Solutions Architect in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Become a part of our caring community Help shape practical, responsible AI solutions that improve healthcare experiences and outcomes. Humana’s Enterprise AI organization develops safe, scalable AI solutions across our Insurance and CenterWell businesses. We bring together product managers, data scientists, engineers, policy experts, and business leaders to apply emerging technology to meaningful healthcare challenges. As Associate Director of Applied AI, you will lead teams that design, build, and deploy enterprise AI solutions, with a focus on generative AI and intelligent agents. You will connect technical strategy to business needs, guide responsible delivery in a regulated environment, and help teams turn promising ideas into measurable outcomes for members, patients, and associates. Key Responsibilities Lead and mentor teams developing production-ready AI solutions that improve healthcare delivery, member experiences, and business operations. Help define and execute the roadmap for applied AI initiatives in alignment with enterprise priorities and business needs. Guide the evaluation and adoption of machine learning, generative AI, large language models, multimodal models, and intelligent agent technologies. Oversee scalable APIs, frameworks, data pipelines, retrieval-augmented generation solutions, and agent orchestration capabilities. Partner with product, data science, engineering, architecture, security, and business teams to translate requirements into reliable solutions. Establish standards for AI evaluation, obse

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a mid- to senior-level Physical Design Engineer who will contribute to the physical design of high-performance chips for industry-leading AI/ML architectures, spanning implementation from synthesis through tapeout. You will partner with front-end and physical design engineers to optimize floorplanning, timing, power, performance, and area across multiple IPs. Along the way, you will build end-to-end ASIC expertise while learning from experienced engineers across the chip development process. This role is hybrid , based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA . We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An engineer excited to work on high-performance designs for industry-leading AI/ML architectures. A collaborative problem solver who enjoys working with experienced engineers across ASIC disciplines. Grounded in logic design fundamentals and gate- and transistor-level implementation. Curious about how early architectural and RTL decisions shape physical implementation and final chip quality. What We Need A BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a relat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

About us Graphcore is one of the world’s leading innovators in Artificial Intelligence compute. It is developing hardware, software and systems infrastructure that will unlock the next generation of AI breakthroughs and power the widespread adoption of AI solutions across every industry. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. Together, they share a bold vision: to enable Artificial Super Intelligence and ensure its benefits are accessible to everyone. Graphcore’s teams are drawn from diverse backgrounds and bring a broad range of skills and perspectives. A melting pot of AI research specialists, silicon designers, software engineers and systems architects, Graphcore enjoys a culture of continuous learning and constant innovation. Job Summary We are seeking a Staff Hardware Engineer to provide advanced operational, diagnostic, and engineering support for Graphcore’s Arm-based hardware platforms across lab and data center environments. This role focuses on supporting hardware bring-up, validation, and troubleshooting of complex AI compute platforms, including server blades, racks, and rack-scale infrastructure. The successful candidate will collaborate closely with engineering, platform, and data center teams to ensure the reliability and performance of next-generation AI systems. The Team The Systems Engineering and Hardware Engineering teams are responsible for enabling the bring-up, validation, and operational reliability of Graphcore’s AI infrastructure platforms. The team works closely with server engineering, firmware teams, platform architects, and data center operations to support the development, testing, and deployment of next-generation AI compute systems. This collaborative environment enables rapid problem-solving and continuous improvement of Graphcore’s hardware platforms from early development through production deployment.

About us Graphcore is one of the world’s leading innovators in Artificial Intelligence compute. It is developing hardware, software and systems infrastructure that will unlock the next generation of AI breakthroughs and power the widespread adoption of AI solutions across every industry. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. Together, they share a bold vision: to enable Artificial Super Intelligence and ensure its benefits are accessible to everyone. Graphcore’s teams are drawn from diverse backgrounds and bring a broad range of skills and perspectives. A melting pot of AI research specialists, silicon designers, software engineers and systems architects, Graphcore enjoys a culture of continuous learning and constant innovation. Job Summary We are seeking a Staff Hardware Engineer to provide advanced operational, diagnostic, and engineering support for Graphcore’s Arm-based hardware platforms across lab and data center environments. This role focuses on supporting hardware bring-up, validation, and troubleshooting of complex AI compute platforms, including server blades, racks, and rack-scale infrastructure. The successful candidate will collaborate closely with engineering, platform, and data center teams to ensure the reliability and performance of next-generation AI systems. The Team The Systems Engineering and Hardware Engineering teams are responsible for enabling the bring-up, validation, and operational reliability of Graphcore’s AI infrastructure platforms. The team works closely with server engineering, firmware teams, platform architects, and data center operations to support the development, testing, and deployment of next-generation AI compute systems. This collaborative environment enables rapid problem-solving and continuous improvement of Graphcore’s hardware platforms from early development through production deployment.

The Forward Deployed Engineer, Staff (FDE) is a high impact technical leader responsible for translating the immense power of Talkdesk's Agentic AI platform into transformative, production grade solutions for our strategic enterprise customers. You are a unique blend of a highly experienced software engineer, a technical project lead, and a hands-on builder. You own the technical execution for deployments, mitigate technical risks, and drive successful customer outcomes across assigned projects. This role is for the experienced builder who excels in high stakes, customer facing environments and is passionate about defining the future of Customer Experience Automation. Responsibilities Technical Project Leadership & Architecture: Act as the technical lead for complex deployments. Design and implement the architectural blueprint for AI agent solutions, manage cross-system dependencies, and ensure designs meet stringent enterprise standards for security and scale. Hands-On Engineering & Delivery: Write production-grade code and leverage Talkdesk and 3rd-party APIs/SDKs to design, build, test, and deploy AI agents. Drive the execution from prototype through to production deployment, ensuring technical quality. Technical Consultation & Alignment: Serve as a trusted technical expert for our AI solutions. Confidently address deep technical inquiries, mitigate technical risk, and build trust with customer Engineering Directors, and technical architects. Influence Product & Engineering Roadmap: Synthesize and codify deployment learnings into reusable solution patterns and tooling. Provide actionable feedback to core Product and Engineering teams to help inform future product direction. Technical Guidance: Mentor junior FDEs and technical specialists on best practices for complex AI architecture, production quality, and client-facing technical delivery. Who You Are We are looking for an autonomous, results-driven technical leader who thrives at the intersectio

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures. Key Responsibilities Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Design Technology Co-Optimization (DTCO) team works at the intersection of process technology, standard cell architecture, and design implementation to optimize power, performance, and area (PPA) for advanced memory products. The team collaborates closely with standard cell library, RTL, and physical design engineers to evaluate design tradeoffs and develop methodologies that improve silicon outcomes. As a DTCO Intern, you will gain hands-on experience assessing and optimizing PPA at the standard cell and logic block level. You will use industry-standard place-and-route tools and AI-enabled automation techniques to implement, benchmark, and optimize logic blocks while developing practical skills in physical design, timing closure, and design analysis. Responsibilities Implement standard cell logic blocks using industry-standard physical design tools, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization activities focused on PPA assessment. Analyze and benchmark power, performance, and area across standard cell libraries and logic block configurations, identifying opportunities for improvement. Perform static timing analysis (STA), investigate setup and hold timing violations, and support timing closure activities. Execute physical verification checks, including DRC, LVS, and IR-drop analysis, and assist with resolving design issues. Leverage Generative AI, AI Assistants, and Agentic AI solutions to automate data collection, reporting, comparison, and w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engin

We are seeking an experienced Senior Generative AI Developer to help drive the design, development, and integration of state-of-the-art Generative AI and agentic AI solutions across our enterprise Controls Technology platform. You will collaborate with cross-functional teams, contribute deep technical expertise in context engineering, retrieval systems, knowledge graphs, and multi-agent orchestration, and play a key role in delivering scalable, grounded AI solutions to enhance automation and operational efficiency. This role centers on architecting robust applications and agent systems on top of pre-trained and hosted foundation models — not on training or fine-tuning models. Key Responsibilities Collaborate with AI architects, leads, and stakeholders to design and implement generative and agentic AI solutions that address business challenges. Architect advanced context engineering strategies — context layering, chaining, compression, pruning/offloading, and memory management — to maximize reliability, provenance, and token efficiency in production. Design and implement advanced generative AI methods, including sophisticated prompt engineering and Retrieval-Augmented Generation (RAG) . Build and optimize RAG systems , including hybrid search, multi-vector retrieval, and re-ranking pipelines. Design and implement knowledge graphs and Graph RAG architectures to enable multi-hop reasoning, explainability, and traceable, grounded responses for high-value business domains. Architect agentic workflows and multi-agent systems using Google Agent Development Kit (ADK) and comparable frameworks (LangGraph, Microsoft Agent Framework, CrewAI), applying orchestration patterns such as supervisor/worker, hierarchical, and peer-to-peer. Design robust agent harnesses — governance, constraints, feedback loops, state/session management, and

Work Flexibility: Remote As a Senior Lead, Data Engineering, you will serve as a technical leader who helps shape the future of enterprise data solutions. In this role, you will drive complex data initiatives, influence technical strategy, and partner with teams across the organization to build scalable, high-impact data products. This is an opportunity to solve challenging business problems while mentoring fellow engineers and elevating data engineering best practices. What You Will Do Lead the architecture, development, and modernization of scalable enterprise data platforms that support global procurement analytics and business transformation. Define and help execute a multi-year data engineering strategy focused on platform scalability, reliability, automation, technical debt reduction, and long-term maintainability. Design, build, and optimize Azure-based data solutions using technologies such as Databricks, Delta Lake, Azure Data Factory, Azure DevOps, CI/CD pipelines, and infrastructure automation. Integrate and harmonize data across multiple ERP systems by standardizing supplier, purchasing, and master data into common enterprise data models. Partner with procurement analysts, architects, engineers, and business stakeholders to translate complex business needs into reusable, scalable data products and engineering solutions. Establish engineering standards, conduct architecture reviews, improve documentation, and mentor engineers to raise the overall technical capability of the team. Identify and implement AI-enabled approaches that accelerate development, improve data quality, automate documentation, support testing, and enhance analyst productivity. Evaluate and recommend tools, frameworks, patterns, and platform investments that improve performance, reliability, security, governance, and operational ef