Assembly Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, Inc., you will join a team responsible for bringing next-generation High Bandwidth Memory (HBM) products from design through high-volume manufacturing. This role plays a critical part in improving product reliability, accelerating production ramp, and enabling early time-to-market through advanced failure analysis. You will focus on analyzing failures from production test, internal qualification, and customer returns (RMA), using a combination of electrical, physical, and data-driven techniques to identify root causes related to fabrication or assembly processes. Key Responsibilities Perform electrical failure analysis and fault isolation using techniques such as emission microscopy, laser-based methods, and EOTPR. Analyze and model failure signatures from backend testing, qualification, and RMA data. Apply physical failure analysis (PFA) and de-processing techniques to isolate defects. Develop and maintain deep technical knowledge of CMOS/FinFET fabrication processes, device structures, and process integration. Generate clear, organized, and timely failure analysis reports, including root cause and corrective action insights. Collaborate multi-functionally with Product, Process, Assembly, Quality, and Management teams to communicate findings and drive resolution. Apply AI-assisted tools and workflows to analyze large datasets, identify failure patterns, and accelerate root-cause determination. Support flexible work sch

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an Industry 4.0 (I4.0) Product Owner at Micron Technology, Inc., you will lead the definition, development, and delivery of end-to-end smart manufacturing solutions to empower Micron Assembly and Test Operation to improve cost, scale, quality and productivity. You will bridge business, engineering, and data science teams to drive Industry 4.0 transformation, leveraging industry best methods, advanced analytics, automation, and AI/ML to optimize planning and manufacturing operations. This role requires deep expertise in I4.0 technologies and strong hands-on data science skills to deliver impactful, scalable solutions across global operations. Key Responsibilities Product Ownership & I4.0 Leadership Define and drive the I4.0 product roadmap, aligning with business objectives and manufacturing strategies. Lead cross-functional teams (engineering, IT, data science, operations) to deliver integrated smart manufacturing solutions. Gather, analyze, and prioritize requirements from end users and stakeholders, develop business cases, validate impact, and propose high-ROI projects for implementation. Understands business problems and effectively translates user requirements into technical specifications—and vice versa—for data science, technical

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality Driving innovation into the future Memory generations within a dynamic work environment Demonstrate openness to leveraging AI‑based tools and automation to improve design efficiency, accelerate analysis, and explore innovative solutions across the design and verification workflow. Minimum Qualifications Bachelor’s degree in electrical or computer engineering with 12-15 years of experience with DDR5, LPDDR5, LPDDR6, or HBM3 or in any other memory related field. Preferred Qualifications Strong communication and teamwork skills.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the Assembly and Test (AT) IP Security Engineer, you will be part of the AT BISO (Business Information Security Officer) Organization. You will partner with Micron’s Enterprise Infrastructure and Security (EIS) and your business area (Assembly and Test) to implement security controls, reduce risk, and maintain business continuity. You will work within Assembly and Test organizations (and sites) to identify risks, help classify data and establish processes which are aligned to Micron’s security disciplines. You will serve as an ambassador for Assembly and Test Organization to protect Micron’s most sensitive data (Intellectual Property). You will institutionalize a security-first culture across AT operations and ensure compliance with micron’s security standards, whilst ensuring AT Business continuity Key Responsibilities Act as a Liaison with EIS team and AT business are to support roadmaps, strategies, and requirements to improve Micron’s security policies. Bridge security goals and commitments with articulated business needs driving towards a common set of goals and objectives Participate in defining clear goals and strategic initiatives to improve our security posture in line with Micron’s 7 Security Disciplines. Secure Data Handling: Help secure micron’s most Sensitive Data (Sensitive Data Protection Program), through Data Classification and Inventorization. Help define and implement Entitlement Policy Management

