3d Animator Jobs

At Zoox, you will collaborate with a world-class, multidisciplinary engineering team spanning AI, robotics, mechatronics, computer vision, and automated testing. Because a robot is in control of the vehicle, you will be constantly challenged to rethink traditional engineering paradigms to design elegant, ultra-efficient hardware systems from the ground up. Working in this agile, forward-thinking environment gives you the unique opportunity to manifest your creativity, push the boundaries of vehicle dynamics, and directly shape the future of autonomous mobility. As a Staff Engineer on the Chassis Actuator team specializing in Steering and Braking Systems, you will hold end-to-end design and release responsibility for the components powering our innovative autonomous by-wire platform. Sitting at the intersection of hardware and software, you will lead the development, execution, and delivery of critical engineering milestones for an active chassis system. You will manage Tier 1 supplier relationships to deliver high-performance hardware and controls software while aggressively meeting cost, weight, timing, and performance targets. Your scope will span from core component development to system integration support and hands-on vehicle-level testing and CAN signal analysis. Working in a highly cross-functional environment, you will bridge the gap between physical hardware and autonomous execution, collaborating daily with Vehicle Integration, Func In this role, you will: Own the product lifecycle of the Zoox Robotaxi steer-by-wire and brake-by-wire systems from initial concept through production, managing the development of mechanical hardware, software, and complex electromechanical systems. Design and release 3D CAD models and 2D drawings with appropriate GD&T for both internal fabrication and external supplier production. Define and manage comprehensive component and system requirements, encompassing mechanical,

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. As part of Packaging Design Team, you will need to think about how to make the perfect unboxing experience for users, keep the safety for transportation, out of the box, break impossibility, and be open to discussion in pursuit of perfection.We don’t just expect you to build products simply but to be proud of what we do. Are you ready to embrace challenges in a fast-paced organization? Join UI, refresh us with your crazy but creative ideas, and make a great impact on the world together! Responsibilities (What he/she will do after join UI): Primarily focus on improving MP packaging design. Modify the packaging structure to enhance the unboxing experience and reduce costs simultaneously. Review samples, DFM, and SOPs. Ensure the structure passes the reliability test. Internal: Work closely with Packaging Designers & Packaging Design PMs. External: Work closely with CMs & Suppliers. Minimum Qualifications (MUST-haves) : Logical thinking / Proactive personality. Effective communication and time management skills. 3+ years of experience in development of packaging structure design. Experienced using 2D: AutoCAD Experienced using 3D: Rhino or Solidworks or ProE Knowledge of material processing for pulp tray, cardboard, blister, gift box, carton and all types of printing processes. Knowledge of a wide variety of packaging

Job Details: Job Description: The Role and Impact We are seeking a Silicon Packaging Design Architect to join our team, where you will drive end-to-end package solutions for physical, electrical, and cost requirements. In this senior engineering role, you will collaborate with cross-functional teams to design, troubleshoot, and continuously improve packaging standards and processes, ensuring high-quality package output. Your contributions will directly impact the seamless transition of designs to production and enhance Intel's advanced packaging technologies. Business Group As part of Intel Corporation's dynamic and innovative ecosystem, this role resides within the Silicon Packaging Architecture team, focused on developing advanced packaging solutions that enable Intel's cutting-edge silicon technologies. The team plays a vital role in ensuring packaging, and 3D IC designs meet technical, mechanical, and reliability standards while supporting Intel's broader mission to drive world-changing advancements in technology. Key Responsibilities Translate product requirements into detailed package architecture specifications. Drive technology tradeoff decisions to ensure silicon packages conform to electrical, mechanical, thermal, and reliability standards. Collaborate with silicon, hardware, and package teams to deliver high-quality package solutions and overcome roadblocks. Oversee the end-to-end package development process, including design, procedures, and continuous improvements to quality standards. Troubleshoot packaging designs and resolve issues related to materials and processes, providing innovative and cost-effective solutions. Implement co-design strategies between silicon and board design teams to optimize product

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. Your responsibilities will include, but are not limited to, the following: Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet pr

