Workload Porting And Performance Engineer in United States

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. In this role you will: As a Hardware Test Engineer, you will work on Machine Learning/AI hardware system projects to craft the solutions for current and future data center deployments. You will bring a strong understanding of hardware system testing, excellent project management skills, and the ability to collaborate across multiple teams to ensure efficient lab operations. You will be responsible for designing, implementing, and executing comprehensive test plans that ensure the reliability, performance, and scalability of our supercomputing hardware systems. You will develop detailed test plans and methodologies tailored to hardware components, including processors, memory modules, custom accelerators and interconnects. You will collaborate with hardware design, manufacturing, firmware teams and vendors to identify, analyze, and resolve issues affecting hardware, power, thermal and high-speed interconnects. You will perform in-depth debugging on the hardware system Excellent analytical skills to diagnose hardware issues, troubleshoot problems, and propose solutions. Ability to interpret complex test data, identify trends, and draw meaningful conclusions. High-speed links, with a focus on SerDes (Serializer/Deserializer) technology to assess signal integrity, error rates, and overall link performance. You will collaborate with the lab manager to maintain the equipment and hardware systems, including oscilloscopes, thermal test chambers, liquid cooling systems, and other mea

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will build the model runtime within the inference engine that executes complex, frontier models at scale on OpenAI’s custom silicon. The runtime will sit between models running on the hardware and the upper layers of the cluster serving software stack, translating demanding inference workloads into efficient execution while optimizing for throughput, latency, utilization, and reliability. You will work across model architecture, distributed systems, compilers, kernels, and silicon to design a production-grade runtime comparable in ambition to systems such as vLLM and SGLang, but customized and optimized for OpenAI’s AI accelerator. Your work will shape how new model capabilities map onto the platform and how quickly custom silicon can deliver meaningful performance in production. In this role, you will: Design and implement the LLM inference runtime for frontier models running on custom silicon. Build scheduling, continuous batching, memory management, KV-cache management, and execution orchestration for high-performance inference. Develop distributed execution strategies across chips, hosts, and racks, including model partitioning, communication, and synchronization. Optimize end-to-end latency, throughput, memory efficiency, and hardware utilization across diverse model architectures and serving workloads. Partner with kernel, compiler, architecture, and silicon teams to co-design interfaces and remove performance bottlenecks across the stack. Enable new

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will build the low-level device runtime that turns compiled programs into efficient, functional and performant execution on OpenAI’s custom AI accelerator. This software will schedule kernel launches, manage device memory and address spaces, coordinate synchronization, and expose reliable abstractions to higher-level runtimes and frameworks. You will work at the boundary of software and hardware, partnering with compiler, kernel, architecture, verification, and silicon teams to define interfaces and validate behavior. You will also use and improve event-based, cycle-accurate simulation to develop runtime capabilities before silicon is available, diagnose performance and correctness issues, and guide hardware-software co-design. In this role, you will: Design and implement the low-level device runtime for OpenAI custom silicon. Build kernel-launch scheduling, command submission, queueing, dependency tracking, and completion handling. Manage device memory spaces, allocation, virtual-to-physical mappings, data movement, and lifetime across concurrent workloads. Implement synchronization primitives, events, barriers, streams, and ordering guarantees that are correct and efficient. Define clean interfaces between the runtime, drivers, firmware, compiler-generated code, kernels, and higher-level execution systems. Use event-based, cycle-accurate simulators to develop, validate, debug, and performance-tune runtime behavior before and after silicon availability. Di

NVIDIA's DGX Cloud (DGXC) powers AI for strategic research and product workloads. The company seeks a Senior Technical Program Manager (TPM) to lead complex, cross-functional programs powering NVIDIA’s next-generation AI software platforms. In this role, you will drive software initiatives across platform services, cloud infrastructure, and system integration. The focus is on enabling scalable, reliable, and supportable software for AI workloads. You will be responsible for managing high-impact engineering programs within a dynamic, fast-paced roadmap, aligning priorities across teams, and ensuring timely, high-quality delivery. This role requires strong technical competence, a proactive approach, and the ability to operate effectively across multiple levels of the organization. This is a software-first TPM role. The ideal candidate has extensive experience managing software initiatives. They also understand the full-stack environment, including infrastructure dependencies, system bring-up, integration readiness, and operational needs to support software across stack layers. What You'll Be Doing: Lead end-to-end execution of software platform initiatives, including planning, execution, delivery, and operationalization. Work together with software, infrastructure, product, and operations teams to ensure alignment on goals, deliverables, achievements, and schedules. Lead cross-functional initiatives encompassing cloud-native services, platform software, system integration, and release delivery. Help connect software roadmap execution to full-stack readiness, including dependencies across infrastructure, bring-up, validation, and downstream operational support. Identify cross-functional dependencies, mitigate risks, and drive resolution of complex technical and programmatic issues. Establish clear success metrics and reporting mechanis

