Module Maintenance Solar Manufacturing in United States

Job Details: Job Description: This is a central requisition for all Ocotillo Technology Fabrication (OTF) functional areas. Successful candidates will be aligned to the areas that match best with factory needs. Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. Our high-volume manufacturing facility in Chandler, Arizona is looking for amazing talent. Join and help us create the next generation of technologies that will shape the future for decades to come. The Ocotillo Technology Fabrication (OTF) Module Engineer role is multifaceted. The ideal candidate will have a passion for instrumentation and equipment with the goal of developing a robust manufacturable process module. This is a central requisition for all functional areas: Litho, Wet Etch, Dry Etch, Diffusion, Implant, Planar and Thin Films. Successful candidates will be aligned to the areas that match best with factory needs. As an OTF Module Engineer you will play an important role in the OTF engineering team. You will be responsible for owning all aspects of one or more of the factory's 300mm toolsets. Your sustaining responsibilities will include the safety and cleanliness of your area and ensuring Copy Exactly for your toolset. You will also be expected to review the relevant control charts and tool output daily and ensure your toolset and layers remain excursion free. You will be responsible for delivering Model of Record (MOR) availability and achieving 100 percent matching for all relevant operations. For new technology start-ups, you will be responsible for tool installations, conversions, and qualifications; and sustained matching performance. You will be expected to drive continuous improvement in the health and matching of your to

Module Development Engineer — US, Oregon, Hillsboro. Apply via Workday.

Module Equipment Technician - Intel Contract Employee — US, New Mexico, Albuquerque. Apply via Workday.

Packaging Module Development Engineer — US, Arizona, Phoenix. Apply via Workday.

Packaging Module Development Engineer — US, Arizona, Phoenix. Apply via Workday.

Job Details: Job Description: Note: This role requires regular onsite presence to perform essential job responsibilities. This position drives technology development and enablement for both high-volume manufacturing and future process technologies. Responsibilities include providing process integration and equipment solutions, conducting feasibility studies to meet device performance requirements, and leading the design and development of advanced manufacturing processes. The role involves material selection, parameter optimization, metrology, equipment engineering, and system design to enable new product architectures and functional requirements. The successful candidate will lead pathfinding activities that support process and hardware development for next-generation manufacturing technologies and will contribute to technology roadmaps that enable future product innovation. The role also includes identifying and implementing equipment and process improvements to enhance manufacturing efficiency, optimize production output, and improve operational performance. Qualifications: Minimum Qualifications Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 6+ years of semiconductor industry experience , primarily in dry etch process development. Bachelor's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related STEM field, with 9+ years of semiconductor industry experience , primarily in dry etch process development. 3+ years of experience collaborating with equipment suppliers (e.g., Lam Research, TEL, Applied Materials, Hit

APTD SWA Module Engineer On-Shift (Day shift) — US, Arizona, Phoenix. Apply via Workday.

Job Details: Job Description: The Thin Films Senior Process Engineer will support PVD, CVD, and ALD technologies for dielectric and metal thin-film deposition in a high-volume manufacturing environment. Key Responsibilities Apply advanced expertise in thin-film deposition processes to drive continuous improvement in process performance, sustainment, and technology development. Collaborate with upstream and downstream partners to deliver manufacturing improvements through strong cross-functional engagement and stakeholder management. Own manufacturing processes and/or equipment, ensuring achievement of key performance indicators (KPIs) including safety, quality, cost, productivity, defect reduction, and yield improvement. Develop and execute strategic plans for complex projects, coordinating timelines and dependencies across multiple teams and initiatives. Support manufacturing capacity expansion and technology transfer activities to enable successful ramp-to-volume production. Partner with equipment vendors and cross-functional stakeholders to troubleshoot technical challenges, improve tool performance, and enhance operational efficiency. Lead process development initiatives that support current and next-generation high-volume manufacturing technologies. Design and optimize excursion prevention and detection systems to strengthen process control and minimize manufacturing risk. Lead equipment installation, conversion, qualification, and readiness activities during factory ramps, ensuring all tools are deployed safely, on schedule, and in compliance with quality and manufacturing standards. Drive root cause analysis and implement corrective actions to resolve process and equipment-related issues while improving overall manufacturing stability and performance. <p st

Ocotillo Technology Fabrication Dry Etch Module Team Leader — US, Arizona, Phoenix. Apply via Workday.

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Job Details: Job Description: Contributes to module process development, process integration flows, and equipment configuration for manufacturing modules. Supports yield improvement initiatives by analyzing defect data, conducting experiments, and assisting in risk assessments. Electrcial characterization of transistors and analysis of data to help yield or improved process conditions. Collaborates with engineering teams to optimize metrology strategies and troubleshoot process flow issues. Contributes to continuous improvement efforts in high volume manufacturing environments. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum qualifications: Must be pursuing a PhD degree in a hard science discipline such as Electrical Engineering, Physics, Materials Science.

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

The Sr. Enterprise Applications Analyst, Order Management owns the health and evolution of TaylorMade's Oracle EBS Order-to-Cash platform across global operations. This role translates business requirements into scalable O2C solutions, partnering with Sales, Operations, Finance, and Supply Chain to keep systems aligned with commercial goals. Reports to the Solution Architect, ERP Applications. Essential Functions and Key Responsibilities Configure and maintain Oracle OM module setups: order types, transaction types, workflow assignments, hold definitions, pricing rules, and shipping parameters. Deliver end-to-end O2C support spanning Order Entry, Pricing, Scheduling, Shipping Execution, and Receivables integration, including inbound and outbound EDI order flows. Gather and document business requirements using Oracle AIM methodology; translate into functional specifications for technical development. Analyze current-state processes, quantify gaps, and design Oracle-standard solutions that deliver measurable efficiency gains. Develop and execute test plans for functional, SIT, and regression scenarios; perform root cause analysis on production defects. Support Oracle EBS integrations with third-party systems including WMS, 3PL, and EDI platforms across O2C processes. Create and maintain functional design documents, configuration workbooks, and end-user training materials. Knowledge and Skills Requirements Deep functional expertise across Oracle EBS O2C modules: Order Management, Advanced Pricing, Configurator, ATP/Global Order Promising, Shipping Execution, Inventory, and Receivables. Functional understanding of RICEW object design and O2C-adjacent integration architecture. Strong analytical and problem-solving skills with attention to detail. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en

Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. Job Purpose The Senior Manager, Manufacturing Engineering owns the manufacturing engineering function across Hyliion's Cedar Park, TX headquarters and primary production site and its Milford, OH R&D operations. The role is the bridge between the engineering design of the KARNO Power Module and the scalable, repeatable production system required for commercial ramp, defining and driving the processes, tooling, documentation, and infrastructure that transform KARNO from a highly engineered prototype into a manufacturable product. This is a player-coach role: the incumbent builds and leads a team of manufacturing engineers while remaining personally hands-on in the most challenging production problems. AI at Hyliion At Hyliion, AI is core to how we work. We equip every team member with leading AI tools and count on you to use them — to move faster, solve harder problems, and help us realize the full potential of KARNO technology for the world. Duties and Responsibilities Productionization: translate engineering designs into manufacturable, repeatable, and scalable production configurations across both sites, aligned to the commercial ramp roadmap. Tooling and process development: design, develop, and qualify manufacturing tooling, fixtures, and processes that support quality, efficiency, and volume scalability. Manufacturing documentation: own PFMEAs, control plans, work instructions, SOPs, and MBOMs, keeping them accurate, current, and accessible to the production floor. Lean and material flow: define and implement standard work, material flow, and handling strategies that increase throughput, reduce waste, and prepare the factory for