Industrial Designer Location: Remote — candidates must be currently based in the United States. About Us Atari, one of the world's most iconic entertainment brands, is a pioneer in interactive entertainment. With operations spanning gaming, e-commerce, licensing, and hardware, Atari thrives at the intersection of innovation and legacy. Join our dynamic team and play a key role in shaping the financial health of our diverse business operations. About the Role We are seeking a creative and passionate Industrial Designer to help establish our internal product design capabilities. You’ll bring your knowledge of concept design, manufacturing, video games, pop culture, and niche fandoms to our growing team. In this role, you will create and iterate on industrial designs in electronics and collectibles to surprise, delight, and connect with our fans. You’ll support the design process from early concepts through production, creating beautiful, functional, and brand-appropriate consoles, controllers, and collectibles. Our collaborative, fast-paced team values creativity, ownership, and bringing products to life quickly. This is a hands-on role for a designer who enjoys prototyping, iterating, and solving real-world product challenges. What You'll Do Product Design & Development Design exciting products that capture the heart of our brands and licensed collaborators while satisfying the needs of our audiences. Collaborate closely with the Creative team to bring 3D designs to life in solutions that convey appropriate visual and tactile messages with consideration for the production process and cost targets. Help develop and mature our existing product design language. Generate multiple concept directions for assigned projects and advance strong solutions within the agreed concept and refinement timelines Prepare and develop concepts for user testing through prototypes or renderings. Support designers with generating and communicating the visual and physical a

Why RoboForce RoboForce is an AI robotics company developing Physical AI–powered Robo-Labor for dull, dirty, and dangerous work. The company’s robots are engineered for demanding industrial environments, with a focus on real-world deployment and scalability. We are looking for a motivated Mechanical Design Engineer Intern to join our team. This is a hands-on opportunity to design, prototype, test, and iterate on robotic hardware for real-world deployment. You will work alongside experienced mechanical, electrical, and robotics engineers on ambitious, real-world problems. You will help turn ideas into tested hardware and see how your designs perform as part of complete robotic systems. Responsibilities Design mechanical parts, mechanisms, and assemblies for robotic systems. Create and update 3D CAD models and engineering drawings . Perform basic engineering analysis, tolerance checks, and FEA. Support prototype fabrication, assembly, testing, and design iteration. Collaborate with mechanical, electrical, and robotics engineers during system integration. Requirements Currently pursuing a Bachelor’s, Master’s, or PhD in Mechanical Engineering, Robotics, Mechatronics, or a related field, or graduated within the past 6 months . Strong mechanical design fundamentals. Experience with SolidWorks or Fusion 360 . Hands-on experience designing and building mechanical hardware through coursework, research, internships, robotics teams, or personal projects. Familiarity with manufacturing processes such as CNC machining, sheet metal, or 3D printing. Able to work on-site in Milpitas, CA, five days per week (40 hours/week) Bonus Qualifications Experience with robotic arms, actuators, transmissions, mobile robots, or end-effectors . Familiarity with GD&T, tolerance stack-up, FEA, and DFM . Machine-shop or rapid-prototyping experience. Experience taking a design from CAD to manufactured and tested hardware . Benefits Company-provided lunch and dinner, a fully stocked

