Solution Architect Sbs in United States

Work Flexibility: Field-based Who we want: Challengers. People who seek out the hard projects and work to find just the right solutions. Teammates. Partners who listen to ideas, share thoughts and work together to move the business forward. Charismatic networkers. Relationship-savvy people who intentionally make connections with both internal partners and external contacts. Strategic closers . Influencer who close profitable business and consistently exceed their performance objectives. Customer-oriented achievers. Representatives with an unparalleled work ethic and customer-focused attitude who bring value to their partnerships. Game changers . Persistent salespeople who will stop at nothing to live out Stryker’s mission to make healthcare better. What you will do: As an Orthopaedics Instruments Regional Sales Manager, you will strategically plan, direct and coordinate the selling activities of sales representatives under your supervision. You will interview, hire, train and develop top level talent. In addition, you will develop plans in accordance with the Director of Sales to maximize sales opportunities in the region and push yourself to exceed each goal. You take great pride in excellent service and are prepared to assist your reps a

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a mid- to senior-level Physical Design Engineer who will contribute to the physical design of high-performance chips for industry-leading AI/ML architectures, spanning implementation from synthesis through tapeout. You will partner with front-end and physical design engineers to optimize floorplanning, timing, power, performance, and area across multiple IPs. Along the way, you will build end-to-end ASIC expertise while learning from experienced engineers across the chip development process. This role is hybrid , based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA . We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An engineer excited to work on high-performance designs for industry-leading AI/ML architectures. A collaborative problem solver who enjoys working with experienced engineers across ASIC disciplines. Grounded in logic design fundamentals and gate- and transistor-level implementation. Curious about how early architectural and RTL decisions shape physical implementation and final chip quality. What We Need A BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a relat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful. Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives. Key Responsibilities Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones. Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement. Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments. Drive continuous improvement initiatives to minimize defects and optimize process reliability. Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance. C

About the Team OpenAI’s IT organization supports the mission of deploying artificial general intelligence (AGI) for the benefit of all. Our team is committed to providing seamless technological support and solutions to ensure that all OpenAI employees are well-equipped and connected. This enables them to contribute effectively towards our AI research, corporate operations and product initiatives. About the Role As an ITAV Operations Engineer at OpenAI, you will administer and troubleshoot conference room AV, video conferencing, background music, digital signage, and other ITAV-owned systems. You will serve as the technical bridge between our support vendors and ITAV Engineering, resolving escalations that require internal access, administrative permissions, or deeper technical investigation. You will maintain reliable configurations, execute changes using established standards, and turn recurring issues into improvements to systems, documentation, and automation This is an in-office role and will require 5 days a week in our San Francisco office. Travel 30% of the time to support ITAV systems, technical changes, and operational readiness. International travel is required. In this role, you will: Set up, configure, administer, and maintain conference room AV, video conferencing, background music, digital signage, and other ITAV-owned systems. Resolve vendor escalations that require internal administrative access or technical expertise, owning diagnosis, remediation, and verification of service restoration. Manage assigned ITAV installation and commissioning scope for office builds, refreshes, and moves, adds, and changes using established standards, and verify that completed systems are ready for ongoing operation. Serve as the technical bridge between vendors and ITAV Engineering, providing clear diagnostic evidence and escalating issues that require changes to system designs or engineering standards. Execute software updates, configuration changes, equipment replac

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio. As a Principal Signal Integrity Engineer , you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption. What You’ll Work On Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks. Key signal integrity domains include: Intercon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of Micron's Technology Engineering & Innovation (TE&I) organization, you will have the opportunity to shape the future of our global infrastructure platforms while enabling business growth, operational resilience, and digital transformation at scale. The Opportunity Micron is seeking a transformational Senior Director of Technology Engineering & Innovation (TE&I) to lead the strategy, engineering, operations, and modernization of our global infrastructure ecosystem. This role is responsible for defining and executing Micron's vision across enterprise networks, cloud platforms, data center strategy, database services, infrastructure engineering, automation, observability, and global infrastructure operations. As a key member of the TE&I leadership team, you will drive innovation, operational excellence, and strategic transformation while building a high-performing organization focused on business outcomes and exceptional customer experiences. The successful candidate will be equally comfortable developing multi-year technology strategies, leading large-scale infrastructure transformations, driving operational performance, developing talent, and fostering a culture of collaboration, accountability, and continuous improvement. What You Will Do Lead Global Infrastructure Strategy & Transformation Define and execute Micron's global infrastructure vision and strategy. Develop multi-year roadmaps for: Enterprise Network Services <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron currently has an opening for a Staff or Principal level EUV Equipment Engineer for our Boise, Idaho location. Our Advanced Lithography and Equipment Engineering team enables the technologies that power the future of semiconductor innovation. We work at the leading edge of EUV and High-NA EUV development, partnering across process, manufacturing, facilities, and supplier organizations to deliver world-class equipment performance and support Micron’s technology roadmap. This EUV Equipment Engineer is a technical leadership role focused on maximizing the performance, reliability, and capability of EUV lithography systems. This position plays a critical role in advancing next-generation semiconductor technologies through equipment optimization, problem solving, supplier engagement, and collaboration across engineering disciplines. Responsibilities: Own the performance, reliability, availability, and productivity of assigned EUV lithography equipment Lead equipment installations, upgrades, qualifications, maintenance strategies, and continuous improvement initiatives Drive improvements in scanner performance, tool matching, imaging stability, defectivity reduction, contamination control, and recipe optimization Analyze equipment data and establish monitoring systems to improve overlay, focus, source performance, automation, and overall equipment health Provide technical leadership through supplier management, cross-functional collaboration, mentoring, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior CVD/PVD (Chemical Vapor Deposition/ Physical Vapor Deposition) Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Process area knowledge DRAM development and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Central Engineering at Micron Technology, Inc. is a dynamic and integral part of the company, focused on providing essential services and driving innovation across various technical domains. Established nearly five years ago, Central Engineering initially concentrated on creating economies of scale and enhancing efficiency for the Technology Products Group (TPG). Over the past three years, the team has evolved to deliver industry-first products, develop core design process automation, and produce powerful AI and Data Science tools. As a CAD in CE Memory CAD Engineer at Micron, we work in a fast-paced and collaborative environment. We provide production support role by evaluating, developing, enhancing and debugging both in-house and commercial EDA tools and flows for the design, physical layout, and verification of CMOS integrated circuits! The right person will have be developing and applying CAD software engineering methods, theories and research techniques in support of the organization's product development! Assignments include crafting and developing CAD software, assessing architecture and hardware limitations, and defining and implementing CAD software engineering applications. Responsibilities: Innovating to develop tools, flows, and methodologies to increase the design efficiency and quality of our memory designs on NAND/DRAM/HBM Providing training, documentation, and support to end-users o

