Systems And Solutions Engineer in Oregon

Job Details: Job Description: Join an enthusiastic team of engineers in Intel's Networking Solutions Group (NSG) focused on enabling next generation of programmable Infrastructure Processing Units (IPUs) with our lead customers as part of the Customer Experience Support (CES) organization. Intel brings decades of leadership in networking, virtualization, packet processing, storage, and security to a new class of IPU products that accelerate host networking functions and support emerging use cases such as security, virtualization, storage, load balancing, and data path optimization. Working closely with major cloud service providers and Intel development teams, you will help deliver customized IPU based solutions that enhance isolation, security, performance, storage and system management for our customers. A big part of the day-to-day job is to help customers manage feature request processes, enable solutions, and debug issues. Projects and responsibilities include but are not limited to: • Gain our customers' trust, understand their needs, and build POCs to meet them. Work closely with internal and external partners to understand use cases and requirements. • Be the go-to technical resource for customers building complex Datacenters, AI infrastructure as well as helping them understand performance characteristics for solutions. • Prepare and deliver technical content to customers including presentations, workshops, etc. • Contribute across the full IPU lifecycle, including board and platform bring up, low-level device initialization, OS driver and kernel configuration, system management, feature enablement, use case testing, debugging, and verification. • Defines systems implementation and integration solutions and plans to ensure optimum performance and reliability across hardware, firmware and software w

Job Details: Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation. Key Responsibilities Design, develop, and debug Fill components of Process Design Kits (PDKs), Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. Automate workflows to enhance efficiency, accuracy, and deployment across design teams. Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment.

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Join us and build on our legacy of innovation and collaboration as we deliver world‑changing technology that improves the life of every person on the planet. Life at Intel: https://jobs.intel.com/en/life-at-intel This position is in the Intel Mask Operations within the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. In this position the engineer will be an integral contributor to the ongoing production of photolithography masks for Intel's leading-edge silicon manufacturing solutions. In this position, you will work on-site, in a dynamic and collaborative environment solving complex and challenging technical problems on sophisticated manufacturing processes and equipment. As an IMO Module Development Engineer, the responsibilities may include but not limited to: Process equipment installation and development. Equipment maintenance, management of troubleshooting activities, regular monitoring of process performance, defect analysis and reduction. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics. Working with cross functional teams to solve technical process and defect issues. Plans and conducts experiments to fully characterize the process throughout the development cycle. Establishes control systems to optimize and sustain production performance. D

Job Details: Job Description: This position is in the Intel Mask Operations within the Logic Technology Development team working in one of the most advanced semiconductor process technologies in the world. In this position the engineer will be an integral contributor to the ongoing production of photolithography masks for Intel's leading-edge silicon manufacturing solutions. In this position, you will work on-site, in a dynamic and collaborative environment solving complex and challenging technical problems on sophisticated manufacturing processes and equipment. As IMO module Engineer the responsibilities may include but not limited to: Process equipment installation and development. Equipment maintenance, management of troubleshooting activities, regular monitoring of process performance, defect analysis and reduction. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics. Working with cross functional teams to solve technical process and defect issues. Plans and conducts experiments to fully characterize the process throughout the development cycle. Establishes control systems to optimize and sustain production performance. Develops strategies to resolve difficult problems and establishes systems to manage these problems in the future. An ideal candidate should exhibit the below behavioral traits: Experience with rapid analysis of complex process issues and identification of a solution path Willing to work Independently with minimal direction, to be self-directing and show initiative Communication skills and demonstrated ability to summarize complex d

Job Details: Job Description: The Role As a Cloud Application Development Engineer within Intel Manufacturing Foundry Cloud Services (imFCS) , you will design, develop, deploy, and support cloud-native applications that power semiconductor manufacturing, engineering automation, and AI-driven factory operations. You will build scalable, secure, and resilient platforms that improve engineering productivity, enable advanced analytics, and accelerate Intel Foundry's digital transformation. Key Responsibilities Develop and maintain cloud-native applications and services supporting manufacturing and engineering workflows. Support 24x7 manufacturing operations through on-call rotations, incident response, and root-cause analysis. Design and implement scalable microservices, APIs, and containerization systems utilizing Kubernetes orchestrator and cloud native applications. Architect secure cloud solutions spanning application, data, networking, identity, and observability domains. Build and maintain CI/CD pipelines, Infrastructure-as-Code, and DevOps automation. Provide technical leadership for contractor and partner development teams across multiple geographic regions, driving architecture, implementation, and operational excellence for cloud-native solutions. Collaborate with manufacturing, engineering, and software teams to deliv

