Advance Packaging Process Development Engineer Jobs

Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering — Fab 10A, Singapore. Apply via Workday.

What We're Looking For: We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team. Ideal Background: Experience with integrated photonics package assemblies with multiple dies Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc. Nice to Have: Experience with large device count photonic assemblies Experience with clear underfill Experience with high density fiber attach Experience with large substrate size photonic MCM assemblies Hands-on experience with PIC design

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify, diagnose, and propose yield related breakthroughs. You will have opportunity to work wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking for an Advanced Packaging Metrology-RDA Engineer to join our Advanced Packaging Technology Development (APTD) team! Your responsibilities include but are not limited to developing and enabling innovative inspection and metrology techniques to enable advanced packaging technologies. You will also be required to identify , diagnose, and propose y

Job Details: Job Description: The Role and Impact We are seeking a dynamic individual to lead global supply chain engineering and commercial teams in optimizing supply chain performance and fostering supplier relationships in support of Advanced Packaging Technology and Manufacturing (APTM) operations. In this role, you will drive operational excellence by integrating supplier strategies with Intel's manufacturing capabilities, collaborating closely with cross-functional teams to develop and implement strategies across global manufacturing sites. Business group Strategic Parts and Service Supply Chain (SPSC) is part of the Foundry Construction and Sourcing (FCS) team in Intel Foundry. We play a pivotal role in developing and managing supply chain solutions supporting Intel Foundry's wafer/packaging development and manufacturing operations. Key Responsibilities - Lead global supply chain teams to optimize supplier performance and operational efficiency through clear metrics, market intelligence, and continuous improvement. - Build strategic supplier partnerships to drive long-term engineering and supply chain roadmaps aligned with future technological needs. - Lead benchmarking and industry intelligence to drive supplier and technology improvements in factory equipment spares and service products. - Provide leadership through goal setting, facilitating team execution, maintaining accountability, and driving performance management practices. - Inspire and develop teams to achieve results while role modeling Intel values and creating a productive work environment. Qualifications: Minimum Qualifications - Bachelor's degree in a relevant field. - 12+ years of progressive experience with a Bachelor's degree, 10+ years of experience with an advanced degree in supply chain, engineering

Job Details: Job Description: As a Module Equipment Technician, you will play a vital role in ensuring the smooth operation of advanced manufacturing equipment used in semiconductor production. You will perform hands-on troubleshooting, maintenance, and calibration of electromechanical systems while supporting experiments and equipment modifications that drive cutting-edge advancements. Your work will directly contribute to enhancing equipment reliability and optimizing production efficiency, making an essential impact on Intel's manufacturing operations. Business Group Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) organization, a leader in delivering innovative and cost-effective substrate packaging solutions. This business group is focused on advancing Intel's capabilities in manufacturing technology to maintain competitive excellence across global markets. As part of this dynamic team, you will support critical equipment and collaborate on continuous improvement initiatives that align with Intel's broader mission of innovation and growth. Key Responsibilities Perform electrical and mechanical troubleshooting to diagnose issues with manufacturing equipment. Execute setup, calibration, corrective and preventative maintenance on production equipment, including wet chemistry, plating, and dry high-vacuum toolsets. Monitor tool performance and analyze data to identify and address equipment-related issues. Collaborate with engineering and support teams to improve equipment reliability and reduce downtime. Document maintenance activities, repair findings, and parts usage using established systems and procedures. Lead or contribute to continuous improvement projects, focusing on equipment optimization and yie

Job Details: Job Description: Intel is one of the world's leading semiconductor companies, driving innovation across computing, connectivity, and manufacturing. With a legacy of technological excellence and a bold vision for the future, Intel is committed to pushing the boundaries of what's possible — from the chip to the cloud. Our Advanced Packaging Technology Development – Substrate and Wafer Assembly (ATPD: SWA) organization is at the forefront of delivering innovative, cost-effective packaging solutions that power the next generation of technology. At Intel, we believe in investing in our people, fostering a culture of continuous learning, and empowering every team member to make a meaningful impact. We are looking for a skilled and motivated Manufacturing Equipment Technician to join our ATPD: SWA team in Arizona. In this role, you will be responsible for maintaining, troubleshooting, and optimizing advanced electromechanical equipment that is critical to Intel's semiconductor manufacturing operations. Your work will directly contribute to Intel's manufacturing innovation, production efficiency, and global competitiveness. This is an exciting opportunity to work with cutting-edge technology in a world-class cleanroom environment while growing your technical career at one of the most recognized names in the semiconductor industry. Shift Information This role operates on Shift 7: 6:00 AM – 6:18 PM on an alternating weekly schedule: Alternating 3-Day (Thu/Fri/Sat) and 4-Day (Wed/Thu/Fri/Sat) work weeks Key Responsibilities: Troubleshoot and resolve electrical and mechanical issues across a range of advanced manufacturing equipment. Perform equipment setup, calibration, and both corrective and preventive maintenance, with a f

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Responsibilities Perform electrical and physical failure analysis on advanced packaging products to identify root causes of defects and failures using advanced failure analysis tools. Perform sample preparation, cross-sectioning, decapsulation, polishing, microscopy inspection, and other laboratory techniques as required for failure analysis investigations. Operate and maintain analytical equipment such as Optical Microscopes, SEM, EDX, FIB, X-ray, C-SAM, and other failure analysis tools. Write and document failure analysis findings, and FA reports in a timely manner. Ensure compliance with laboratory safety requirements, equipment operating procedures, quality management systems, and 6S housekeeping rules. Participate in continuous improvement initiatives to enhance laboratory efficiency, analytical capability, and turnaround time. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhanc

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron’s vision is to transform how the world uses information to enrich life for all . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing. Job Summary The Package Health Test Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on en

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As Package Characterization Lab Manager within Advanced Packaging Technology Development (APTD), you will lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. You will provide technical direction, own lab operational excellence and workforce development, ensuring timely, high‑quality results that directly impact critical APTD technical decisions. This role partners closely with Micron's global engineering labs, subject-matter experts and external vendors to expand lab capability, efficiency and ensure forward-looking readiness for new technologies. Responsibilities and Tasks Lab Management, Compliance & Audits Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards. Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency. Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime. Evaluate and introduce new FA tool models and capabilities in partnershi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. An Operations Improvement Engineer is a key member of the Operations Improvement (OI) Team. This role is responsible for driving performance optimization across PWF, Assembly (HBM, advanced packaging) and T est Operations by identifying improvement opportunities in output, cycle time, cost, and efficiency. It involves applying industrial engineering principles to enhance core manufacturing functions such as line management, production planning, scheduling and dispatching. Additionally, the role supports factory automation initiatives by exploring and implementing innovative solutions that streamline processes and reduce variability. Key Responsibilities: Identify and analyze optimization opportunities within PWF, Assembly (HBM, advanced packaging) and Test

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Join Micron in Shaping the Future of Semiconductor Manufacturing Help drive the strategic decisions behind Micron's global Assembly & Test network. As a Senior Financial Analyst , you will influence critical investments, manufacturing strategies, and technology roadmaps that support the production of the world's most advanced memory and storage solutions. Working with leaders across the business, you will turn complex manufacturing and financial challenges into actionable insights, helping Micron strengthen its competitive advantage and accelerate innovation in a dynamic, fast-paced industry. Job Responsibilities Lead complex Conventional and Advanced Packaging scenario studies and financial analyses to support Micron’s Assembly & Test manufacturing network. Partner closely with Operations, Engineering, Supply Chain, and Finance leadership teams to evaluate business scenarios and provide data-driven recommendations. Develop cost models and financial analyses to support key decisions related to cost competitiveness, capacity planning, manufacturing network optimization, and technology transitions. Manage the increasing volume, speed, and complexit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron Technology’s vision is to change how the world uses information to improve life. Our dedication to people, innovation, tenacity, collaboration, and customer focus helps us fulfill our mission to lead globally in memory and storage solutions. We conduct business with integrity, accountability, and professionalism while supporting our worldwide community. We are looking for Engineers to become part of the Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, concentrating mainly on transitioning new product from development to high-volume manufacturing. The position partners closely with stakeholders such as Develo

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre