Solutions Architect in United States

1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will work on the systems software strategy and execution that brings new AI silicon from first power-on to a fully integrated system running production-representative models at expected functionality and performance. You will define how software exercises and validates compute, memory, interconnect, and I/O subsystems, then build the diagnostics, automation, and observability needed to find issues quickly. This role sits at the center of silicon, firmware, platform, systems, and workload teams. You will turn hardware specifications and performance targets into an end-to-end bringup plan, drive cross-functional debug, and establish the stress and regression infrastructure that makes each new platform reliable across operating environments. In this role, you will: Contribute to the end-to-end software bringup and validation strategy for new silicon and first-party systems. Define software-driven test coverage across compute, memory, interconnect, I/O, and their system-level interactions. Build diagnostics, test automation, telemetry, and regression infrastructure that accelerate first-silicon learning and issue isolation. Lead bringup from initial silicon arrival through board and system integration, docking, runtime enablement, and model execution. Design stress tests that characterize reliability, performance, and stability across workloads and operating conditions. Translate architecture specifications and performance models into measurable acceptance crit

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will build the model runtime within the inference engine that executes complex, frontier models at scale on OpenAI’s custom silicon. The runtime will sit between models running on the hardware and the upper layers of the cluster serving software stack, translating demanding inference workloads into efficient execution while optimizing for throughput, latency, utilization, and reliability. You will work across model architecture, distributed systems, compilers, kernels, and silicon to design a production-grade runtime comparable in ambition to systems such as vLLM and SGLang, but customized and optimized for OpenAI’s AI accelerator. Your work will shape how new model capabilities map onto the platform and how quickly custom silicon can deliver meaningful performance in production. In this role, you will: Design and implement the LLM inference runtime for frontier models running on custom silicon. Build scheduling, continuous batching, memory management, KV-cache management, and execution orchestration for high-performance inference. Develop distributed execution strategies across chips, hosts, and racks, including model partitioning, communication, and synchronization. Optimize end-to-end latency, throughput, memory efficiency, and hardware utilization across diverse model architectures and serving workloads. Partner with kernel, compiler, architecture, and silicon teams to co-design interfaces and remove performance bottlenecks across the stack. Enable new

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will build the low-level device runtime that turns compiled programs into efficient, functional and performant execution on OpenAI’s custom AI accelerator. This software will schedule kernel launches, manage device memory and address spaces, coordinate synchronization, and expose reliable abstractions to higher-level runtimes and frameworks. You will work at the boundary of software and hardware, partnering with compiler, kernel, architecture, verification, and silicon teams to define interfaces and validate behavior. You will also use and improve event-based, cycle-accurate simulation to develop runtime capabilities before silicon is available, diagnose performance and correctness issues, and guide hardware-software co-design. In this role, you will: Design and implement the low-level device runtime for OpenAI custom silicon. Build kernel-launch scheduling, command submission, queueing, dependency tracking, and completion handling. Manage device memory spaces, allocation, virtual-to-physical mappings, data movement, and lifetime across concurrent workloads. Implement synchronization primitives, events, barriers, streams, and ordering guarantees that are correct and efficient. Define clean interfaces between the runtime, drivers, firmware, compiler-generated code, kernels, and higher-level execution systems. Use event-based, cycle-accurate simulators to develop, validate, debug, and performance-tune runtime behavior before and after silicon availability. Di

MongoDB's Partner Program is how we formalize value for every partner type in our ecosystem — Technology/ISV partners, Services and Solutions partners (including our Systems Integrators), Cloud partners (AWS, Azure, Google Cloud), Built with MongoDB partners, and Certified by MongoDB DBaaS partners. We're looking for a Director, Partner Programs to own this program end to end: the tiering and benefits structure, the incentive framework, certification (including our SI Associate and SI Architect tracks), and the operational rigor that keeps thousands of partners engaged and productive. You'll report to the VP of Partner Strategic Operations and oversee all MongoDB Partner Programs globally, managing a team of Partner Program Managers. You'll be the connective tissue between the field-facing work being done in Sales Plays & Offerings, the platform work being built by our Business Product Manager (PRM), and the automation work coming out of Digital Process & AI Operations — making sure the underlying program itself stays coherent, well-governed, and aligned to company strategy as all of that activity happens around it. This role can be hybrid near any of our MongoDB hub offices in the United States or remote in the United States. What You'll Do Own Partner Program strategy and structure Own and evolve the overall architecture of the MongoDB Partner Program across all partner categories — Technology, Services and Solutions, Cloud, Built with MongoDB, and Certified by MongoDB DBaaS — including tiering, entitlements, and benefits at each level Ensure the program structure stays aligned to MongoDB's broader GTM strategy, including emerging priorities like AI-driven partnerships and cloud marketplace growth Own partner certification pathways (e.g., SI Associate and SI Architect certifications) and ensure they reflect current MongoDB technology and sales priorities Design and govern incentives Own the global partner incentive framework — MDF, SPIFs, rebates, and co-s

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for a highly experienced RTL engineer to own critical on- and off-chip interconnect components for our custom AI accelerator platform. You will drive the microarchitecture and RTL implementation of scalable on-chip communication fabrics connecting high-bandwidth compute, memory, and I/O subsystems as well as purpose-built off-chip interfaces and protocols needed to enable custom computing at scale. This is a senior, hands-on engineering role with broad technical ownership. You will drive design from requirements through the full silicon lifecycle, from architecture definition and performance analysis through RTL implementation, verification closure, physical design convergence, bring-up, and production readiness. You will plan and oversee the work of junior engineers and help drive and develop productive engineering relationships with external partners and help manage partner execution. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own the microarchitecture, RTL design, and delivery of major SoC interconnect components, including network-on-chip fabrics, switches, routers, bridges, protocol adapters, arbiters, and traffic-management logic as well as off-chip protocol bridges and interfaces. Drive third party engagements to develop novel networking and interface protocols and silicon IP while ensuring high quality and de

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Platform Engineer An individual contributor who will serve as a hands-on technical member of the SMAI Platform Engineering team. In this role, you will help build, operate, and maintain the platforms that power Micron's analytics and AI workloads. You will contribute to platform reliability and scalability through day-to-day engineering, collaborative problem solving, and close partnership with solution architects, project teams, and multi-functional partners. Responsibilities: Collaborate with global platform teams, customers, partners, and vendors to deliver effective technical solutions. Know the latest platform roadmaps, emerging technologies, and new service offerings; evaluate and recommend adoption opportunities. Partner with solution architects to design, implement, and optimize solutions across IaaS, PaaS, SaaS, and Infrastructure as Code (Terraform). Document findings, operational procedures, guidelines, and reusable patterns while providing feedback to vendors and internal teams. Deliver high-quality platform support by managing customer requests, maintaining service standards, and implementing controlled platform adjustments. Monitor platform performance, observability, costs, and resource utilization to identify optimization opportunities and improve reliability. Collaborate with multi-functional teams to ensure seamless operations, scalable architectures, and automation, including AI-driven business solutions. Implement and m

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Customer Engineering organization serves as the primary technical interface for our global customers and helps ensure that Micron solutions are seamlessly integrated into next-generation technology platforms. Our team coordinates deep engineering engagements, technical product qualifications, and architecture reviews to secure design wins and grow market share. We are dedicated to providing world-class technical support that accelerates revenue and builds long-term strategic partnerships with our customers. Role Description: The Field Applications Engineer - Associate plays a vital role in achieving the technical achievements needed to launch products. You will be an important member of our field engineering team. In this position, you will oversee many end-to-end technical tasks, including sophisticated product sample deployments, lifecycle management, addressing technical questions, and other customer interactions. You should adopt an "automation-first" approach to actively find ways to improve processes and apply AI-based workflows in daily operations when possible. This role can lead to a full-time FAE career for individuals who achieve the right results. It also requires demonstrating the right skills and behaviors. Example Responsibilities: Coordinate the entire process of tech