Software Engineer Company: Tapestry - G0G Tapestry Solutions, A Boeing Company, brings over 30 years of industry experience designing, implementing, training, and supporting high-quality, cost-effective information technology and business intelligence solutions. With a dedicated team of approximately 500 professionals, we proudly serve 75 defense, commercial, and government clients across more than 50 U.S. locations and 9 countries worldwide. As a trusted partner, our employees embody our core values by consistently delivering excellence, taking full ownership, and developing innovative solutions that enable critical missions and ensure the safety of our global customers and team members. Joining Tapestry Solutions means enjoying the best of both worlds: access to the vast resources of Boeing combined with the agility and people-focused, family-oriented culture of a small business where your contributions truly matter. Tapestry Solutions, a part of Boeing Global Services BGS, is seeking a Software Engineer in Berkeley, MO to support future franchise programs. In this role you will support mission planning software development, integration and test efforts supporting the fielding of systems critical to our national defense posture. These Solutions will shape the way the DoD conducts mission planning for the next 30 years. Position Responsibilities: Supports the design, development, test, and maintenance of software throughout the end-to-end lifecycle Assists Product Owner to review, analyze, and translate customer requirements into initial design of software products Supports with development, maintenance, enhancement and optimization of softw

Project Management Specialist Company: Tapestry - G0G Tapestry Solutions, A Boeing Company, brings over 30 years of industry experience designing, implementing, training, and supporting high-quality, cost-effective information technology and business intelligence solutions. With a dedicated team of approximately 500 professionals, we proudly serve 75 defense, commercial, and government clients across more than 50 U.S. locations and 9 countries worldwide. As a trusted partner, our employees embody our core values by consistently delivering excellence, taking full ownership, and developing innovative solutions that enable critical missions and ensure the safety of our global customers and team members. Joining Tapestry Solutions means enjoying the best of both worlds: access to the vast resources of Boeing combined with the agility and people-focused, family-oriented culture of a small business where your contributions truly matter. Tapestry Solutions, a part of Boeing Global Services (BGS), is seeking a Project Management Specialist in Maryland Heights, MO and/or Hazelwood, MO. In this role you will test software for the F-15 Mission Planning systems. Position Responsibilities: Understands dependencies and enablers for a product to be able to prioritize Run team demos and retrospectives Ensures Iteration goals are defined Understands stakeholder requirements and priorities Work under general direction Runs Iteration planning, and backlog refinement meetings Ensures team is performing ceremonies in a value added manner – keeps people on track, moving through different processes (scrum, planning, retro) Supports the product owne

Become a part of our caring community Humana is seeking a Lead Product Manager, Medication Experience & Pharmacy Solutions to lead the strategy, discovery, delivery, and optimization of digital experiences that help members understand, manage, and maximize the value of their prescription benefits. This highly visible role sits at the intersection of pharmacy, health insurance, member experience, and digital product innovation. The Lead Product Manager will own the product lifecycle end-to-end, from identifying customer and business opportunities through defining features and stories, partnering across Design and Engineering, driving delivery, and measuring outcomes. Success requires strong strategic thinking, customer obsession, analytical rigor, and the ability to influence cross-functional stakeholders in a highly matrixed environment. The role directly supports Humana's goals of improving member experience, increasing digital engagement, reducing friction in medication-related journeys, and helping members make informed healthcare decisions. Why Join This Team This role offers a unique opportunity to solve meaningful healthcare problems at scale. You will help millions of members better understand their benefits, manage medications, reduce prescription costs, and make more informed healthcare decisions. Unlike many product organizations, our Product Managers own the entire product lifecycle, providing an uncommon level of ownership, accountability, and impact from strategy through implementation and measurement. Responsibilities Define and execute product strategy, vision, and roadmap for Medication Experience and Pharmacy Solutions Identify member, business, and operational opportunities through research, analytics, VOC, and stakeholder insights Lead product discovery efforts to validate problems, oppor

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5&#43; years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP