Salary not disclosed
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Role overview
Job description
FII USA, Inc ., a Foxconn Technology Group Company, is seeking an Industrial Engineer to optimize manufacturing processes and enhance workflow efficiency in PCBA operations. Once a part of the team, you will be responsible for a wide variety of tasks within the Industrial Engineering Department in a production environment and have the opportunity to display critical thinking skills to expand your career in Smart Manufacturing. The Industrial Engineer will analyze production processes, implement lean manufacturing principles, and drive continuous improvement initiatives while collaborating with cross-functional teams to ensure high-quality output. Analyze and optimize PCBA production processes through statistical analysis, time studies, and workflow mapping to achieve 20%+ efficiency improvements while maintaining quality standards and cost targets Lead implementation of Lean Manufacturing, Six Sigma (DMAIC), and Kaizen initiatives, including developing value stream maps, conducting Kaizen events, and establishing KPIs to reduce cycle times by 15-25% Perform comprehensive time and motion studies using predetermined time systems (MOST/MTM), analyzing workstation layouts and operator movements to improve throughput by 30% and enhance ergonomic conditions Design and optimize assembly line configurations using line balancing techniques, takt time analysis, and labor modeling to achieve 95%+ line efficiency and optimal workforce utilization Research, evaluate and implement automation solutions including pick-and-place machines, AOI systems, and collaborative robots, resulting in 40% reduction in manual operations Partner with Quality Engineering team to conduct FMEA, implement poka-yoke devices, and establish process controls to reduce defect rates below 50 PPM Drive cost reduction initiatives through material optimization, labor efficiency improvements, and process innovations, delivering $500K+ annual savings Create and maintain detailed SOPs, work instructions, and process documentation using TWI methodology to ensure 100% process standardization Develop simulation models using software like FlexSim or Arena to validate process improvements and optimize material flow Lead DFM/DFA reviews with engineering teams to improve product designs for manufacturability and assembly efficiency Implement real-time production monitoring systems and develop dashboards to track OEE, yield, and other critical metrics Design and execute pilot programs for new manufacturing technologies and methodologies before full-scale implementation Other duties as assigned Bachelor's degree in Industrial Engineering, Manufacturing Engineering, or related field required 2-5+ years experience in PCBA manufacturing or electronics manufacturing required Lean Six Sigma certification (Green/Black Belt) preferred Must be able to stand and walk for extended periods, lift up to 25 pounds occasionally, and work in a manufacturing environment Comprehensive benefits package including medical, dental, and vision insurance coverage. Basic life insurance and short-term disability coverage provided by employer. Supplemental life insurance and long-term disability coverage options available. 401K with employer contribution. Personal, Vacation, and Holiday paid time off for all full-time employees. Onsite Aurora Health & Wellness Center available for all employees. Employees are continuously encouraged to learn and grow their careers in smart manufacturing.
About this listing
- Source: Foxconn WI's official careers site · still listed there on 12 Nov 2026
- First seen by Jobiba 12 Nov 2026
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What they are looking for
Skills & requirements
Department · Oracle L10/L11
Hiring company
Foxconn WI
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