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: • Own and deliver critical HBM IO blocks and subsystems from architectural definition through circuit and RTL implementation, verification, tape-out, silicon bring-up, and post-silicon debug, including interfaces supporting future CPO systems. • Define HBM PHY, controller-to-PHY, die-to-die, clocking, training, calibration, power-management, error-handling, and test requirements for advanced heterogeneous systems. • Drive robust, high-performance builds by balancing bandwidth, latency, power, area, reliability, electrical signal quality, power stability, yield, and manufacturability trade-offs. • Lead architecture and design of analog, mixed-signal, and digital interface functions used in high-speed memory subsystems. • Partner with package, interposer, physical design, signal integrity, power integrity, and thermal teams to optimize interface implementation across 2.5D and 3D systems. • Lead root-cause analysis and resolution of complex pre-silicon and post-silicon issues across circuit design, RTL, architecture, process, package, interposer, and system interactions. • Serve as technical project lead for one or more advanced interface programs, coordinating execution across architecture, design, layout, verification, validation, packaging, test, and product engineering teams. • Define and communicate technical priorities, interface specifications, execution plans, risks, dependencies, and schedule impacts. • Work with internal teams, customers, IP pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of the Heterogeneous Integration Group within Technology and Products, where we build High Bandwidth Memory solutions that power AI and ML platforms. Our team works at the edge of what’s possible, stacking and integrating advanced silicon technologies to deliver industry‑leading bandwidth, density, and power efficiency. We move fast, solve hard problems, and set technical direction others follow! This role sits at the center of next‑generation HBM development. As a senior SI/PI technical authority, you will shape system‑level decisions that directly impact performance, reliability, and scalability across multiple product generations. If you enjoy deep technical ownership, complex problem solving, and influencing architecture from concept to sign‑off, this role offers both challenge and impact. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Lead signal integrity channel analysis for 2.5D and 3D silicon interposers, including frequency‑ and time‑domain evaluation Define and drive power delivery architecture, impedance targets, and transient analysis Perform electromagnetic extraction and modeling across PCB, package, and interposer designs Establish SI/PI standards, methodologies, and sign‑off criteria for HBM system designs Provide clear technical direction in ambiguous or incomplete design environments Minimum Qualifications: 7 years of experience in

Level Up Your Career with Zynga! At Zynga, we bring people together through the power of play. As a global leader in interactive entertainment and a proud label of Take-Two Interactive, our games have been downloaded over 6 billion times—connecting players in 175+ countries through fun, strategy, and a little friendly competition. From thrilling casino spins to epic strategy battles, mind-bending puzzles, and social word challenges, our diverse game portfolio has something for everyone. Fan-favorites and latest hits include FarmVille™, Words With Friends™, Zynga Poker™, Game of Thrones Slots Casino™, Wizard of Oz Slots™, Hit it Rich! Slots™, Wonka Slots™, Top Eleven™, Toon Blast™, Empires & Puzzles™, Merge Dragons!™, CSR Racing™, Harry Potter: Puzzles & Spells™, Match Factory™, and Color Block Jam™—plus many more! Founded in 2007 and headquartered in California, our teams span North America, Europe, and Asia, working together to craft unforgettable gaming experiences. Whether you're spinning, strategizing, matching, or competing, Zynga is where fun meets innovation—and where you can take your career to the next level. Join us and be part of the play! Position Overview: To strengthen our current and future game developments, we are looking for an experienced Senior Technical Artist to join a specialized technical team focused on prototyping and creating "new games" using AI. You should have the technical skills to implement the tools and solutions our projects need, while also being able to communicate effectively with different project teams, artists, and programmers. Your primary objective is to reinvent mobile game development pipelines by capitalizing as much as possible on current AI tools. What You'll Do: Act as a "one-man army" across various disciplines (2D, 3D, animation, UI) to rapidly build and test prototypes. Reinvent traditional art workflows by evaluating and integrating state-of-the-art AI tools to maximize production efficiency. Mediate

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach's Summer 2027 Engineering Internship, Mechanical is open for future engineers and builders who want to work with us. This is a paid, in-person, 12-week internship. Depending on your background and team placement, you might work on: Mechanical design — CAD, assemblies, mechanisms, and structural components for next-generation systems Prototyping & manufacturing — turning designs into hardware through machining, fabrication, 3D printing, and other manufacturing processes Testing & validation — building test setups, running experiments, analyzing results, and improving designs Structures & mechanisms — designing components that withstand demanding mechanical, thermal, and environmental requirements Systems integration — integrating mechanical hardware with electrical, embedded, and autonomous systems Engineering tools & analysis — simulations, modeling, tolerance analysis, and tools that accelerate hardware development What We're Looking For Enrollment in a BS, MS, or PhD program in mechanical or a related engineering discipline Intellectual curiosity and the drive to own problems end-to-end Genuine interest in defense technology, national security, or the future of autono

