Senior Techops Senior Techops Engineer in United States

About Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a TPM to drive development and integration of a range of sensor systems for robotics. This role will drive cross-functional alignment across requirements, engineering design, integration, validation, manufacturing, supply chain, and release processes, helping turn complex sensor-system needs into clear plans, decisions, and milestones. Location and in-person expectations: This role is based in San Francisco, CA and requires in-person presence 4 days a week. In this role you will: Drive requirements alignment across engineering design, integration, testing, and validation for camera modules, LiDAR, IMUs, RADAR, proximity sensors, audio components and the systems they interact with. Coordinate the integration of modules including electrical, mechanical, harnessing, and software interfaces with the full robotic system with deep understanding of timelines to drive the respective PCBAs, enclosures, build and test fixtures, connectors and cables. Establish effective cadences for technical reviews, BOM readiness, change management, production releases, approvals, and decision tracking. Align harnesses, fasteners, assembly fixtures, test fixtures, and documentation so cross-functional teams can execute against a clear plan. Lead validation planning around functional, reliability, NVH failure modes, including testing needs, schedules, and exit criteria. Partner with manufacturing and supply chain to manage handoffs, lead times, dependencies, and production readiness. Drive tradeoff decisions across cost, qua

What you’ll do Act as the in-house electrical lead for Midjourney Medical: own the electrical architecture of the scanner and the technical direction for all board-level design. Own complex board design end-to-end: architecture, schematic capture, layout (high-speed digital, analog/mixed-signal, power), DFM/DFT, fabrication and assembly vendor management, bring-up, and revision control. Write firmware for embedded targets (MCU/SoC): drivers, real-time control loops, safety-relevant logic, bootloaders, and field update paths. Audit and update HDL (FPGA) code for high-throughput data acquisition, timing/synchronization, triggering, and pre-processing of ultrasound and sensor data streams. Define electrical interfaces and data contracts with software, recon/ML and mechanical teams: timing budgets, clocking/sync, signal integrity, connectors/harnessing, and failure modes. Establish electrical engineering rigor: design reviews, schematic/layout review checklists, bring-up procedures, test fixtures, and documentation suitable for a regulated medical device program (DHF, traceability, change control). Mentor and grow the electrical function; select and manage external design partners where leverage is high. What we’re looking for Deep experience designing complex boards from blank page to stable revision, including high-speed digital and analog/mixed-signal domains. Strong schematic and layout skills (Altium/KiCad or equivalent) with real signal integrity, power integrity, grounding, and EMI/EMC instincts. Solid embedded firmware background in C/C++ (and Python for tooling): peripherals, DMA, interrupts, real-time constraints, and debugging on hardware. Practical HDL experience (VHDL/Verilog/SystemVerilog) for data acquisition, timing, and streaming interfaces. Track record of owning bring-up and debug on real hardware: scopes, logic analyzers, and disciplined root-cause analysis. Technical leadership: clear trade-offs, strong written documentation, and the ability to set

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a Mechanical Engineer to design and prototype novel tactile, proprioceptive and force sensor solutions. You will work closely with experienced engineers and cross-functional partners to set functional requirements, develop and iterate on hardware to meet program expectations. This role is aimed at candidates with strong fundamentals in mechanical system design and robotic sensing including tactile sensors, force sensing and position sensing. You will contribute to real hardware programs moving from prototype through early production. You will lead both new sensor subsystem development and ongoing improvements to existing systems based on testing, field performance, and manufacturing feedback. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will Lead the design and iteration of mechanical subsystems, including tactile sensors, load cells, force torque sensors and joint encoders. Create and maintain CAD models, assemblies, and drawings with appropriate tolerancing and documentation. Build and test prototypes, supporting debugging of mechanical issues such as fit, alignment, friction, and wear. Assist in developing test methods and executing validation to evaluate performance, durability, calibration and failure modes. Work with cross-functional teams to integrate mechanical components with sensors, actuators, and control systems. Support transition of designs from prototype to manufacturable assemblies, incorporating DFM and DFA considerations. Collaborate with manufact

What you’ll do Be the generalist EE for the scanner system: integration, bring-up, debugging, and making the electrical side of the device reliable and serviceable. Own ultrasound experimentations that feeds the image reconstruction team Design and execute experiment setups for transducer characterization (element sensitivity, bandwidth, cross-talk mapping, beam profile measurements) and ex vivo / phantom clinical testing. Acquire, process, and analyze RF and baseband signals for data quality assessment and benchmarking. Design simple boards and adapters as needed (monitoring, power/safety, interface/conditioning), and take them from prototype through a stable revision. Prototype quickly, then harden what works: wiring/harnessing, grounding, safety interlocks, and reliable integration across subsystems. Own practical test setups and documentation (fixtures, scripts, procedures) that make experiments repeatable and results comparable over time. What we’re looking for Strong hands-on EE background with experience building, debugging, and iterating on real systems in the lab. Solid understanding of signal processing fundamentals — knows what to measure, how to condition and digitize it, and how to evaluate signal quality in the context of an imaging system (SNR, bandwidth, dynamic range, artifacts). Comfortable spanning system integration + occasional design work (schematics/layout reviews or light PCB design) in a fast-moving environment. Ability to work at the boundary between hardware and algorithms: measure reality, communicate constraints, and help close gaps vs simulation. High agency and practicality: able to set up experiments, get trustworthy data, and unblock others on a lean team. Useful experience Analog/mixed-signal, or high-speed data capture experience; strong instincts for instrumentation and noise/debugging. Ultrasound or acoustic sensor handling: hydrophone calibration and field mapping, transducer impedance characterization, element-level sensitivity

About the Team The Consumer Products team at OpenAI builds end-to-end hardware and software systems that bring AI into the physical world. We work at the intersection of custom silicon, embedded systems, operating systems, and cloud services to deliver reliable, production-ready devices at scale. Within Consumer Products, the camera stack is a critical sensing component. The team partners closely with electrical engineering, silicon vendors, systems, and higher-level perception and product teams to bring up new hardware, stabilize capture pipelines, and ensure camera systems are robust, debuggable, and ready for real-world deployment. This work spans early prototypes through production, with a strong emphasis on correctness, repeatability, and long-term reliability. About the Role As a Camera Firmware Engineer, you will own low-level camera enablement on custom hardware—from early board bring-up through stable production capture. You will develop and maintain the firmware and software that makes camera sensors reliable, controllable, and debuggable, forming the foundation for higher-level camera pipelines and product features. This role is highly hands-on and systems-oriented. You will work close to the hardware, diagnose real-world timing and integration issues, and build tooling that accelerates iteration across the entire camera stack. This role is based in San Francisco, CA. We follow a hybrid work model with four days per week in the office and offer relocation assistance to new employees. In This Role, You Will Bring up new camera sensors and modules on prototype and production boards, including link stability, sensor control, and correct power, reset, and clock sequencing. Develop and maintain low-level camera software, including sensor drivers, board configuration, and camera subsystem integration across hardware revisions. Enable and validate core capture paths for development and production, including RAW capture for debugging, still capture, and hardware-