Band6 Jobs

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a senior High Speed Interconnect / Signal Integrity Engineer to design and validate high-bandwidth links for large-scale AI systems. You will define, model, and qualify interconnect solutions across copper and optical technologies for next-generation AI inference and training clusters. This role is on-site in Santa Clara, CA, Austin, TX, or Toronto, Canada. We welcome candidates at various experience levels. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting Who You Are An experienced electrical engineer with a Bachelor’s or Master’s in Electrical Engineering. 5+ years working on high-speed communications (100G–1.6T), including signal integrity, channels, and links. Comfortable building and owning link and channel budgets and making clear tradeoffs between reach, loss, BER, and margin. Hands-on with SI tools and lab equipment such as Keysight ADS, VNAs, TDRs, BERTs, and protocol analyzers. Familiar with cable specification and testing, as well as accelerated life testing, mating life, and failure analysis. Able to collaborate across hardware, systems, and manufacturing teams; manufacturing/DFM/DTM experience is a plus. What We Need Define and specify high-speed interconnect architectures

Locum - Medical Laboratory Assistant (Biochemistry) HCA Labs at Shropshire House, are looking for an MLA who can work the below requirement: - Start date: ASAP - End date: Ongoing - Monday to Friday - Shifts times of 08:00 to 16:30, 09:00 to 17:30 and 12:00 to 21:00 * candidate must be available for all shift times, pro rota * - Band 4/5 ( pending candidate CV review ) - £16 - £20 per hour Skills/Experience required : - Loading and unloading Cobas 8000 analysers - Running P671/P612 - Filing samples - Aliquoting samples for referrals - Pending lists (in-house and referral) - Reagent management - Email responses re customer service - Answering phone calls

EnCharge AI is a leader in advanced AI hardware and software systems for edge-to-cloud computing. EnCharge’s robust and scalable next-generation in-memory computing technology provides orders-of-magnitude higher compute efficiency and density compared to today’s best-in-class solutions. The high-performance architecture is coupled with seamless software integration and will enable the immense potential of AI to be accessible in power, energy, and space constrained applications. EnCharge AI launched in 2022 and is led by veteran technologists with backgrounds in semiconductor design and AI systems. About the Role EnCharge AI is seeking a highly skilled Device Driver Engineer to design and implement high-performance driver stack for our cutting-edge AI accelerator hardware. In this role, you will work closely with hardware, firmware, and AI software teams to develop low-latency, high-bandwidth communication between the host system and AI accelerator. Responsibilities Develop, optimize, and maintain Linux/Windows PCIe device drivers for AI accelerators. Implement low-level hardware interactions, DMA, memory management, and interrupt handling. Work on driver optimizations to reduce latency and improve throughput for AI workloads. Debug and troubleshoot PCIe protocol, kernel panics, crashes, and performance bottlenecks. Collaborate with hardware, firmware, and AI software teams to define driver interfaces. Ensure compliance with PCIe standards (Gen4/Gen5), SR-IOV, BAR memory mapping, and IOMMU. Support virtualization (VFIO, SR-IOV, DPUs) and containerized environments (Kubernetes, Docker, etc.). Develop tools for profiling, debugging, and monitoring driver performance. Contribute to open-source kernel modules if applicable. Qualifications Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, or a related field. 3+ years of experience in device driver development for Linux and/or Windows. Strong experience with PCIe-based hardware, including BAR

Registered General Nurse needed in West Midlands We are working in partnership with one of our valued clients in the West Midlands area who are looking for enthusiastic, dedicated General Nurses to join their team. If you are looking for long term, guaranteed block booking shifts across winter into spring, then look no further! Here, you’ll find a supportive environment, opportunities for professional growth, and the chance to provide exceptional care to our diverse community. Be part of a team that values your expertise and dedication. Are you interested in, Long days (07:30 am – 20:00pm) Nights (20:00pm- 08:00am) You have the flexibility of choosing your preferred shifts patterns of long days and or nights, available Monday-Sunday. Position: Registered General Nurse Band 5 Location: West Midlands Duration: 6 months (starting September 2024) Shifts: Minimum 2 long days or 2 long nights per week (up to 7 days a week) Pay rate: £16.60- £29.95 What We Offer: Competitive pay rates (Up to £29.95 hourly) Flexible shift patterns Supportive team environment Opportunity to be part of a new and innovative project Requirements: Minimum 6 months UK based Nursing experience Valid NMC registration Strong communication and interpersonal skills Ability to work independently and as part of a team How to apply? If this is for you, we would love to start your application process. All you have to do is email your updated CV to [email protected] , and our consultants will reach out to you or contact 033 3577 3410 for more information. Don’t miss out on this chance to be part of something amazing. Apply today and let’s create something great together!