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a Product Manufacturing Engineer to drive manufacturing strategy and execution for next-generation AI hardware within the Silicon & Systems team, with a particular focus on PCBA manufacturing, assembly, process development, and production readiness. You will work closely with design engineering, systems engineering, operations, TPMs, contract manufacturers, suppliers, and other external partners to ensure new hardware products successfully transition from concept and prototype builds through NPI and high-volume production. You’ll own critical manufacturing initiatives, identify and resolve production risks, and help establish the processes and controls required to deliver complex hardware at scale. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Drive manufacturing and quality initiatives to ensure product success from concept and early development through NPI, production launch, and scale. Lead manufacturing process development for next-generation AI hardware systems, partnering closely with design engineering, systems engineering, operations, TPMs, suppliers, and manufacturing partners. Own PCBA manufacturing development and production readiness, including assembly processes, process validation, manufacturing test, rework, yield improvement, and successful transition into volume production. Establish NPI manufact

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

At ClickUp, we're building the future of work: the first truly converged AI workspace unifying tasks, docs, chat, calendar, and enterprise search, all supercharged by context-driven AI. We are an AI-native company. Every team member is expected to leverage AI daily, and we evaluate AI fluency as part of our hiring process. Join us and help redefine what's possible. 🚀 Job Summary We are looking for a GTM DevOps Engineer to join our Business Systems team and own the reliability, automation, and delivery infrastructure behind our Go-To-Market (GTM) technology stack. This role sits at the intersection of platform reliability and CI/CD engineering, ensuring that our critical business systems — including Salesforce, NetSuite, MuleSoft, Workato, and an expanding portfolio of AI-powered workloads — are deployed consistently, operate resiliently, and scale with the business. You will partner closely with Business Systems developers, architects, and business stakeholders to build and maintain the pipelines, monitoring frameworks, and operational standards that keep our GTM systems healthy and our release cycles fast and predictable. As our team builds and deploys AI agents across GCP Cloud Run and AWS Bedrock AgentCore, you will serve as the infrastructure and deployment owner for these workloads — bringing engineering discipline to an environment where AI-generated code is increasingly entering production. This is a hands-on engineering role for someone who thrives in complexity, takes ownership of platform uptime, and brings a software engineering mindset to business application operations — directly supporting GTMSOE's broader mission of operational excellence across the GTM org. Key Responsibilities CI/CD & Release Engineering Design, build, and maintain CI/CD pipelines for Salesforce (SFDX/Salesforce CLI), NetSuite (SuiteScript/SuiteBundler), MuleSoft (Anypoint Platform), and Workato; establish branching strategies, environment promotion standards, and release gatin

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role As an AI Accelerator Systems Software Technical Program manager at OpenAI, you will help bring our chips/system hardware roadmap to life, navigating an array of technical and partnership challenges. We’re looking for people excited to push the frontiers of computing by navigating technical explorations and are passionate about building. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Manage the end-to-end software development from design to implementation for our AI acceleration systems, working across technical, cross-functional and external stakeholders Lead planning and scheduling of AI system software designs with our strategic partners and vendors Coordinate and lead internal resources and communication for efficient interaction with partners and vendors. You might thrive in this role if you: Have experience as a software technical program manager for data center system products (server, GPU, TPU, networking, storage and so on) taking products from concept to volume in a data center environment ensuring the systems scale with high quality Know end-to-end software development program management techniques from concept, design, production, deployment into the data center Want to help design some of the world’s largest supercomputing systems, working at the edge of complex hardware challenges Enjoy working with and enabling world-clas

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a software engineer to help build the design methodology, software abstractions, and infrastructure that enable a small silicon team to develop complex chips rapidly and with high confidence. You will turn evolving architecture and design needs into reusable tools and workflows that improve iteration speed, quality, and then apply those tools to help construct world-class silicon. You’ll work closely across architecture, design, verification, performance modeling, and systems software. This role is well suited for an engineer who enjoys building high quality software and is motivated by the challenge of improving velocity and quality of the silicon development process. In this role, you will: Develop and scale design methodologies for rapid first-party chip development and apply them to construct complex custom chips Create abstractions that allow hardware structures, configurations, experiments, and results to be represented consistently across tools. Automate high-value engineering workflows and improve their reproducibility, observability, testability, and ease of use. Partner with architects, RTL designers, verification engineers, compiler engineers, and systems software engineers to gather requirements and then implement solutions. Use methodology and tooling to identify design risks early, accelerate iteration, and improve confidence in performance and implementation tradeoffs. Contribute across multiple aspects of software and hardware

