Verification Of Benefits Specialist in United States

Drata is building the trust layer between great companies - automating compliance, managing risk, and helping organizations prove trust continuously as they scale. We're Dratanauts: a global crew of 600+ professionals united by a culture that rewards integrity, ownership, and raising the bar, no matter where in the world we're working from. Why Join the Drata Team? At Drata, you're not maintaining legacy compliance software - you're building the agentic AI platform defining what trust looks like for the next generation of companies. Here's what makes the work itself worth showing up for: Problems without a playbook: You'll work at the edge of AI and security, building agentic governance, continuous compliance, and real-time trust verification to solve problems that don't have an established answer yet. You're writing it as you go. Real ownership, not just process: Our values center on owning outcomes and raising the bar, not checking boxes. You're expected to have opinions and back them. A seat at the table: Your perspective is unique and valued. Open debate and diverse viewpoints are built into how decisions actually get made here, at every level. Growth at rocketship speed: Drata is scaling fast, which means scope grows fast too. High performers get more ownership, visibility, and experience. A crew, not just coworkers: Dratanauts consistently describe a "come as you are" culture with sharp, curious people—the kind of team that makes hard problems genuinely fun to solve. See what they say here and follow us on LinkedIn for company news, employee stories, and career updates. Job Summary: As a member of the IT team, you will play an important role in helping Drata scale securely and thoughtfully as we grow. You’ll build, secure, and continuously improve the systems and processes that power our internal operations across identity and access management, device management, network security, SaaS administration, and workflow automation. This is a great opportunity for s

Drata is building the trust layer between great companies - automating compliance, managing risk, and helping organizations prove trust continuously as they scale. We're Dratanauts: a global crew of 600+ professionals united by a culture that rewards integrity, ownership, and raising the bar, no matter where in the world we're working from. Why Join the Drata Team? At Drata, you're not maintaining legacy compliance software - you're building the agentic AI platform defining what trust looks like for the next generation of companies. Here's what makes the work itself worth showing up for: Problems without a playbook: You'll work at the edge of AI and security, building agentic governance, continuous compliance, and real-time trust verification to solve problems that don't have an established answer yet. You're writing it as you go. Real ownership, not just process: Our values center on owning outcomes and raising the bar, not checking boxes. You're expected to have opinions and back them. A seat at the table: Your perspective is unique and valued. Open debate and diverse viewpoints are built into how decisions actually get made here, at every level. Growth at rocketship speed: Drata is scaling fast, which means scope grows fast too. High performers get more ownership, visibility, and experience. A crew, not just coworkers: Dratanauts consistently describe a "come as you are" culture with sharp, curious people—the kind of team that makes hard problems genuinely fun to solve. See what they say here and follow us on LinkedIn for company news, employee stories, and career updates. Job Summary: The Senior Platform Engineer II, AI Tooling on the Developer Experience Team (part of Foundation Engineering group) will lead the design and delivery of the internal AI platform that makes Drata's engineers more efficient - the tools, agents, and integrations that turn AI coding agents (and the rest of the AI dev stack) into a paved road for everyday engineering work. This is not a

We believe that the way people interact with their finances will drastically improve in the next few years. We’re dedicated to empowering this transformation by building the tools and experiences that thousands of developers use to create their own products. Plaid powers the tools millions of people rely on to live a healthier financial life. We work with thousands of companies like Venmo, SoFi, several of the Fortune 500, and many of the largest banks to make it easy for people to connect their financial accounts to the apps and services they want to use. Plaid’s network covers 12,000 financial institutions across the US, Canada, UK and Europe. Founded in 2013, the company is headquartered in San Francisco with offices in New York, Washington D.C., London and Amsterdam. The Credit team at Plaid builds lending solutions across the full lender lifecycle — including underwriting, verification, and servicing. We help lenders make faster, more informed decisions using consumer-permissioned financial data. Within Credit, the Insights team develops data-driven products including LendScore, Income Insights, CashFlow Insights, and Network Insights. These products power smarter credit decisioning for lenders of all sizes. As a Product Manager on the Insights team, you will drive execution across our portfolio of credit decisioning products. You’ll work closely with engineering and data science teams to ship high-quality product experiences, and partner with sales and marketing on go-to-market motions. You’ll report to the Insights product lead and play a critical role in ensuring we deliver on our roadmap commitments while maintaining the flexibility to pursue new product opportunities as they emerge. Responsibilities Own end-to-end execution of the product roadmap for LendScore, Income Insights, CashFlow Insights, Network Insights, and new Insights products Write product specs, define requirements, and work with engineering and data science to deliver features on schedule R

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a software engineer to help build the design methodology, software abstractions, and infrastructure that enable a small silicon team to develop complex chips rapidly and with high confidence. You will turn evolving architecture and design needs into reusable tools and workflows that improve iteration speed, quality, and then apply those tools to help construct world-class silicon. You’ll work closely across architecture, design, verification, performance modeling, and systems software. This role is well suited for an engineer who enjoys building high quality software and is motivated by the challenge of improving velocity and quality of the silicon development process. In this role, you will: Develop and scale design methodologies for rapid first-party chip development and apply them to construct complex custom chips Create abstractions that allow hardware structures, configurations, experiments, and results to be represented consistently across tools. Automate high-value engineering workflows and improve their reproducibility, observability, testability, and ease of use. Partner with architects, RTL designers, verification engineers, compiler engineers, and systems software engineers to gather requirements and then implement solutions. Use methodology and tooling to identify design risks early, accelerate iteration, and improve confidence in performance and implementation tradeoffs. Contribute across multiple aspects of software and hardware

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for a highly experienced RTL engineer to own critical on- and off-chip interconnect components for our custom AI accelerator platform. You will drive the microarchitecture and RTL implementation of scalable on-chip communication fabrics connecting high-bandwidth compute, memory, and I/O subsystems as well as purpose-built off-chip interfaces and protocols needed to enable custom computing at scale. This is a senior, hands-on engineering role with broad technical ownership. You will drive design from requirements through the full silicon lifecycle, from architecture definition and performance analysis through RTL implementation, verification closure, physical design convergence, bring-up, and production readiness. You will plan and oversee the work of junior engineers and help drive and develop productive engineering relationships with external partners and help manage partner execution. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own the microarchitecture, RTL design, and delivery of major SoC interconnect components, including network-on-chip fabrics, switches, routers, bridges, protocol adapters, arbiters, and traffic-management logic as well as off-chip protocol bridges and interfaces. Drive third party engagements to develop novel networking and interface protocols and silicon IP while ensuring high quality and de

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will develop and evolve the tooling ecosystem that hardware engineers rely on every day — from hardware compilers and IR transformations to simulation, debugging, and automation infrastructure. The work spans software engineering, compiler concepts, and practical hardware workflows, with direct impact on how quickly and effectively we design next-generation AI systems. You’ll collaborate closely with architects, RTL designers, and verification engineers to translate real engineering friction into durable, scalable tooling solutions. In this role you will: Build and improve the software tooling that makes hardware teams faster: compilation, IR transforms, RTL generation, simulation, debug, and automation. Extend and integrate hardware compiler stacks (frontends, IR passes, lowering, scheduling, codegen to Verilog/SystemVerilog) and connect them to real design workflows. Improve developer experience and reliability: reproducible builds, better error messages, faster iteration loops, and dependable CI and regression infrastructure. Work closely with designers and verification engineers to turn real pain points into durable tools. Dive into RTL when needed: read and reason about Verilog/SystemVerilog to debug issues, validate tool output, and improve debuggability. Be willing to go all the way down the stack when necessary, including gate-level views, synthesis results, and implementation artifacts. Help enable PPA optimization loops by building analysis and au

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Expansion Construction team is driving some of the most significant semiconductor manufacturing projects in the United States, including two high-volume manufacturing facilities in Boise, Idaho (ID1 and ID2) and a greenfield manufacturing facility in Clay, New York. Our team partners across engineering, construction, commissioning, and operations to deliver world-class facilities that support the future of technology and innovation. As the ID Quality Assurance Lead, you will be a key member of the US Expansion Strategic Programs team, reporting to the ID Sr. Commissioning Manager. In this highly visible role, you will lead quality governance across major capital projects, ensuring compliance, commissioning readiness, documentation integrity, and operational turnover excellence. You will serve as the primary owner-side quality leader, collaborating with contractors, vendors, inspection agencies, operations teams, and regulatory stakeholders to deliver successful project outcomes. Responsibilities: Lead quality governance, performance metrics, audit programs, reporting, and continuous improvement initiatives across Idaho capital projects Oversee contractor and vendor quality execution, including quality plans, inspections, testing, material verification, hold points, and compliance with project requirements Manage special inspection programs, testing agency coordination, regulatory interfaces, and turnover-ready quality documentation Align construction quality activities with co