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior Manager, Strategy Lead (Quality Systems) at Micron Technology, Inc., you will report to the Smart Manufacturing and Artificial Intelligence organization, focusing in Micron Assembly and Test areas. The team defines, drives, and delivers end-to-end smart manufacturing solutions, integrated across business functions. The team investigates the application of industry-leading methodologies in automation, AI, and machine learning to enhance Micron’s product development, business, and administrative processes across the company. Responsibilities and Tasks Establish Strong partnership with Global Stakeholders to identify significant and breakthrough business transformation opportunities using AI Translate expected project metrics gains into dollar values, partnering with Finance. Lead the analysis of complex business problems and issues using data from internal and external sources to provide insights to decision-makers. Identify and interpret trends and patterns in datasets to locate influences. Construct forecasts, recommendations, and strategic/tactical plans based on business data and market knowledge. Create specifications for reports and analyses based on business needs and required or available data elements. Provide con

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the Assembly and Test (AT) IP Security Engineer, you will be part of the AT BISO (Business Information Security Officer) Organization. You will partner with Micron’s Enterprise Infrastructure and Security (EIS) and your business area (Assembly and Test) to implement security controls, reduce risk, and maintain business continuity. You will work within Assembly and Test organizations (and sites) to identify risks, help classify data and establish processes which are aligned to Micron’s security disciplines. You will serve as an ambassador for Assembly and Test Organization to protect Micron’s most sensitive data (Intellectual Property). You will institutionalize a security-first culture across AT operations and ensure compliance with micron’s security standards, whilst ensuring AT Business continuity Key Responsibilities Act as a Liaison with EIS team and AT business are to support roadmaps, strategies, and requirements to improve Micron’s security policies. Bridge security goals and commitments with articulated business needs driving towards a common set of goals and objectives Participate in defining clear goals and strategic initiatives to improve our security posture in line with Micron’s 7 Security Disciplines. Secure Data Handling: Help secure micr

Job Details: Job Description: As one of the world's largest semiconductor manufacturers, Intel is committed to advancing every aspect of semiconductor technology, from process development and manufacturing to advanced packaging and reliability characterization. Employees within Intel Foundry are part of a global network spanning technology development, manufacturing, assembly, test, and quality organizations across both front-end silicon and advanced packaging facilities. You will join the Foundry Lab Network (FLN), a key organization within Foundry Quality, Reliability, and Labs (FQRL), located at Intel's growing Chandler, Arizona site. This site serves as the technology development hub for Intel's most advanced packaging technologies, including Hybrid Bond Interconnect (HBI), Embedded Multi-die Interconnect Bridge (EMIB-T), glass substrates, Foveros, and future advanced packaging innovations. FLN is actively expanding its laboratory capabilities and capacity to support Intel Foundry's roadmap, enabling faster technology qualification and accelerating development cycles through Quick Turn Monitoring (QTM) solutions that significantly reduce time-to-data. As the Stress Test and Reliability (STaR) Back-End Laboratory Manager, you will play a critical leadership role within FLN. You will partner closely with Packaging Technology Development, Quality and Reliability, and Failure Analysis teams to establish and enhance laboratory capabilities that support qualification and certification of next-generation packaging technologies and products. This position offers a unique combination of people leadership, technical problem solving, and organizational strategy. You will lead a team of 7-10 talented engineers, spearhead cross-functional efforts to resolve complex reliability and technology challenges, drive strong quality and operati

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As a Process Integration & Yield Enhancement Engineer of Micron, you will be responsible for driving manufacturing performance through systematic variability reduction across assembly and test. You will leverage statistical analysis and advanced data analytics to rapidly identify yield improvement opportunities and support timely, accurate production issue resolution. Through daily analysis of inline, alarm, electrical test, and experimental data, you will enable best-in-class yield, quality and reliability performance in high-volume manufacturing. Responsibilities and Tasks: Demonstrates strong understanding of yield analysis methodologies, Backend assembly and test processes, and their characteristic impacts on yield, quality and product performance. Apply knowledge of semiconductor device behavior, materials, and backend manufacturing processes to diagnose and resolve yield and reliability issues using statistical and data‑driven analysis tools. Identify and communicate process-, material-, and equipment‑related yield sensitivities to assembly and test process owners and actively support corrective actions and process optimization. Collaborate effectively with Quality, Manufacturing,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a capacity planning engineer, you will be responsible for ensure accurate capacity model through periodic audits and validation of workstation performance, capital asset utilization (CAU), and cycle time using static and dynamic models. You will also need to identify opportunities to improve capacity, minimize capital expenditures and cycle time. Responsibilities and Tasks: 1. Ensure tool capacity is well positioned to meet output requirements at the manufacturing area levels. 2. Drive areas to close gaps in performance of tools with in a workstation through internal bench marking. 3. Work with engineering team and partner with ATCP(Assembly&Test Central Planning) to understand and close the gaps in workstation performance to meet external benchmark levels. 4. Understand the impact to the driven by output changes through scenario analysis. 5. Understand individual area’s Entitled Cycle Time (ECT) for a given scenarios. 6. Organize & Lead the continuously improvement Project to optimize the work flow as well as capacity model. 7. Applying Artificial Intelligence : use AI improvement to reduce the efforts from the job. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, te

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall layout, and optimization of Memory/Logic/Analog layouts Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success Working with Marketing, Probe, Assembly, Test, Process Integration, and Product

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Yield Enhancement Engineer at Micron, you will be part of a forward-thinking team of engineers that solves sophisticated problems, responsible for enabling Micron’s products with magnificent and issue free release to both internal and external customers! We are the key interface between Research and Development, Manufacturing, Marketing, and Quality Assurance departments. This position will need to have work shift and hours flexibility (position requires day to night shift rotations in intervals of 4 months). Responsibilities: Identify causes of low yield through detailed analysis Work closely with various engineering groups in resolving process/defects related issues Perform physical failure analysis to understand the failure mechanism relating to assembly defects and fab process Apply statistical tools for detailed data analysis on product to drive yield improvement projects Certify in and follow chemical safety procedures Train and gain experience doing Physical Failure Analysis Use internal training resources to become familiar with manufacturing processes and test flow Develop expert level skills using Focused Ion Beam (FIB), Scanning Electron Microscope (SEM). Minimum Qualifications: B.S. in Chemical Engineering, Mechanical Engineering, Material Science & Engineering Demonstrate teamwork, self-development, drive for result

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality Driving innovation into the future Memory generations within a dynamic work environment About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description The MSH PDE Process Integration (PI) Manager leads a team of Process Integration engineers responsible for the successful execution of High Bandwidth Memory (HBM) New Product Introduction (NPI) from early development through High Volume Manufacturing (HVM) . This role combines people leadership, technical oversight, and cross‑functional execution , ensuring PI readiness, yield ramp, and risk mitigation across wafer fabrication, assembly, and test. The manager is accountable for delivering NPI commitments while developing a strong, scalable PI organization. Job Responsibilities People Leadership & Talent Development Lead, coach, and develop a team of MSH PDE PI engineers across multiple experience levels Set clear expectations, goals, and priorities aligned to NPI and business objectives Provide regular feedback, performance evaluations, and career development guidance Build organizational capability through hiring, onboarding, mentoring, and succession planning Foster a culture of accountability, collaboration, and technical excellence HBM NPI Execution & Delivery Own PI execution for HBM NPI programs, en

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Overview As a Staff/Senior Process Development Engineer within PDE-CEM, you will leverage advanced semiconductor process characterization, failure analysis, yield analytics, and process integration expertise to accelerate product and technology development. The role focuses on developing robust assembly processes, improving yield and reliability, supporting New Product Introduction (NPI), and utilizing data-driven methodologies to optimize manufacturing performance. The ideal candidate combines strong semiconductor physics knowledge, advanced characterization skills, yield improvement experience, and cross-functional leadership capability to drive continuous process innovation and manufacturing excellence. Key Responsibilities Process Development & Characterization Develop and optimize Process of Record (POR) for assembly and packaging technologies. Establish process windows, process capability targets, and characterization strategies. Apply statistical methodologies including DOE, SPC, JMP, and Six Sigma to characterize and optimize manufacturing processes. Drive early process learning through advanced characterization and failure analysis techniques. Yield Improvement & Problem Solving</