1. Operation Urethane machine #1 and #2 Check the air compressor for Urethane Units 1 and 2. Constant temperature for Coating mantle and check product check Operation of the cooling unit on the panel Check the temperature of the raw material Check the temperature of the dispenser Ensure that the heating furnace of the band heater of the raw material is properly maintained Check the condition of the drum's raw material being transferred to the tank well and check the vacuum condition. Urethane machine setting – check the overall groove of the Assembly engine and check the temperature of the Cure oven Full groove fixing of cooling – check cooling temperature Secure and verify the entire groove of the demold section Full groove fixing and verification of unloading section Check the temperature of the preheater After cleaning the nozzle of the robot's dispensing, attach the mixer. Check the urethane molding ball eccentricity 2. Mold cleaning work – 2 times/ 1year day cleaning work Mold replacement Mold disintegration Sanding application of release agent Mold assembly 3. Ball inspection 4. Ball extraction TaylorMade Golf Company is an equal opportunity employer. All qualified applicants receive consideration for employment without regard to race, religious creed, color, national origin or ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, pregnancy, gender, gender identity, gender expression, age, sexual

1. Operation Urethane machine #1 and #2 Check the air compressor for Urethane Units 1 and 2. Constant temperature for Coating mantle and check product check Operation of the cooling unit on the panel Check the temperature of the raw material Check the temperature of the dispenser Ensure that the heating furnace of the band heater of the raw material is properly maintained Check the condition of the drum's raw material being transferred to the tank well and check the vacuum condition. Urethane machine setting – check the overall groove of the Assembly engine and check the temperature of the Cure oven Full groove fixing of cooling – check cooling temperature Secure and verify the entire groove of the demold section Full groove fixing and verification of unloading section Check the temperature of the preheater After cleaning the nozzle of the robot's dispensing, attach the mixer. Check the urethane molding ball eccentricity 2. Mold cleaning work – 2 times/ 1year day cleaning work Mold replacement Mold disintegration Sanding application of release agent Mold assembly 3. Ball inspection 4. Ball extraction TaylorMade Golf Company is an equal opportunity employer. All qualified applicants receive consideration for employment without regard to race, religious creed, color, national origin or ancestry, physical or mental disability, medical condition, genetic information, marital status, sex, pregnancy, gender, gender identity, gender expression, age,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Within the HBM organization, this role is part of a highly collaborative team focused on advancing next-generation High Bandwidth Memory (HBM) solutions through deep characterization, modeling, and root-cause analysis. The team partners closely with Design Technology Co-Optimization (DTPCO), Product Engineering, Packaging, Test, Reliability, and Technology Development organizations to drive product innovation and quality. This role is critical to achieving DTPCO objectives by developing a first-principles understanding of HBM cube limitations and validating hypotheses through silicon data and supporting models. The position focuses on custom bench-level characterization of HBM devices under thermal, mechanical, and electrical stress conditions to improve product performance, yield, reliability, and adaptability across future HBM generations. Responsibilities Design, build, debug, and complete custom bench-level test setups, fixtures, and measurement flows using laboratory equipment including power supplies, SMUs, oscilloscopes, thermal systems, handlers, sockets, and probe cards. Perform thermal, mechanical, and electrical characterization of HBM cubes under hot/cold, transient, and forced-temperature conditions, including power-temperature correlation, warpage analysis, stress characterization, tim

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a global leader in memory and storage innovation, accelerating the transformation of information into intelligence. The High Bandwidth Memory (HBM) Heterogeneous Integration Group (HIG) develops advanced memory solutions that power next-generation Machine Learning (ML), Artificial Intelligence (AI), and high-performance computing applications. Our team brings together experts across design, validation, manufacturing, test, and quality to deliver industry-leading products through a highly collaborative and innovative environment. As a Design Validation Product Engineer, you will play a critical role in the development and validation of next-generation HBM products from design through qualification and high-volume manufacturing. This position provides the opportunity to work at the intersection of semiconductor design, silicon validation, hardware and software debugging, and data analysis while collaborating with multi-functional teams around the world. The level of responsibility will be aligned with a combination of education, experience, and demonstrated technical capabilities. Responsibilities Develop expertise in JEDEC HBM specifications, internal architecture documentation, and HBM design schematics and layouts. Perform silicon validation and characterization of HBM products using laboratory equipment, circuit simulations, debugging techniques, and data analysis. Collaborate closely with Product Engineering, Design, Manufacturing, Test, Quality, and other multi-functional teams to id

