Dram Design Technology Layout Engineer Jobs

New College Grad - Semiconductor Design Engineer, DRAM Products Group — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role We are looking for a passionate and innovative ATE Test Engineer to design and deliver cutting-edge test solutions for HBM-DRAM devices using modern advanced ATE platforms. In this role, you will lead the development and implementation of test plans, ATE test programs, silicon validation, and test methodologies, while driving multi-site hardware design and development, product characterization, and high-volume production support. Success in this position requires a forward-thinking mindset and the ability to apply the right technologies to meet evolving challenges. Key Responsibilities Develop and implement robust test strategies, plans, and ATE programs for HBM-DRAM devices. Drive silicon validation, characterization, and yield improvement initiatives. Design and debug test hardware, including schematic capture and PCB layout. Collaborate cross-functionally to ensure seamless integration of test solutions into production. Support high-volume manufacturing and troubleshoot complex test issues. Qualifications & Skills Education: Bachelor’s or Master’s degree in Electrical, Electronics or Computer Engineering. Experience: A

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key technical contributor within the High Bandwidth Memory (HBM) Product Engineering – Media Health team, you will play a critical role in driving Media Health manufacturing execution for Micron’s latest next ‑ generation HBM products, including DRAM die, interface die, and stacked HBM solutions. You will be responsible for Best ‑ in ‑ Class HBM product enablement, with direct technical ownership across the core manufacturing KPIs of Quality, Cost, Cycle Time, and Scale. Your contributions will include manufacturing test flow development and validation, device ‑ and stack ‑ level yield improvement, and delivery of optimized extrinsic and intrinsic reliability through deep circuit debug, test coverage optimization, and innovative test strategies. In this role, you will drive manufacturing test time reduction, enhance overall manufacturing efficiency, and contribute to Design ‑ For ‑ Test (DFT) strategy development, introducing new ideas that improve cost competitiveness, cycle time, and product quality. You will work closely with cross ‑ functional partners—including Fab, Product Leads, Design Engineeri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our DRAM and Cell Technology team is focused on advancing memory innovation through the development of next-generation DRAM cell and device technologies. We work across disciplines to solve complex technical challenges, improve product performance, and enable future memory scaling. Join a collaborative team that is shaping the future of information technology through breakthrough memory solutions. As a DRAM Device & Cell Technology Engineer, you will play a key role in defining and optimizing next-generation DRAM architectures and technologies. You will contribute to device and cell development, lead experimental investigations, and partner with cross-functional teams to improve performance, reliability, and scalability. This is an opportunity to work on leading-edge memory technology and influence future product roadmaps. Responsibilities: Develop DRAM cell and access device technologies to improve density, retention, and disturb immunity Design and execute silicon experiments; perform electrical characterization, data analysis, and interpretation Analyze array-level behavior and collaborate with circuit teams to optimize operating conditions and sequences Partner with cross-functional teams to ensure developed solutions are scalable and manufacturable Contribute to technology roadmaps through benchmarking, technical evaluation, and strategic recommendations Minimum Qualifications: M.S. or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a re