Who We Are Verkada is transforming how organizations protect their people and places with an integrated, privacy-sensitive AI-powered platform that includes solutions for video security, access control, air quality sensors, alarms, intercoms, and visitor management. We’ve got serious momentum in the market: more than 30,000 customers (including 100+ of the Fortune 500), a $5.8B valuation , more than $1 billion in annualized bookings, and backing from CapitalG, Sequoia Capital, General Catalyst, Felicis Ventures, Next47 and more. Physical AI is one of the most consequential technology shifts of our time, and Verkada is at the center of it. You can look at all kinds of communities to see our platform’s impact in the world. It's the retailer that uses our agentic AI to deter theft before it happens. The warehouse that uses AI-powered alerts to make sure its team is protected on the floor with proper PPE. The school that’s alerted to a threat in real-time and triggers a lockdown in seconds, not minutes. We’re rapidly scaling this impact: today, more than 2 million Verkada devices are deployed across 170+ countries. About the Role We are looking for a founding Staff Engineer to lead the technical architecture of our next-generation Spatial Platform. For the past decade, floor plans have been static images; we are rebuilding that foundation from the ground up as a high-performance, interactive, and collaborative 3D engine. This is a greenfield role for a builder who wants to own a core pillar of Verkada’s infrastructure before we hit the public markets. You won't just build features—you will architect a platform that supports 8+ product lines, solving the "hard math" of geospatial projections and the "hard graphics" of rendering thousands of interactive assets at a buttery-smooth 60 FPS. What You'll Do Build the Rendering Platform: Design a high-performance rendering architecture that supports both an interactive viewer for high-density geospatial visualizatio

Job Details: Job Description: Join Intel's Silicon and Platform Engineering Group (SPE) as an Exempt Tech Contract Employee, The Role and Impact :As a Power Integrity Engineer, you will play a pivotal role in ensuring Intel's platforms and products meet the highest standards of performance and reliability. This position offers you the opportunity to work on cutting-edge technologies, designing and optimizing power delivery networks for complex high-speed platforms, boards, packages, and silicon. Your contributions will directly impact Intel's ability to deliver industry-leading solutions to its customers, driving innovation in power integrity and enhancing the performance and functionality of our silicon and systems. Join us to tackle exciting challenges and create impactful solutions that push technological boundaries. The primary responsibilities for this role will include, but are not limited to: Develop and analyze power delivery networks, including 2D and 3D model extraction and noise analysis across die/C4 bumps, silicon, package, sockets, and boards. Define power grid specifications and power and area targets to achieve optimal balance between power integrity and performance. Design test structures, electrical analysis methodologies, and verification plans to address power integrity challenges. Perform measurements to characterize power noise profiles across frequency, ground bounce, and other critical metrics, verifying power delivery networks post-design. Correlate measurements back to presilicon analysis and estimations for improved accuracy. Apply expertise in power integrity design and tradeoffs to guide simulations of power networks and physical implementations for packages and platforms. Ensure on-die power noise meets system-on-chip (SoC) functionality an

What if the work you did every day could impact the lives of people you know? Or all of humanity? At Illumina, we are expanding access to genomic technology to realize health equity for billions of people around the world. Our efforts enable life-changing discoveries that are transforming human health through the early detection and diagnosis of diseases and new treatment options for patients. Working at Illumina means being part of something bigger than yourself. Every person, in every role, has the opportunity to make a difference. Surrounded by extraordinary people, inspiring leaders, and world changing projects, you will do more and become more than you ever thought possible. We are seeking a Senior Mechanical Engineer to support new product development in genomics instrumentation. This is a highly technical mechanical design role focused on the development of custom mechanisms, precision motion systems, and electromechanical assemblies used in advanced instrumentation. The ideal candidate will be an engineer with experience designing motorized mechanisms and precision motion systems, including a strong understanding of system requirements, motion architecture, controls integration, structural design, and performance validation. The ideal candidate also has experience developing motion solutions from requirements through implementation and understands the engineering principles behind achieving precise, reliable motion in complex systems. Responsibilities Design and develop custom mechanical mechanisms for use in genomics instruments, including motion systems, precision assemblies, and fluidic or sample‑handling components. Integrate mechanical designs with electrical, firmware, and control systems Create and maintain 3D CAD models, engineering drawings, and support

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND . You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Main Responsibilities: As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts Advance

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre