About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction
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Silicon Packaging Design Engineer in San Francisco
50 active opportunities · Updated October 2026
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About the Team The Consumer Devices team at OpenAI builds end-to-end hardware and software systems that bring AI into the physical world. We work at the intersection of custom silicon, embedded systems, operating systems, cloud services, mechanical engineering, electrical engineering, and product design to deliver reliable, production-ready devices at scale. Within Consumer Devices, Hardware Engineering eXperience, or HEX, is a new bootstrapped team building the environments, applications, compute, product-data systems, and workflows that let hardware engineers do their work without needing to troubleshoot the machinery underneath. HEX owns virtual engineering environments, HPC/GPU compute, storage, networking, licensing, MCAD/ECAD/CAE applications, PLM, product data, automation, validation, and support as one connected system. About the Role As a Staff PLM & Engineering Applications Engineer, you will be one of the first technical builders of HEX and the primary counterpart to the HEX lead. You will own the engineering-application and product-data side of the hardware engineering experience, with an initial focus on NX, Teamcenter, licensing, parts import, integrations, packaging, validation, and user workflows. This is not a traditional Teamcenter administration role and not a Corporate IT application-support role. You will take complex, fragile workflows and turn them into reliable engineering systems. This role is highly hands-on and systems-oriented. You will not inherit a mature environment and support queue. You will help build a fresh one, replacing manual setup guides, tribal knowledge, repeated support issues, and team handoffs with tested automation and reliable workflows. In This Role, You Will Own the technical architecture, deployment, configuration, integration, validation, and long-term operation of NX and Teamcenter. Build reliable workflows for parts import, product-data migration, metadata quality, BOMs, revisions, lifecycle states, and releas
About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli
About the Team OpenAI’s Hardware organization develops system and infrastructure solutions optimized for advanced AI workloads. We collaborate across research, software, and external hardware partners to design and deploy next-generation AI systems at scale. Our team works closely with silicon vendors and system partners to evaluate emerging technologies, validate performance characteristics, and ensure that hardware capabilities translate effectively to real-world AI workloads. About the Role We are seeking a 3P Hardware Architecture Expert with deep expertise in GPU and accelerator architectures to engage directly with silicon vendors and guide hardware decisions for AI infrastructure. In this role, you will evaluate architectural tradeoffs across compute, memory, and interconnect systems, translating vendor specifications into real-world workload impact. You will play a critical role in early silicon evaluation, benchmarking, and performance validation, helping ensure that next-generation hardware meets the needs of our workloads. This role is highly hands-on and requires both deep technical understanding and the ability to engage at a high level with partners such as NVIDIA and AMD on architectural direction and design tradeoffs. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance. Key Responsibilities Engage deeply with silicon vendors (e.g NVIDIA & AMD) on GPU and accelerator architecture tradeoffs. Analyze and interpret performance, power, and efficiency characteristics of next-generation hardware. Translate vendor specifications into expected real-world performance for AI workloads. Evaluate architectural aspects including: compute throughput and utilization memory systems (HBM, cache hierarchies, bandwidth constraints) data types and precision tradeoffs (FP16, BF16, FP8, etc.) interconnect and scaling behavior. Run benchmarks and profiling to validate hardware performance a
About the Role We’re seeking an Associate General Counsel to lead commercial legal strategy and execution for OpenAI’s silicon initiatives and the semiconductor ecosystem that supports our AI infrastructure. This is a senior, highly cross-functional role for a lawyer who can advise business and technical leaders across the semiconductor development, manufacturing, and supply lifecycle. The role will partner closely with silicon engineering, infrastructure, strategic sourcing, supply chain, manufacturing, finance, partnerships, IP, policy, regulatory, and trade compliance teams to structure and negotiate strategic arrangements with semiconductor ecosystem partners, technology providers, and critical suppliers. This person will help establish the commercial frameworks needed to protect OpenAI’s technology and support resilient, scalable commercial arrangements. We’re looking for an experienced technology transactions lawyer with meaningful semiconductor industry experience who can translate highly technical and operational issues into practical commercial structures. The ideal candidate combines strong judgment, commercial creativity, and the ability to lead complex, high-value transactions in a fast-moving and complex global ecosystem. This role is based in San Francisco, CA. We use a hybrid work model of 3-days in the office per week and offer relocation assistance to new employees. This role will: Lead commercial legal strategy and risk management for OpenAI’s silicon and related technology initiatives. Advise senior business, engineering, sourcing, and operational stakeholders on strategic relationships, commercial priorities, and complex transactions. Draft, negotiate, and advise on sophisticated development, manufacturing, supply, licensing, services, and strategic partnership agreements. Structure commercial arrangements that support long-term business and operational requirements. Advise on the commercial and operational issues that arise across the developmen
