consulting into a digital-first platform strategy — and the Senior Manager, Product Management will define what that platform becomes. Reporting to the Director of Platform & Productization within Global Delivery & Solutions, you will lead a product management team responsible for Autodesk's digital consulting platform. Your portfolio spans platform capabilities, industry-specific solutions, consulting tools, and packaged services. In the first year, you will launch and land our first digital consulting offering, validating our new consulting model with paying customers. You will establish product management discipline for a maturing capability — discovery practices, prioritization frameworks, go-to-market coordination — while simultaneously delivering product that proves the model works. You own the product strategy and roadmap. You will partner with Content & Knowledge on knowledge readiness and publication decisions, with Architecture and Engineering on technical feasibility and delivery sequencing, and with GTM on market positioning and launch execution. The role sits at the center of the organization, and yo

Job Title Senior Supplier Quality Engineer Job Description The Senior Supplier Quality Engineer ensures supplier quality, compliance, and process capability across sustaining activities within Philips’ Image Guided Therapy Devices business. Your role: Serves as the primary Supplier Quality Engineering point of contact for the Colorado Springs, CO facility, providing on-site support ensuring timely alignment with site Quality, Manufacturing, R&D, Sustaining Engineering, Procurement, and supplier stakeholders. Leads and owns MSA, PFMEA, Control Plan, SPC, PV&V, FAI, IQ/OQ/PQ, and related APQP / PPAP activities to ensure supplier process capability, validation readiness, and compliance with quality requirements. Leads APQP / PPAP execution for supplier transfers, supplier changes, SICRs, and sustaining projects supporting the Fremont, CA manufacturing facility. Facilitates Design for Excellence collaboration between R&D, Sustaining Engineering, Manufacturing, and suppliers to improve design quality, manufacturability, supplier process robustness, and long-term product performance. Ensures Critical to Quality characteristics are clearly defined, flowed down to suppliers, validated through appropriate controls, and maintained throughout production. Leads supplier audits, including initial qualification, for-cause, and follow-up audits, to assess supplier compliance with applicable quality system requirements, regulatory expectations, process controls, and supplier agreement obligations. Leads supplier qualification activities for addition to the Approved Supplier List, including supplier capability assessment, quality system maturity evaluation, technical readiness, risk classification, approval documentation, and onboarding completion. Leads supplier-related non-conformance investigations, including defect

Job Details: Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation. Key Responsibilities Design, develop, and debug Fill components of Process Design Kits (PDKs), Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. Automate workflows to enhance efficiency, accuracy, and deployment across design teams. Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment.

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Quality Engineer (Associate or Experienced) Company: The Boeing Company Boeing Defense, Space & Security (BDS) has an exciting opportunity for a Quality Engineer to join our dynamic team in Berkeley, MO. Position Responsibilities: Represents Quality function on team activities to integrate contractual and Boeing Quality Management System requirements into all aspects of proposals and program processes and documentation Provides Quality interpretation of requirements Develops quality metrics, design and production certification plans for small programs to ensure compliance with contractual, Company and regulatory requirements Conducts capability assessments and process validations to support supplier selection activities Participates in various reviews to ensure quality attributes are incorporated into product designs Performs analysis, tests and process audits to ensure manufacturing and test readiness Provides material review dispositions for non-conformances Conducts RCCA and CAPA activities Analyzes non-conformance trends to evaluate effectiveness of corrective actions Recommends corrective actions to address non-conformances Performs benchmarking and other forms of analysis to ensure specified processes capability levels are achieved Supports Advanced Product Quality Planning (APQP) activities Works under general direction Basic Qualifications (Required Skills/Experience): Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer scien

Distinguished Technologist - Principal Architect, Platform Security and Firmware Systems Description - HP is seeking a senior technical leader to serve as a lead architect for hardware rooted Platform Root of Trust for HP's commercial PC platform. In this role, you will be responsible for envisioning, defining, and driving the architecture of hardware, firmware, software, and cloud-integrated security capabilities that protect HP commercial PCs from current and emerging threats. You will also work across the hardware and security architecture teams, collaborate with HP's Security Research Labs, Firmware (BIOS) team, our security business that creates and deploys industry leading enterprise security and manageability solutions, product management, manufacturing, supply chain, customer enablement, and field organizations to create cohesive system solutions that deliver unique customer value. This position requires deep expertise in embedded systems, platform firmware, hardware, security, device manageability, and PC system architecture. The role also requires the ability to translate complex technical capabilities into customer-relevant value propositions and to influence internal and external stakeholders without relying solely on formal authority. Responsibilities Serve as principal architect for HP Endpoint Security Controller roadmap, associated hardware and firmware based capabilities, cryptographic identity, attestation, secure communication, event logging, and future controller generations. Define and evolve HP Sure Start architecture and related firmware resilience capabilities, including hardware-enforced firmware authenticity, recovery, update, and protection mechanisms. Drive secure BIOS and firmware configuration management strategies, including HP Sure Admin ecosystem capabilities, key management, zero-touch provision

NVIDIA’s Silicon Co-Design Group is the team that gets every GPU, SoC, and CPU silicon program from first power-on to high-volume production. We are hiring a Senior Manager to lead our Test, Manufacturability, Reliability & Quality (TMRQ) organization. This is not a coordination role . Your work decides if a product can be built at scale and trusted in the field. These include production test development (SLT, BLT), control run flow, system reliability stress (HTOL), platform- and board-level manufacturing issue closure, and field diagnostic test development. You lead a team of individual contributors and a first-line manager at the layer where silicon, platform, and software collide with manufacturing reality. Decisions you make show up in yield curves, production ramp , and customer escapes. You are the leader the program turns to when a build is stuck, a control run is fallout-heavy, or a field return points back at silicon . The exceptional hire also uses AI deliberately — with demonstrated workflow impact and the judgment to know where it compresses real work and where it introduces risk. What you will be doing: Keep programs moving. Own the technical execution and velocity of SLT, BLT, Board/Chip/Rack CR, and system reliability stress (HTOL) across every GPU, SoC, and CPU silicon program. Close the hardest multi-functional failures. Resolve Vmin and binning escapes, performance shortfalls, and power anomalies by driving root-cause across design, methodology, DFT, ATE, package, software/firmware, and manufacturing — and own the WARs and productized fixes through to confirmation. Give leadership the clarity to act. Convert raw integration signals — CR fallout, BLT/SLT yield, SHTOL/CHTOL data, RMA trends, customer escalations — into decision-ready options that enable executive leadership to act with confidence on POR, QS/PS gates, a

Job Title Material Handler 2 Job Description The Material Handler 2 will assist group leads prepare the line for production; they will ensure the correct components have been issued for the work order based on the BOM. The Material Handler will keep the line supplied with components and remove waste from the line as needed. Your role: Assist the group lead manage the workflow within the assigned manufacturing cell to achieve the daily production objective. Supervise workflow, move full pallets of finished goods to the proper location and monitor inventory of components to insure the line has enough components to complete the order. Interface with warehouse personnel to ensure all components are correct and staged in the appropriate area to avoid delays in production. Maintain the all the materials needed to complete the work order and take appropriate action when it's not. You're the right fit if: You have a high school diploma, GED or equivalent. No experience required, preferably knowledgeable on any of the following manufacturing production e

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom