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Airtable helps organizations build the applications and workflows they need to run their most important business processes, without being constrained by off-the-shelf software. Its flexible platform combines a relational database, custom applications, automations, and AI, giving teams the building blocks to create solutions around the way they actually work. Just like Lego blocks, what our customers can build with Airtable is virtually limitless. That flexibility is why more than 500,000 organizations, including 80% of the Fortune 100, use Airtable to power critical work across their businesses. We’re builders at heart, and we’re looking for builders who want to expand what’s possible in Airtable and what the world can build with it. We sell a powerful, flexible product to organizations with very different problems, teams, and ways of working. That means the best opportunities rarely come from following a script. We need someone who finds that energizing—someone curious enough to understand how a business works, persistent enough to earn a prospect’s attention, and thoughtful enough to make every interaction relevant. If you’re excited by the challenge of finding the right accounts, understanding what matters to them, and figuring out how to earn a conversation, you’ll thrive here. You’ll have the freedom to experiment, learn quickly from what works and what doesn’t, and build the skills to become an exceptional salesperson. Please note, this is a hybrid position based in Austin with the expectation of 3 days a week in office. What you'll do Run a hybrid pipeline motion: act on product-led signals early in the week, then shift into outbound prospecting for the bulk of your time. Qualify prospects through calls, emails, and social media (LinkedIn) to generate sales-ready meetings for Account Executives. Partner with AEs on our larger, more strategic accounts, shaping territory plans and outreach. Build, test, and iterate on outbound strategies, using AI tools t

Position Overview As a Solutions Engineer at Diligent, you will partner closely with Sales to help organizations understand how our platform can transform the way they identify and mitigate risk, perform audits, strengthen controls, and operationalize broader GRC programs. You’ll independently lead the SE workstream on small to mid-sized opportunities, while partnering with more senior Solutions Engineers on complex, multi-pillar deals, acting as a trusted partner to customer stakeholders and helping translate Risk & Audit and broader GRC challenges into clear, compelling solutions that drive business value. If you enjoy combining domain expertise, storytelling, solution design, and customer interaction and are looking to build your career in a commercial, customer-facing environment, this is a strong next step. Key Responsibilities Customer & Commercial Partnership Partner with Sales to lead the full pre-sales lifecycle for small to mid-sized opportunities, helping customers understand how Diligent solves real-world risk, audit, and control management challenges. Deliver independent, well-prepared, tailored software demonstrations that clearly articulate business value, while seeking coaching and feedback from senior team members for continuous improvement. Engage confidently with stakeholders across Internal Audit, Risk, Compliance, IT, Controls, and Governance teams, owning day-to-day customer conversations and escalating to senior SEs for high-risk or complex topics as needed. Translate customer pain points into clear solution narratives, including outcomes and success criteria, to support deal progression and closure. Own the technical win for small to mid-sized opportunities, and contribute to the technical strategy on larger, multi-stakeholder deals in partnership with senior SEs. Solution Design & Thought Leadership Design and present solu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Job Details: Job Description: Ocotillo Technology Fabrication Yield is looking for Integration Technicians with a strong computing background and capabilities to support all Ocotillo Technology Fabrication platforms and beyond technologies. The candidate will work closely with a team of Integration Technicians to execute experiments/pilots, develop process flows and lot plans for new product introductions, and support taskforces. As a Process Integration and Yield Technician, you will play a critical role in Intel's high-tech manufacturing process, your contributions will directly impact Intel's innovation, enabling the delivery of advanced technologies that power the future of computing. This is an exciting opportunity to grow your technical expertise, work alongside engineering teams, and be part of a collaborative environment where your skills make a tangible difference. The Process Integration and Yield Technician will be responsible for but not limited to: Sustaining factory floors with lot plan/operation/route/process flow checks/rework/critical queue time edits, shipping errors, automation errors, process flow adjustments, wafer shipments, and scraps. Delivering lot plan owner training to the Ocotillo Technology Fabrication organization Collaborate with integration engineers to gather data needed for lot disposition Respond to and contain discrepant material in the fab Conduct engineering tests and detailed experimental testing to collect data or assist in research work related to integration, process, and yield. Provide pilot lot set up and cross site shipment support. Process change support and implementation via global flow changes, global route changes, and lot conversions The ideal candidate should exhibit the following behavioral traits: Self-starter an

Job Details: Job Description: The Role and Impact As a SoC Design Verification Engineer, you will play a pivotal role in ensuring that Intel's complex System-on-Chip (SoC) designs meet functional specifications and deliver high-quality performance. You will design scalable and reusable verification plans, develop test environments, and execute tests to uncover issues and improve functionality. Your contributions will directly enhance Intel's product quality and ensure optimal performance in presilicon development. Business Group You will be joining Intel's cutting-edge product development group, a team focused on designing and verifying advanced semiconductor solutions. This group is at the forefront of innovation, delivering high-quality, scalable products that drive Intel's leadership in technology and performance. By contributing your skills here, you will help shape the future of computing and enable groundbreaking advancements in the industry. Key Responsibilities - Define and develop scalable and reusable block, subsystem, and SoC verification plans. - Create test benches and verification environments that align with microarchitecture specifications. - Execute verification plans, including emulation and system simulation models, to ensure design functionality and uncover bugs. - Debug and root cause issues in presilicon environments, implementing corrective measures to address failures. - Collaborate with architects, RTL developers, postsilicon teams, and physical design teams to improve verification of complex architectural features. - Document and maintain test plans, driving technical reviews with design and architecture teams. - Integrate security coverage activities within test plans, including regression and debug tests. - Maintain and improve

Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. Join us as a Manufacturing Failure Analysis Engineer, where you'll play a pivotal role in ensuring the quality and reliability of Intel's next-generation silicon, product, package, platforms, and board process technologies. You will identify failures, conduct root cause analyses, and develop innovative methodologies to enhance performance and yield. By leveraging your expertise, you'll contribute to driving manufacturing innovation and supporting the delivery of world-class products. The ideal candidate brings hands-on experience in probing, strong understanding of device behavior, and the ability to independently execute complex debug workflows. Business group You will be part of Intel's manufacturing organization, a cornerstone of our operations that focuses on advancing semiconductor process technologies and ensuring product excellence. This team is dedicated to delivering high-quality solutions that support Intel's broader mission to create groundbreaking technologies that power the future. Key Responsibilities: • Operate general failure analysis tools in the labs, such as TEM, SEM, optical scopes. • Perform electrical probing an

Job Details: Job Description: As a Packaging Module Development Engineer, you will play a pivotal role in the development and optimization of Intel's assembly media and collaterals. Your daily work will involve designing innovative solutions to improve media and collateral reliability, manufacturability, and cost efficiency. Your contributions will directly support Intel's cutting-edge assembly packaging technology roadmap, driving advancements in semiconductor manufacturing processes. Business Group You will be part of Intel Corporation's Media Development organization, a team dedicated to advancing packaging technologies and manufacturing processes. This group operates at the forefront of innovation, enabling high-performance products and driving Intel's leadership in the semiconductor industry. By joining this collaborative environment, you will contribute to Intel's broader goals of delivering transformative technology solutions. Key Responsibilities Develop and optimize media and collaterals to meet quality, reliability, cost, yield, and productivity targets. Design and implement new media and collateral solutions, leveraging statistical methods like Design of Experiments (DOE) and Statistical Process Control (SPC). Conduct evaluations of media and collaterals under simulated field conditions, including tests for heat, humidity, temperature cycling, and dynamic forces. Lead initiatives to identify and mitigate media and collateral quality and reliability risks, utilizing innovative tools and methods. Provide technical consultation on media and collateral challenges and deliver solutions that align with operational and technology milestones. Document technical improvements and innovations through research papers and presentations. <p styl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This Notice is provided as a result of the filing of applications for permanent alien labor certification for the positions noted below. Any person may provide documentary evidence bearing on an application to the Certifying Officer, U.S. Department of Labor, Employment and Training Administration, Office of Foreign Labor Certification, 200 Constitution Avenue NW, Room N–5311, Washington, DC 20210. Employer: Micron Technology, Inc. Job Title: Firmware Engineer Job Requisition: JR42883 Job Location: Longmont, Colorado Job Type: Full Time Rate of Pay: $100,000 to $254,000 Duties: Develop high-performance controller firmware for innovative volatile and non-volatile memory systems. Assist in evaluating, designing, building, bench testing, debugging, and failure analyzing firmware for new high-performance memory controllers and Solid State Drives that will increase performance, while reducing power, latency and SoC (System on Chip) complexity for the target markets. Work closely with system test engineers, system failure analysis engineers, firmware engineers, firmware test engineers, system hardware design engineers, product engineers, memory design engineers, firmware tools developers, and production engineers to solve cross-functional product development issues. Validate customer requirements and perform failure analysis on FW related issues. Develop structure

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Idaho Semiconductor Manufacturing (Triton) LLC Identify, diagnose and resolve DRAM (Dynamic Random Access Memory) process integration related problems; Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step; Lead / participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction; Support SPC/FDC/RMS/APC. Employer will accept a Master’s degree in Mechanical Engineering, Electrical Science, Material Science, Physics, Chemical Engineering, or related field. Position requires: 1. Validate and qualify processes, tools, and materials for product introduction 2. Manage and audit material suppliers to meet quality, cost, and risk objectives 3. Support internal and external audits 4. Sustain fab healthiness with daily monitoring 5. Drive effective process technology improvement that enables best-in-class yield, quality and cost As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that b

Senior Program Manager (Level M) Company: The Boeing Company Boeing’s Defense, Space & Security (BDS) Experimental Systems Group (ESG) team, in Seal Beach , CA is seeking a Senior Program Manager (Level M) with demonstrated strong project management abilities and Agile software development experience to join our dynamic team. ESG is a rich portfolio of state-of-the-art space products, advanced small satellites, and multi-domain technology development efforts. One of our products, the X-37B Orbital Transfer Vehicle, is the world’s first fully autonomous reusable spaceplane. Our team works in a collaborative development environment while delivering new capabilities to customers rapidly and affordably. The selected candidate will serve as the program manager for a proprietary software development project within the Experimental Systems Group (ESG) portfolio. Position Responsibilities: Team Leadership : Manage, develop, and motivate programmatic team. Maintain team organization and staffing plan with clear roles, responsibilities, and authorities. Develop and maintain relationships with customers, suppliers, stakeholders, peers, partners, and management Program Performance – Develop, maintain, track, and update schedules and earned value baselines of program statement of work. Own program contractual responsibilities starting at delivery of incremental capability through sell off and verification. Implement Program Management Best Practices to track and measure performance to plan. Organize independent cost estimates to ensure cost realism, validating assumptions (or risk) for technology maturity, reuse, and/or cost-sharing. Build a dat

Audiovisual Technician / Installer (Associate, Experienced or Senior) Company: The Boeing Company Boeing Defense, Space & Security (BDS) / Intelligence Systems (IS) is looking for a motivated and self-starting Audiovisual Technician / Installer (Associate, Experienced or Senior) to join our team based in Herndon, VA . Position Responsibilities: Survey, plan, design, configure, and test multi-classification AV solutions tailored for government customers. Create custom audiovisual system designs, including DSP layouts and system configurations Participate in customer stakeholder meetings to gather, document, and validate system requirements. Research, evaluate, and recommend technology solutions to address customer needs Prepare detailed system engineering documentation such as signal flow diagrams, line diagrams, bills of materials, rack elevations, and cable plant layouts Continuously enhance industry knowledge and technical skills through ongoing training, certifications, and review of relevant trade publications Support and lead onsite AV system installations and configuration phases Collaborate closely with customer facility teams, subcontractors, and vendors during installation as needed Assist in developing end-user training materials, as well as operations and maintenance plans Conduct thorough in-house testing and perform on-site system commissioning at client locations Basic Qualifications (Required Skills/Experience): This position requires an active Top Secret/SCI U.S. Security Clearance with an active Counterintelligence Polygraph (U.S. Citizenship Required) (A U.S. Security Clearance that