About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will work on the systems software strategy and execution that brings new AI silicon from first power-on to a fully integrated system running production-representative models at expected functionality and performance. You will define how software exercises and validates compute, memory, interconnect, and I/O subsystems, then build the diagnostics, automation, and observability needed to find issues quickly. This role sits at the center of silicon, firmware, platform, systems, and workload teams. You will turn hardware specifications and performance targets into an end-to-end bringup plan, drive cross-functional debug, and establish the stress and regression infrastructure that makes each new platform reliable across operating environments. In this role, you will: Contribute to the end-to-end software bringup and validation strategy for new silicon and first-party systems. Define software-driven test coverage across compute, memory, interconnect, I/O, and their system-level interactions. Build diagnostics, test automation, telemetry, and regression infrastructure that accelerate first-silicon learning and issue isolation. Lead bringup from initial silicon arrival through board and system integration, docking, runtime enablement, and model execution. Design stress tests that characterize reliability, performance, and stability across workloads and operating conditions. Translate architecture specifications and performance models into measurable acceptance crit
About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a software engineer to help build the design methodology, software abstractions, and infrastructure that enable a small silicon team to develop complex chips rapidly and with high confidence. You will turn evolving architecture and design needs into reusable tools and workflows that improve iteration speed, quality, and then apply those tools to help construct world-class silicon. You’ll work closely across architecture, design, verification, performance modeling, and systems software. This role is well suited for an engineer who enjoys building high quality software and is motivated by the challenge of improving velocity and quality of the silicon development process. In this role, you will: Develop and scale design methodologies for rapid first-party chip development and apply them to construct complex custom chips Create abstractions that allow hardware structures, configurations, experiments, and results to be represented consistently across tools. Automate high-value engineering workflows and improve their reproducibility, observability, testability, and ease of use. Partner with architects, RTL designers, verification engineers, compiler engineers, and systems software engineers to gather requirements and then implement solutions. Use methodology and tooling to identify design risks early, accelerate iteration, and improve confidence in performance and implementation tradeoffs. Contribute across multiple aspects of software and hardware
About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role As a Hardware Chips Programs Manager at OpenAI, you will help bring our chips hardware roadmap to life, navigating an array of technical and partnership challenges. We’re looking for people excited to push the frontiers of computing by navigating technical explorations and are passionate about building. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Manage the design and implementation planning of our ML acceleration hardware, working across technical, cross-functional and external stakeholders Lead planning and scheduling of chip hardware designs with our strategic partners and vendors Coordinate and marshal internal resources and communication for efficient interaction with partners and vendors. You might thrive in this role if you: Have experience as a technical program manager for data center hardware products (server, GPU, TPU, networking, storage and so on) Know the whole end-to-end system program management from concept, design, production, deployment into the data center Have some experience with System SW programs through NPI Want to help design some of the world’s largest supercomputing systems, working at the edge of complex hardware challenges Enjoy working with and enabling world-class AI Researchers and Engineers Are passionate about the technical program function, and enjoy independently owning and delivering on your tea
About the Team The Stargate team is responsible for building the physical infrastructure that powers large-scale AI systems. We design and deliver next-generation data centers optimized for dense compute clusters, advanced networking, and rapidly evolving hardware platforms. This work sits at the intersection of hardware engineering, systems architecture, and infrastructure execution—translating cutting-edge compute roadmaps into scalable, production-ready environments. Our teams partner across silicon vendors, server and storage OEMs, networking teams, and data center engineering organizations to bring new capacity online quickly, reliably, and at global scale. About the Role We are seeking a CPU & Storage Technical Lead to define and drive the server compute and storage architecture strategy for Stargate infrastructure. In this role, you will own technical direction across CPU platforms, memory configurations, local and disaggregated storage systems, and their integration into large-scale AI clusters. You will evaluate vendor roadmaps, lead platform tradeoff decisions, and ensure compute and storage systems are optimized for training, inference, and supporting services. You will work cross-functionally with hardware engineering, performance modeling, networking, supply chain, and deployment teams, as well as external partners such as AMD, Intel, OEMs, ODMs, and storage vendors. This is a highly strategic role for someone who can operate deeply at the component level while also driving long-range infrastructure decisions. Key Responsibilities Own CPU and storage technical strategy for Stargate compute infrastructure across current and future generations. Evaluate CPU platforms across performance, efficiency, memory bandwidth, PCIe topology, cost, and roadmap alignment. Define storage architectures for AI environments, including boot media, local NVMe, shared storage, caching tiers, metadata services, and high-performance data pipelines. Drive server platform de
About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a Rack Power Engineer with deep expertise in high-power conversion and distribution to design, qualify, and support power systems for AI supercomputers. You will own rack power solutions—including power shelves, AC/DC rectifiers, power supply units (PSUs), power management controllers (PMCs), and high-current distribution—from requirements and supplier development through deployment. You will also monitor fleet rack power health, lead debugging and root-cause investigations, and drive improvements into hardware, firmware, and qualification coverage. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own rack power architecture and requirements for high-power AI supercomputing systems, including power budgets, AC input interfaces, DC distribution, redundancy, efficiency, serviceability, and integration with data center infrastructure. Drive the design and supplier development of power shelves, rectifiers, PSUs, PMCs, busbars, connectors, and protection circuits. Review electrical designs and control behavior, and evaluate performance, cost, reliability, and availability trade-offs. Define and execute component, shelf, and rack qualification plans covering load transients, current sharing, hot-swap, startup and shutdown, redundancy failover, fault protection and recovery, thermal limits, and AC disturbances and ride-through
