Physical Design Engineer - STA

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking talented Physical Design Engineers to implement high-performance partitions for an industry-leading AI SOC. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid, based out of Austin,TX or Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are Experienced with synthesis and place-and-route flows, especially using Synopsys Design Compiler / Fusion Compiler and IC Compiler II. Comfortable in a small, cross-functional physical design team, owning a block or subsystem and partnering on tapeout milestones with clear communication and accountability. Ideally bring extra depth in areas such as UPF/multi-voltage power domains, SoC interface IP integration (e.g. I3C, UART), signoff breadth (DRC/LVS, EM/IR, LEC/Formality), multi-clock/CDC-aware implementation, PLL/DLL integration, and DFT-aware physical implementati

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent licenses RISC-V and AI IP to customers who need hardened, PPA-proven deliverables on their target node and foundry. This role owns physical implementation of those IP blocks end to end, from synthesis through PnR, timing closure, and GDSII signoff, and directly determines how fast we can commit to a customer's timeline. This role is hybrid, based out of Toronto, ON; Austin, TX; or Belgrade, Serbia. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on physical design engineer who owns blocks end to end, with a track record of block-level and IP tapeouts on advanced nodes. Driven by PPA outcomes, working closely with RTL owners to close critical paths and hit power budgets. Rigorous about signoff quality, because our IP ships to customers who integrate it without you in the room. What We Need BS/MS/PhD in EE/ECE/CE/CS with 5+ years of block-level or IP-centric physical design through tapeout. Expertise with industry-standard tools (Innovus, ICC2/FusionCompiler, PrimeTime) and scripting languages (Tcl, Python, Perl). Deep understanding of advanced node challenges, low-power design (UPF, power gating, multi-Vt, voltage sc

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a talented Physical Design Engineer to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid, based out of Austin, TX or Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts. Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration. Strong problem solver who excels at debugging complex issues across design hierarchies. Collaborative team player who thrives in fast-paced, technically challenging environments. What We Need BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs. Expertise with industry-stan

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an Physical Design Engineer to lead cross-functional efforts to solve complex physical design challenges and develop end-to-end RTL-to-GDS methodologies across advanced nodes, with a strong focus on PPA and runtime improvements. The engineer will architect, integrate, and deploy AI/ML-driven solutions into production physical design flows, creating custom CAD tools and partnering with internal teams and EDA vendors to drive next-generation, ML-enabled capabilities. This role is hybrid, based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are BS in Electrical or Computer Engineering (or equivalent experience) with 5+ years in Physical Design CAD methodology at advanced nodes. Proven track record improving PPA and/or runtime on high-performance, low-power taped-out designs. Hands-on with industry-standard EDA tools (e.g., Fusion Compiler) across synthesis, P&R, STA, signoff, and hierarchical flows. Strong Python/Tcl and data skills, with interest or experience in ML frameworks (PyTorch, TensorFlow), and the ability to drive complex projects independent

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an exceptional Senior-level Physical Design Engineer to drive top-level implementation of our complex AI and CPU System-on-Chip designs. You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level. If you excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware, we need your expertise. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned physical design engineer who thrives on complex, full-chip implementation challenges. Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams. Passionate about optimizing chip-level implementations for power, performance, and area. Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules. What We Need 8+ years of top-level SOC physical design experience on complex, multi-million gate designs. Deep expertise in hierarchic

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Our IP delivery timelines are set as much by flow maturity as by design work. This role develops, deploys, and owns the RTL-to-GDSII methodology the IP physical design team runs on, so a new block, node, or customer variant starts from a working flow instead of a cold start. This role is hybrid, based out of Toronto, ON; Austin, TX, or Belgrade, Serbia. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A physical design or CAD methodology engineer who has built flows that production teams depend on daily. Automation-minded, happiest when you are removing manual steps and making PPA exploration repeatable. Building with AI as part of how you develop flows, and opinionated about where LLMs and ML-driven optimization genuinely help versus where they do not. An effective partner to design teams and EDA vendors, and a clear writer who documents flows well enough that others can run them without you. What We Need An Engineer with 5+ years developing and supporting physical design methodology or CAD flows in production use. Expertise with industry-standard tools (FusionCompiler/ICC2, Innovus/Genus, PrimeTime, RedHawk) and scripting languages (T