About us Graphcore is one of the world’s leading innovators in Artificial Intelligence compute. It is developing hardware, software and systems infrastructure that will unlock the next generation of AI breakthroughs and power the widespread adoption of AI solutions across every industry. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. Together, they share a bold vision: to enable Artificial Super Intelligence and ensure its benefits are accessible to everyone. Graphcore’s teams are drawn from diverse backgrounds and bring a broad range of skills and perspectives. A melting pot of AI research specialists, silicon designers, software engineers and systems architects, Graphcore enjoys a culture of continuous learning and constant innovation. Job Summary We are seeking a Staff Hardware Engineer to provide advanced operational, diagnostic, and engineering support for Graphcore’s Arm-based hardware platforms across lab and data center environments. This role focuses on supporting hardware bring-up, validation, and troubleshooting of complex AI compute platforms, including server blades, racks, and rack-scale infrastructure. The successful candidate will collaborate closely with engineering, platform, and data center teams to ensure the reliability and performance of next-generation AI systems. The Team The Systems Engineering and Hardware Engineering teams are responsible for enabling the bring-up, validation, and operational reliability of Graphcore’s AI infrastructure platforms. The team works closely with server engineering, firmware teams, platform architects, and data center operations to support the development, testing, and deployment of next-generation AI compute systems. This collaborative environment enables rapid problem-solving and continuous improvement of Graphcore’s hardware platforms from early development through production deployment.

We’re building a world of health around every individual — shaping a more connected, convenient and compassionate health experience. At CVS Health®, you’ll be surrounded by passionate colleagues who care deeply, innovate with purpose, hold ourselves accountable and prioritize safety and quality in everything we do. Join us and be part of something bigger – helping to simplify health care one person, one family and one community at a time. Position Summary CVS Health is seeking a Senior Varicent Integration & Platform Engineer with expertise in technical architecture and integration to join the Human Resources Technology team. This experienced and motivated professional will support Compensation business operations by delivering optimal, scalable technology solutions. As an integral member of the team responsible for the Varicent Sales Performance Management (SPM) platform, its integrations, and its technical architecture, this role will address the needs of Total Rewards and Human Resources business partners and stakeholders. The ideal candidate will combine deep technical and platform expertise with a demonstrated ability to collaborate with technical and non-technical partners. The role will provide essential support to the Compensation organization for sales incentive technology needs and will collaborate with HR Technology, Centers of Excellence (COEs), and HR Shared Services across all business segments. This individual will establish cross-functional relationships throughout HR Technology and Human Resources to ensure that solutions and initiatives are effectively designed and implemented, with colleague satisfaction as a key goal. Primary Responsibilities: Collaborate with business and technical partners to support the Varicent technical architecture and integration roadmap, including the e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary We are seeking a motivated engineer to join the DRAM Systems Engineering team, focusing on the development, evaluation, and optimization of next-generation memory systems for AI accelerators. This role emphasizes research and development across hardware architecture, operating systems, and performance analysis to support Agentic AI inference workloads. If you are ambitious and eager to make an impact in the exciting world of AI and memory systems, this is the perfect opportunity for you! Responsibilities Characterize AI inference workloads and examine memory behavior Build and evaluate tiered memory hierarchies for AI accelerators Study KV cache lifecycles, MoE models, and data placement strategies Compare and optimize explicit versus hardware-assisted data movement Develop, test, debug, and detail system-level and OS components Prototype and evaluate agentic AI systems by building agents and multi-agent workflows using modern frameworks and orchestration patterns (planning, tool use, memory, and context management). Apply these technologies both as workloads under study and as accelerators for internal engineering workflows <h2 style="color:!importan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en