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Integration Engineer working in the fast-paced DRAM R&D Memory Group, you will be instrumental in developing Micron's core memory technology critical for AI-enabled customers. The R&D development takes place in an industry-leading 300mm facility which is adjacent to our newly announced Manufacturing facility (currently under construction). Your focus will be on driving front-end process integration for future DRAM technology nodes, owning integration schemes, DOEs, and silicon learning from development through transfer to manufacturing. You will strengthen that work with device and process modeling, using simulation and device physics to build predictive insight, shorten learning cycles, and guide integration decisions. This is an integration role first; modeling is a tool you bring to it, not a standalone assignment. Responsibilities include, but not limited to: Own process integration for assigned DRAM FEOL modules: define integration schemes, drive unit process and module interactions, and deliver on technology node milestones. Design and execute DOEs on silicon, analyze inline, parametric, and yield data, and drive root cause to resolution. Apply device and process modeling (TCAD, Silvaco, Sentaurus, or comparable) to evaluate process interactions, device behavior, and scaling options, and to prioritize experiments before committing silicon. Correlate simulation results with experimental and silicon data to improve model accuracy and deepen process understanding.</li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join our Advanced DRAM organization and help shape the future of memory technology! We are a team of world class engineers and scientists working in a leading-edge R&D environment to solve some of the industry's most sophisticated semiconductor challenges and to transform breakthrough concepts into manufacturable solutions. As a Process Integration Engineer, you will help define the future of memory technology by identifying novel solutions to scaling, performance, and power challenges in advanced semiconductor devices. You will work with experts in process development, device engineering, modeling, characterization, and reliability to develop and integrate new technologies from concept through implementation in silicon. Responsibilities: Lead integration activities for advanced semiconductor devices, including charge storage devices, thin-film transistors (TFTs), and related device structures Evaluate device operating mechanisms, failure modes, noise sources, and variability to improve device performance and reliability Partner with cross-functional teams to identify and resolve performance, yield, reliability, and product margin challenges Design, implement, and analyze experiments in the R&D fab to optimize process flows and meet product requirements Analyze inline, parametric, and probe data to drive yield improvement, process margin, and cost reduction Communicate sophisticated technical issues and lead teams toward achieving project goals <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. RESPONSIBILITIES AND TASKS: Develop new tests and test algorithms for products, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times Develop test programs for products using primarily Python and C coding on automated test equipment in the given area followed by test program release to manufacturing area Be a lead to new product introduction (NPI) as well as pre/post silicon check out Develop test Automation solutions as well as electrical validation and qualification of new test equipment and tools Independently debug and identify root causes on test issues and provide feedback to external groups Provide statistical data analysis, analytics and justification on program validation and its release to ensure program quality Evaluate and verify yields/quality with global teams to ensure we are shipping the highest quality product to our customers with enforce to all data sheet specification Support both internal and external groups on experiments designed to improve yield or capacity by resolving test issues that impact site in a timely manner Maintain tactical and project updates on daily and weekly basis, respectively. Updates should show progress against the timelines. Drive Innovation and Improvement with the end goal of reducing the Cost of Test for Micron in the Test Department Support intra-departmental (and multi-site) teams in dev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Lead DRAM technology transfer efforts between development and manufacturing locations. Coordinate transfer achievements, qualification plans, and execution readiness reviews. Drive issue resolution during transfer ramp and production transition. Analyze process interactions across modules to optimize device performance and manufacturability. Conduct process change assessments and identify potential manufacturing risks. Minimum Qualifications: Bachelor’s degree in Engineering or a related technical field, or equivalent practical experience. Proven experience in semiconductor process integration. Knowledge of DRAM technology and manufacturing. Strong analytical skills with experience in yield analysis and statistical data analysis. Ability to work effectively by AI Assisted tools in cross-functional and global teams. Preferred Qualifications: Master’s degree or PhD in Engineering or a related technical field, or equivalent experience. Experience in risk assessment and problem-solving within semiconductor manufacturing. Experience in tech node transfer from NPI to HVM phase. Strong project management and communication skills. Demonstrated ability to successfully implement corrective actions for manufacturing issues. Familiarity with FMEA and risk mitigation planning. About Micron Technology, Inc. <p style="tex

DRAM Device & Process Modeling Engineer — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of memory systems. Our DRAM Architecture organization works at the intersection of silicon, packaging, systems, and customers to build technologies that power next-generation platforms. If you enjoy solving ambiguous problems that matter at industry scale, this is the place. This role is a senior technical leadership position with broad architectural ownership. You will develop complete DRAM system architectures, impact industry direction, and engage directly with customers and executives to convert complex ideas into scalable products. Responsibilities: Define next-generation memory system builds focusing on performance, capacity, RAS, and telemetry Lead cross-stack co-optimization spanning silicon, package, module, board, and system Architect sophisticated RAS and telemetry features and translate system needs into silicon Drive long-range memory technology strategy and influence industry standards Act as a senior technical liaison to customers, executives, and partners Minimum Qualifications: Bachelor’s degree or relevant equivalent experience in EE, CE, CS, or a related field Extensive hands-on experience in DRAM or memory systems architecture Deep understanding of DRAM timing, signaling, power, and reliability mechanisms Proven ability to translate system requirements into silicon architecture Preferred Qualifications: Master’s degree or PhD, or equivalent experience, in a related technical field Recognized techn

DRAM Device Engineer ID1 — Taichung - Fab 16, Taiwan. Apply via Workday.

DRAM Power Architect (MTS) — Boise, ID - Main Site. Apply via Workday.

DRAM Architect – Principal Engineer | MTS - TPG — Boise, ID - Main Site. Apply via Workday.

DRAM Power Architect, DEG — Boise, ID - Main Site. Apply via Workday.

DRAM Product Engineer - AI — Boise, ID - Main Site. Apply via Workday.