About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a
About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We're seeking a Software Engineer to join our First-Party Hardware team. In this role, you will design, build, integrate, and validate the software used to manufacture, qualify, and deliver our hardware from the factory. You will work across the stack to create the infrastructure that runs internally and externally to coordinate all aspects of the production process. You will create the critical tools and procedures to execute, capture, process, and present the data resulting from the end to end assembly and validation of our hardware across multiple vendors and sites. This role is hands-on and high-ownership. You will work closely across teams both internal and external to define the standards that will be used across our products to ensure the velocity and quality of our 1P hardware. You will own the implementation, deployment, and output of these systems as well their continued maintenance and SLAs. Location: San Francisco, CA (Hybrid: 3 days/week onsite). Relocation assistance available. In this role, you will: Design, develop, and maintain the software infrastructure for manufacturing process execution and data export. Own integration across internal customers and vendor systems and processes. Build and maintain the CI, release, and delivery pipeline of tooling to external partners. Build and maintain internal systems to ingest, process, deliver, and visualize critical data for internal teams and systems. Build system health monitoring, telemetry, remote d
About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are seeking a highly skilled Physical Design Engineer with deep expertise in physical design and methodology. This individual contributor role sits within our physical design team and is central to delivering power, performance, and area (PPA) optimized datapath and interconnect solutions for next-generation AI accelerators. You’ll work closely with RTL designers to define and execute on physical design strategies. You will develop tools, flows and methodologies to increase team productivity. Your work will directly impact silicon’s performance and cost efficiency, as well as the team’s execution velocity and quality. In this role, you will: Develop, build and own tools, flows and methodologies for physical implementation Own physical implementation of floorplan blocks from floorplanning to final signoff Collaborate with RTL designers to drive optimal block implementation solutions Analyze and optimize design for timing, power, and area trade-offs, working in collaboration with EDA vendors and ASIC partners Qualifications: BS w/ 4+ or MS with 2+ years or PhD with 0-1 year(s) of relevant industry experience in physical design and methodology development Demonstrated success in taping out complex silicon designs Hands-on experience with block physical implementation and PPA convergence Strong coding experience with python, bazel, TCL Strong experience building physical design tools, flows and methodologies Strong understanding of microarchitecture, RTL design,
About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a product manufacturing & quality engineer, who will be responsible for driving technical initiatives related to the manufacturing, quality and reliability of our AI supercomputer hardware systems to ensure product success from concept to launch and through mass production. You’ll have the opportunity to coordinate with functional SMEs and work with a wide range of stakeholders, from design engineering and operations teams, TPMs, external industry vendors and partners to ensure that all products are developed and delivered on time and to the highest quality standards. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees In this role, you will: Own the integrated manufacturing and quality readiness for a product across L6, L10, and L11, with clear gates, milestones, deliverables, owners, and closure criteria. Lead readiness of process flows, tooling, fixtures, assembly operations, test interfaces, and production controls. Review and contribute to work instructions. Translate product requirements into qualification plans, process controls, test requirements and acceptance criteria with design engineering and Area SMEs Coordinate and drive execution of product and process qualification, reliability testing, and validation with the relevant SMEs. Maintain traceable evidence that assigned products and processes meet agreed performance, reliability,
About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. In this role you will: As a Hardware Test Engineer, you will work on Machine Learning/AI hardware system projects to craft the solutions for current and future data center deployments. You will bring a strong understanding of hardware system testing, excellent project management skills, and the ability to collaborate across multiple teams to ensure efficient lab operations. You will be responsible for designing, implementing, and executing comprehensive test plans that ensure the reliability, performance, and scalability of our supercomputing hardware systems. You will develop detailed test plans and methodologies tailored to hardware components, including processors, memory modules, custom accelerators and interconnects. You will collaborate with hardware design, manufacturing, firmware teams and vendors to identify, analyze, and resolve issues affecting hardware, power, thermal and high-speed interconnects. You will perform in-depth debugging on the hardware system Excellent analytical skills to diagnose hardware issues, troubleshoot problems, and propose solutions. Ability to interpret complex test data, identify trends, and draw meaningful conclusions. High-speed links, with a focus on SerDes (Serializer/Deserializer) technology to assess signal integrity, error rates, and overall link performance. You will collaborate with the lab manager to maintain the equipment and hardware systems, including oscilloscopes, thermal test chambers, liquid cooling systems, and other mea
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