Job Details: Job Description: Join an enthusiastic team of engineers in Intel's Networking Solutions Group (NSG) focused on enabling next generation of programmable Infrastructure Processing Units (IPUs) with our lead customers as part of the Customer Experience Support (CES) organization. Intel brings decades of leadership in networking, virtualization, packet processing, storage, and security to a new class of IPU products that accelerate host networking functions and support emerging use cases such as security, virtualization, storage, load balancing, and data path optimization. Working closely with major cloud service providers and Intel development teams, you will help deliver customized IPU based solutions that enhance isolation, security, performance, storage and system management for our customers. A big part of the day-to-day job is to help customers manage feature request processes, enable solutions, and debug issues. Projects and responsibilities include but are not limited to: • Gain our customers' trust, understand their needs, and build POCs to meet them. Work closely with internal and external partners to understand use cases and requirements. • Be the go-to technical resource for customers building complex Datacenters, AI infrastructure as well as helping them understand performance characteristics for solutions. • Prepare and deliver technical content to customers including presentations, workshops, etc. • Contribute across the full IPU lifecycle, including board and platform bring up, low-level device initialization, OS driver and kernel configuration, system management, feature enablement, use case testing, debugging, and verification. • Defines systems implementation and integration solutions and plans to ensure optimum performance and reliability across hardware, firmware and software w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Work Flexibility: Hybrid or Onsite Stryker is hiring a Senior Quality Engineer to join our Neurovascular division. This is a hybrid r ole based in Fremont, CA or Salt Lake City, UT . As the Senior Design Quality Engineer , you will be actively involved in Product Risk Management, Post Market Surveillance, Design Control and Product Quality Improvement. You will be involved in a fast-paced mix of short design change efforts and will be responsible for product risk management and adherence to design control requirements throughout the product lifecycle. You will be responsible for ensuring that post market data and feedback is channeled into the risk management system throughout the product lifecycle. You will make regular use of problem-solving tools and statistical analysis to analyze and trend data and provide quality input into technical investigations, perform test method development and validation, design verification, risk assessment and design reviews. You will be responsible for supporting product testing and failure analysis, writing protocols and reports, creating and maintaining risk files and assessing the impact of necessary changes to our products. You will lead initiatives to increase sales and improve the customer experience of our devices. Neurovascular (NV) products push the boundaries of technology to meet ever increasing product performance requirements, making the goal of assessing and demonstrating, safety, performance and compliance an exciting challenge. What You Will Do Develop qualification plans, protocols, and reports for new products, existing products, components, and subassemblies. Execute product testing, inspection, verification, and validation activities to support design and quality objectives. Perform failure investigations and root cause anal

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity As a Mechanical Engineering Intern, you will contribute to the mechanical design and thermal validation of advanced AI hardware. Working alongside experienced mechanical and thermal engineers, you will gain hands-on experience with 3D computer-aided design (CAD), laboratory setup, test development, prototype evaluation, and engineering documentation. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You’ll Do Contribute to mechanical design activities using Creo or comparable 3D CAD software, including part modeling, assemblies, drawings, and design updates under the guidance of experienced engineers. Work with the thermal engineering team to develop test procedures and help set up laboratory capabilities for evaluating AI hardware. Support thermal and mechanical testing using appropriate laboratory equipment; collect, organize, and analyze test data. Assist the mechanical and thermal design teams with prototype evaluation, troubleshooting, design verification, and documentation of findings. Collaborate with cross-functional engineering partners, communicate progress and issues clearly, and follow applicable laboratory and safety procedures. What You’ll Bring Current enrollment in a bachelor's, master's, or doctoral program in mechanical engineering or a related discipline during the internship. Students in other disciplines with relevant mechanical engineering exper

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As