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We're looking for an Optical Interconnect System Engineer to design, qualify, and deploy scalable optical connectivity for large-scale AI infrastructure. This role spans fiber-system architecture, optical-mechanical integration, validation, reliability, deployment, and serviceability. You will work with optical, mechanical, electrical, networking, manufacturing, reliability, and data-center teams to translate system needs into practical interconnect solutions. This is a hands-on role for someone who can connect design decisions with installation, qualification, troubleshooting, and long-term operational performance. In this role, you will: Define optical interconnect architectures and requirements across hardware platforms and rack-level systems. Design high-density fiber systems for performance, density, reliability, installation, and serviceability. Lead optical-mechanical integration and cross-functional design reviews. Develop test and qualification plans for optical components, modules, switching platforms, and integrated systems. Own optical loss budgets, routing guidelines, handling requirements, and serviceability criteria. Support system bring-up, deployment, troubleshooting, failure analysis, and reliability improvement. Create reusable design guidelines, interface requirements, and qualification methods. You might thrive in this role if you have: Core experience Experience desi

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for an experienced systems software engineer to help define and build the host software stack for our custom next-generation AI systems. You will work close to the hardware on performance-critical software, including Linux kernel drivers, high-throughput I/O paths, and system-scale networking and RDMA. This role spans architecture, implementation, platform bring-up, debugging, and performance optimization. You will work across hardware and software boundaries to make new systems usable end to end, from low-level device interfaces through userspace tooling and production validation. In this role you will: Design, implement, and debug host-side systems software for AI infrastructure, including Linux kernel drivers and supporting userspace components. Build and optimize software paths for high-throughput, low-latency communication, including RDMA and related networking functionality. Develop software around PCIe, DMA, NICs, accelerators, memory movement, and device interaction. Bring up new hardware platforms and diagnose complex issues across kernel, firmware, networking, and hardware boundaries. Build tooling for integration, testing, diagnostics, observability, qualification, and performance characterization. Collaborate with hardware, networking, and platform teams to define interfaces and integrate new capabilities. Work with external vendors where needed to integrate technologies and drive issues to resolution. Contribute across the systems sof

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for a highly experienced RTL engineer to own critical on- and off-chip interconnect components for our custom AI accelerator platform. You will drive the microarchitecture and RTL implementation of scalable on-chip communication fabrics connecting high-bandwidth compute, memory, and I/O subsystems as well as purpose-built off-chip interfaces and protocols needed to enable custom computing at scale. This is a senior, hands-on engineering role with broad technical ownership. You will drive design from requirements through the full silicon lifecycle, from architecture definition and performance analysis through RTL implementation, verification closure, physical design convergence, bring-up, and production readiness. You will plan and oversee the work of junior engineers and help drive and develop productive engineering relationships with external partners and help manage partner execution. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own the microarchitecture, RTL design, and delivery of major SoC interconnect components, including network-on-chip fabrics, switches, routers, bridges, protocol adapters, arbiters, and traffic-management logic as well as off-chip protocol bridges and interfaces. Drive third party engagements to develop novel networking and interface protocols and silicon IP while ensuring high quality and de

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We're seeking a Security Engineer to join our First-Party Hardware team. In this role, you will own the end-to-end security foundation for OpenAI's first-party AI hardware systems, working across hardware security, embedded security, system security, and practical deployment at data center scale. You will partner with silicon, hardware, firmware, infrastructure, manufacturing, operations, and security teams to define and deliver system-level device trust. This includes boot integrity, device identity, provisioning, attestation, management-plane security, storage encryption, debug controls, firmware update and recovery, RMA, and decommissioning. You will be accountable for turning threat models into requirements, requirements into implementation, and implementation into validation evidence that can support launch decisions. Location: San Francisco, CA (Hybrid: 3 days/week onsite) Relocation assistance available. In this role, you will: Own security requirements, threat models, validation strategy, and launch-readiness evidence for first-party hardware platforms from early design through production deployment. Design and review secure boot, measured boot, roots of trust, platform firmware resilience, firmware signing, recovery, and anti-rollback strategies across heterogeneous devices. Own device identity, provisioning, enrollment, attestation, certificate lifecycle, and key-management requirements across manufacturing and data center bring-up. Harden management