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

PWI R&D Writing Systems Engineer Description - A Writing Systems Engineer is an experience individual contributor responsible for owning system-level performance of industrial inkjet web presses , with a strong emphasis on hands-on engineering, on-press troubleshooting, and technical leadership . This role leads complex problem solving across ink, printhead, media, firmware, and mechanical systems, driving print quality, reliability, and robustness through a combination of deep systems thinking and direct experimentation . The specialist serves as a key decision-maker in resolving ambiguous, cross-functional issues and ensuring successful product delivery. Responsibilities Hands-on system ownership & advanced troubleshooting (Primary) Serve as the technical owner for system-level performance , including print quality, reliability, and production robustness Lead hands-on troubleshooting on industrial web presses , diagnosing complex print defects (banding, mottle, nozzle behavior, edge effects, etc.) Design and execute on-press experiments (DOEs) to isolate root causes and quantify system sensitivities Drive root cause analysis across subsystems (ink formulation, printhead, firmware, mechanics, media) and implement corrective actions Support press bring-up, ramp, customer escalations, and field issues , often in high-pressure situations requiring rapid, data-driven decisions Translate real-world press behavior into actionable engineering insights and design improvements System design & integration leadership Define and develop system-level solutions to optimize ink/media interactions, printhead performance, and image quality Lead integration of subsystems (ink, printheads, m

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom

Business Systems Manager Description - Position Summary Lead financial planning, manufacturing cost modeling, capital forecasting, and financial systems for MTD (MEMS Technology Development) and associated labs. Serve as a strategic partner to MTD labs, and executive leadership by translating financial and operational data into clear investment, resource, and long-range planning decisions. Core Responsibilities Financial Planning and Performance Lead annual budgeting, quarterly forecasts, Long-Term Planning, affordability reviews, capital prioritization, close activities, and executive financial reviews. Deliver variance, depreciation, headcount, scenario, and investment analyses with actionable recommendations. Provide timely reporting on financial results, operational trends, risks, and opportunities. Financial Systems and Data Governance Lead the vision, roadmap, and requirements for AMD (asset tracking), RaFT (forecasting tool), and related planning platforms. Govern cost objects, funding assignments, master data, reconciliations, and integrations across SAP, RaFT, AMD, eMagic (inventory finance system), and reporting tools. Improve data quality, usability, controls, and automation so systems remain trusted sources of record. Manufacturing Cost and Capital Leadership Lead manufacturing cost models and collaborate with Financial Analyst partners on ESC forecasts for wafer fabrication, development, and product platforms. Translate yield, capacity, and operating performance into cost, margin, funding, and investment insights. Help facilitate capital planning, depreciation and actuals reporting, purchase-order analysis, affordability assessments,

Advanced Facilities operations Maintenance and Repair Process Technician Description - At HP, we exist to amaze. Through the people we hire, the experiences we enable, the way we treat our customers and each other—and ultimately through the technology we create. HP’s Corvallis site is a hybrid development and manufacturing factory, supporting advanced R&D, prototype manufacturing, and low‑volume production in a semiconductor cleanroom environment. Our technicians work on cutting‑edge equipment and processes that directly enable next‑generation printing and manufacturing technologies. Responsibilities The primary function of this role is the day-to-day operations and maintenance of the facilities equipment that supports business needs. Knowledge of RODI/IWW systems, chemical handling and delivery systems, troubleshooting and repair and maintenance of systems. Knowledge of operations and repair for chemical dispense systems that support fab wafer manufacturing. Willingness to be on call and wear full face respirators while performing chemical duties. Streamlines activities under common initiatives, managing achievements and touchpoints to ensure alignment and unity. Executes design work that consistently meets defined quality standards within specified timelines. Identifies team needs regarding processes, tools, documentation, and asset management, and drives necessary changes to enhance efficiency. Conducts design reviews of blocks with peers and management to demonstrate that designs meet specification targets and requirements. Develops design systems and standards that can scale across organizations and can be deployed across various global businesses. Collaborates with platform architects and systems groups to define overall specifications based on system requirements. Acts as the

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, dedicated to creating world-changing technology that enriches the lives of every person on earth. Our Wafer Packaging Manufacturing (WPM) organization is at the forefront of advancing semiconductor packaging technologies, enabling groundbreaking product innovation. At Intel's Oregon campus, we are proud to be part of a legacy of innovation, collaboration, and excellence that continues to shape the future of technology. We are looking for a motivated and detail-oriented Metro Module Equipment Technician to join our Night Shift team in Oregon. In this hands-on role, you will be a critical contributor to the performance and reliability of Intel's semiconductor manufacturing equipment. You will troubleshoot, maintain, and optimize tools that are essential to Intel's production processes, directly supporting our ability to deliver cutting-edge technologies to the world. If you have a passion for problem-solving, a technical mindset, and a desire to make a real impact in the semiconductor industry, this is the opportunity for you. Key Responsibilities: Perform electrical and mechanical troubleshooting to diagnose and resolve issues in non-functioning manufacturing equipment Dismantle, adjust, repair, and reassemble equipment using Intel specifications, blueprints, manuals, and technical drawings Execute equipment setup, calibration, and preventative maintenance to ensure optimal tool performance Monitor and analyze equipment performance data; review and classify inline defects to drive continuous improvement Create detailed reports on system failures, update existing specifications, and develop new documentation to support equipment maintenance goals Coordinate with suppliers for serv