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a global leader in memory and storage innovation, accelerating the transformation of information into intelligence. The High Bandwidth Memory (HBM) Heterogeneous Integration Group (HIG) develops advanced memory solutions that power next-generation Machine Learning (ML), Artificial Intelligence (AI), and high-performance computing applications. Our team brings together experts across design, validation, manufacturing, test, and quality to deliver industry-leading products through a highly collaborative and innovative environment. As a Design Validation Product Engineer, you will play a critical role in the development and validation of next-generation HBM products from design through qualification and high-volume manufacturing. This position provides the opportunity to work at the intersection of semiconductor design, silicon validation, hardware and software debugging, and data analysis while collaborating with multi-functional teams around the world. The level of responsibility will be aligned with a combination of education, experience, and demonstrated technical capabilities. Responsibilities Develop expertise in JEDEC HBM specifications, internal architecture documentation, and HBM design schematics and layouts. Perform silicon validation and characterization of HBM products using laboratory equipment, circuit simulations, debugging techniques, and data analysis. Collaborate closely with Product Engineering, Design, Manufacturing, Test, Quality, and other multi-functional teams to id

We are seeking a professional with a hospitality background and at least 5-6 years of experience in front desk operations. The candidate should be experienced in visitor management call handling receptionist duties and general administrative support. Address: 18TH FLOOR, CAPITAL BUILDING, STAR BUCK, GR. FLOOR, OPP. ICICI BANK TOWAR, BACK ENTRANCE, BKC, BANDRA - EAST, 400051 Facility: PFIZER- MUMBAI- OFFICE- CORE FM Qualification: Graduate Experience: 5 - 10 years Preferred Gender: FEMALE Source: Sodexo India | Job Code: IJP575698

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: <span

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About the Team At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops future High-Bandwidth Memory (HBM) architectures, PHY design methodologies, and automation solutions that enable next-generation AI, high-performance computing, networking, and data center applications. The team works closely with Architecture, Design Engineering, Verification, Product Engineering, and external partners to advance memory technologies while improving design quality, productivity, and development efficiency. Position Overview As a Senior or Graduate Engineering Intern, you will collaborate with experienced HBM architects and engineers to support the development of digital design methodologies, automation frameworks, timing analysis flows, and architecture validation solutions for next-generation HBM PHY and IO subsystems. This role offers hands-on experience in digital design, verification, automation, and timing analysis, while providing opportunities to leverage AI Assisted engineering workflows, Large Language Models (LLMs), and Generative AI tools to enhance engineering productivity and design efficiency. Responsibilities Support digital design, integration, and timing analysis activities for HBM PHY and IO subsystems, including timing constraint development and timing closure efforts. Develop an

Key Responsibilities Act as liaison between the Client s representative and Sodexo Coordinate and schedule projects with the Facility Manager Work with outside vendors and contractors as required Direct all facility personnel to assist in day-to-day operations and project completion Daily inspection of premises for cleanliness and hygiene and take corrective actions as and when required On-time submission of monthly requisition of cleaning/disposable materials uniform stationary and cash. These requisitions should be done on prescribed formats. Responsible for training and replacement of the staff Apply and follow the contractual obligations policies and procedures. Establish and maintain cordial relationship with the Client. Maintain a safe environment for all facility employees visitors and staff Address: & 34 Nav Bharat Mega Developers Pvt. Ltd. (Adani) Inspire BKC 6th floor Bharat Nagar Near Mahanagar Gas Opp ICICI Bank BKC Bandra East Mumbai & 34 Facility: NAVBHARAT DEVELOPERS FM MUMBAI BKC Qualification: Graduate Experience: 2 - 3 years Source: Sodexo India | Job Code: IJP560591

NVIDIA Networking division is a leading supplier of innovative end-to-end InfiniBand and Ethernet connectivity solutions and services for servers and storage. We offer market-leading solutions that include adapter cards, switches, cables, and software to support networking technologies. Our products optimize Data Center performance and deliver industry-leading bandwidth and scalability. In addition, we serve a wide range of sectors including high performance computing, enterprise, Data Center, cloud computing and Web 2.0. We are constantly reinventing ourselves to stay ahead of the market and bring groundbreaking products and services to the industry. Our product line is focused on delivering the most optimized Ethernet solutions for industries like Media and Entertainment as well as any other industry that can benefit from our DataStream and TCP/IP acceleration. What you will be doing: Drive multiple early-stage design concepts of Test Equipment & fixtures while working in fast-paced product development cycles. Independently lead Test Equipment & fixtures design from concept, through detailed design, and support it during Bring-up, Qualification and Mass-Production phases. Participate and lead design and design reviews of Test Equipment & fixtures by using our CMs (Contract Manufacturers) as the designers Collaborate in research of groundbreaking technologies, materials, and processes with other groups to bring in creative ideas that address evolving needs. What we need to see: B.Sc. in Mechanical Engineering or higher degree. 5&#43; years of experience in classical mechanical design of mechanisms, jigs, fixtures, products and machines development. Knowledge and experience in automation (pneumatics XYZ motion systems, etc) and in design of machining and sheet metal parts Knowledge and experience in static analysis and simulations.