DRAM Process Integration Engineer — Boise, ID - Main Site. Apply via Workday.
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DRAM Device Engineer Lead — Taichung - Fab 16, Taiwan. Apply via Workday.
DRAM Device Engineer ID1 — Taichung - Fab 16, Taiwan. Apply via Workday.
DRAM Product Test Development Engineer — Taichung - Fab 16, Taiwan. Apply via Workday.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 47 years, Micron Technology, Inc . has redefined innovation through advanced memory and semiconductor technologies that power the world’s information infrastructure. The DRAM Customer Enablement team serves as the bridge between Micron’s newest memory innovations and the customer platforms that deploy them, enabling successful adoption across cloud, AI, enterprise, client, mobile, and next-generation computing environments. The DRAM Customer Enablement Intern will gain hands-on experience working with groundbreaking memory technologies, modern computing platforms, and software automation solutions. This role provides the opportunity to collaborate with experienced engineers while contributing to projects focused on DRAM validation, platform enablement, reliability analysis, and engineering productivity improvements. The ideal candidate is curious, analytical, and enthusiastic about learning both hardware and software technologies in a collaborative engineering environment. Responsibilities Support the bring-up, validation, characterization, and debugging of server, client, and mobile platforms using Micron DRAM technologies. Analyze system and customer data to identify performance trends, reliability concerns, and opportunities for product or process improvements. Develop and maintain software tools, automation frameworks, dashboards, and reporting solutions using Python and related technologies. Collaborate with multi-functional engineering teams on DRAM reli
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s vision is to transfer how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a process integration and device engineer Intern at Micron Technology, Inc., you will have opportunities to work with an industry leading team on cutting edge technologies to enable next generation DRAM in the manufacturing Fab, ramp up production yield and deliver high quality DRAM products to customers. You will be offered hands-on experience in semiconductor process integration, electrical data analysis, with exposure to advanced technology development, yield improvement, and cross-functional collaboration. Responsibilities Support integration of process modules across various DRAM module loops. Analyze electrical and inline data to identify yield detractors and process anomalies. Collaborate with cross-functional teams (YE, Device, PI, process et al) to drive continuous improvement. Document findings and present updates to engineering and leadership teams. Leveraging AI tool to improve problem solving efficiency and productivity Requirements: Strong knowledge of semiconductor devices is required. Advanced CMOS or capacitor knowledge is preferred. Basic Knowledge of mainstream memory such as DRAM, NAND, NOR et al. Knowledge of sta
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Coordinate the P&L for the vEIM DRAM product line serving embedded markets. Define and carry out approaches to increase revenue and market share in Automotive, Industrial, and Consumer verticals while maintaining product line profitability. Develop positive relationships with engineering, technology development, and quality organizations to deliver outstanding products with differentiated features that surpass customer requirements. Establish effective financial and business analyses and processes to justify and approve next-generation products. Drive speedy resolution of customer issues seen during qualification and production. Define marketing strategies to drive demand creation while effectively handling supply, demand, and inventory. Define long-term DID and node longevity strategy for the product line. Define pricing strategies to meet product line objectives. Define and complete go-to-market plans for new products, including collateral, field training, and outbound messaging. Education & Ideal Experience Degree or equivalent experience in Electrical Engineering, Computer Science, or a related field and/or advanced education in business administration. 10+ years of progressive marketing leadership and industry experience. Extensive semiconductor experience with a deep understanding of DRAM and memory markets. Extensive background in developing and introducing products, combined with understanding of
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron's DRAM Systems & Component Architecture team to develop next-generation software platforms and AI-enabled workflows for memory-system architecture research. This role combines computer architecture, DRAM systems, software development, and artificial intelligence to accelerate architecture exploration, simulation, data analysis, and technical decision making for future memory technologies. The US base salary range that Micron Technology estimates it could pay for this full-time position is: $35.96 - $43.15 an hour Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. As a world leader in the semiconductor industry, Micron is dedicated to
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 47 years, Micron Technology, Inc. has driven innovation through advanced memory and semiconductor technologies that power the world's computing platforms. The DRAM Customer Enablement team serves as a critical link between Micron's newest memory solutions and the systems that deploy them across cloud, AI, enterprise, client, mobile, and next-generation computing environments. The group committed to DRAM Customer Enablement works closely with hardware, firmware, systems, validation, and analytics engineers to ensure successful deployment of new DRAM technologies. Through system validation, reliability analysis, automation, and customer enablement activities, the team helps bring Micron's latest innovations to market. As an intern, you will gain hands-on experience working with sophisticated memory technologies, modern server and computing platforms, and AI-assisted software development tools. You will contribute to real engineering projects involving platform bring-up, validation, interpreting data, developing automated solutions, and technical problem solving while collaborating with experienced engineers across multiple fields. Responsibilities Support bring-up, validation, characterization, and debugging of server, client, and mobile platforms using Micron DRAM technologies. Analyze engineering and customer data to identify performance trends, reliability concerns, and system-level insights; create dashboards, visualizations, and technical reports to communicate findi
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We're advancing some of the most important technologies in modern computing. Our memory solutions power AI, cloud, enterprise, mobile, and high-performance computing platforms around the world. The Memory Systems Architecture team explores complex technical challenges across the memory stack and turns them into practical product innovations, helping shape the future of memory technologies and industry standards. As a Technical Staff Member, you will provide systems-level architecture leadership for next-generation memory solutions. This role combines analytical modeling, architecture development, reliability strategy, and cross-functional influence to help define future products. You will work across engineering disciplines to evaluate tradeoffs, guide technical decisions, and develop differentiated solutions that deliver value to customers and platforms. Responsibilities: Define architectures for DDR, LPDDR, HBM, CXL-attached memory, and emerging memory technologies. Develop analytical and simulation-based models to evaluate performance, reliability, power, thermal, and cost tradeoffs. Drive architecture requirements across DRAM, packaging, modules, controllers, platforms, and system software. Lead technical studies, roadmap development, and architecture recommendations supported by quantitative analysis. Influence cross-functional teams, mentor engineers, and contribute to patents, publications, and standards activities. Mi
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the R&D DRAM Device and Cell Technology Group at Micron, working at the heart of future memory scaling in an industry‑leading 300mm R&D facility. We explore new device concepts, push the limits of DRAM cell performance, and turn deep physics understanding into manufacturable technology. If you enjoy learning fast, solving hard problems, and collaborating across process areas, this team delivers! In this role, you will play a critical part in defining and validating future DRAM device and cell technologies. As a Device Engineer, you will characterize memory arrays, analyze electrical behavior and failures, and influence process and material decisions that directly impact yield, quality, and performance. Your work will shape the electrical foundation of next‑generation DRAM products. Responsibilities: Define and drive electrical specifications for DRAM, Advanced DRAM and emerging memory technologies, translating product requirements into device-level targets for performance, reliability and scaling Design, implement, and interpret experiments to optimize cell and access device performance. This includes running materials experiment, developing new integration schemes and defining new characterization methodologies Develop physical and electrical models (TCAD and compact modeling) to identify performance, yield and reliability limiters, using advanced materials characterization, device physics insight, and statistical data analysis Creat
Intern - DRAM Process Integration — Boise, ID - Main Site. Apply via Workday.
Advanced DRAM Process Integration Engineer — Boise, ID - Main Site. Apply via Workday.
Engineer- DRAM, Advanced DRAM and EM Device/Cell Technology — Boise, ID - Main Site. Apply via Workday.
Senior DRAM Product Engineer — Manassas, VA - Fab 6. Apply via Workday.
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