Dram Design Validation Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life. Join an inclusive team focused on one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solution we create help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while contributing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing. Job Description: As a CAD Applications Engineer at Micron Technology, Inc., you will be working in a collaborative, production support role evaluating, improving EDA and debugging both in-house and commercial Electronic Design Automation (EDA) tools and flows for the physical layout and design of CMOS integrated circuits. You will work closely with the Design and Layout teams to increase their productivity and work efficiency. Responsibilities and Tasks include, but not limited to: Develop place and route flows at advanced process technology nodes for DRAM designs. Implement advanced methodologies such as hierarchical flow, UPF, and process specific flow customizations to name a few Work with EDA vendors to deploy latest PnR tool or report/track tool issue to resolution. Customize EDA tools and create in house flows to improve the design team efficiency. Work closely with global design teams to support multiple aspects of PnR flow and associated methodolog

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Working place : Hiroshima Manufacturing site (Fab15) 勤務地：広島製造拠点(Fab15) As a Process Integration Engineer at Micron Fab15, you will help ensure process stability and drive yield/quality improvements by leveraging standard procedures, data analysis, and cross-functional collaboration. You will support early detection, root-cause isolation, and corrective/preventive actions for process deviations in a high-volume manufacturing environment. 職務概要 Micron Fab15 プロセスインテグレーションエンジニアとして、標準手順データ分析、ならびに部門横断的な協業を活用し、プロセス安定性を確保するとともに、歩留まりおよび品質改善を推進します。 Job role more in detail, Optimizing Device performance to improve not only yield but also repair density consumption. Need to think about appropriately HVM DRAM process condition especially focusing on Device process condition. Need to collaborate with other PI module teams and Each Area teams and also discuss with PE/GQ/ Design and TD device teams to take balance for deciding HVM device process condition Need to collaborate with other site OMT, ID1 and TD. 職務内容詳細 歩留まり改善を行うだけでなく、Repair Density消費の最適化を含めたデバイス性能の最適化を行う。 特にデバイスプロセス条件に注目し、HVM DRAM プロセス条件を適切に検討する。 他のPI moduleチームおよび、各エリアチームと連携し、さらにPE/GQ/Design /TDデバイスチームと議論しながら、HVMデバイスプロセス条件のバランスを取った意思決定を行う。 他サイトのOMT,ID1,TDチームとも連携する。 Job responsibilities Take responsibility for creating SWR for device performance improvement proactively. Take responsib

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Architecture team defines the future of memory systems that enable next-generation AI, machine learning, and high-performance computing applications. By researching advanced memory architectures, system designs, and emerging technologies, the team develops innovative solutions that maximize performance, scalability, and efficiency for future memory products. As a Memory System Architect on the HBM Architecture team, you will contribute to the definition of future memory architectures supporting Generative AI and data-intensive workloads. You will research and evaluate advanced memory system concepts, analyze AI accelerator architectures, and develop models that guide product strategy and technology roadmaps for next-generation memory solutions. Responsibilities Research and evaluate advanced memory architecture concepts for AI accelerators, including GPU, TPU, and emerging compute platforms. Develop and analyze system-level models to assess performance, power, scalability, and efficiency across memory and compute architectures. Investigate memory hierarchy optimizations involving HBM, DRAM, cache, storage, and interconnect technologies. Evaluate architectural trade-offs and emerging technologies, including compute-near-memory concepts, to support future product development. Collaborate with cross-functional teams to translate research findings into architecture recommendations and long-term technology roadmaps.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: - Responsible for IPQA - quality assurance of all products Module and SSD - Responsible for Yield monitoring and continual improvement - Responsible for driving 8D for all quality issues - Resource planning and KPI management - Responsible for PPAP, FMEA, Control plan - AI Assistant Knowledge Develops, implements, and maintains technical quality assurance and control systems and activities. Defines and specifies the implementation of standards, methods, and procedures for inspecting, testing, and evaluating the precision, accuracy, and reliability of company products. Participates in the reviewing of engineering designs to contribute quality requirements and considerations. Assists product support areas in gathering and analyzing data. Selects, develops, and evaluates personnel to ensure the efficient operation of the function. Location - Sanand, Gujarat About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in art

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our DRAM and Cell Technology team is focused on advancing memory innovation through the development of next-generation DRAM cell and device technologies. We work across disciplines to solve complex technical challenges, improve product performance, and enable future memory scaling. Join a collaborative team that is shaping the future of information technology through breakthrough memory solutions. As a DRAM Device & Cell Technology Engineer, you will play a key role in defining and optimizing next-generation DRAM architectures and technologies. You will contribute to device and cell development, lead experimental investigations, and partner with cross-functional teams to improve performance, reliability, and scalability. This is an opportunity to work on leading-edge memory technology and influence future product roadmaps. Responsibilities: Develop DRAM cell and access device technologies to improve density, retention, and disturb immunity Design and execute silicon experiments; perform electrical characterization, data analysis, and interpretation Analyze array-level behavior and collaborate with circuit teams to optimize operating conditions and sequences Partner with cross-functional teams to ensure developed solutions are scalable and manufacturable Contribute to technology roadmaps through benchmarking, technical evaluation, and strategic recommendations Minimum Qualifications: M.S. or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a re

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process Integration Engineer working in the fast-paced DRAM R&D Memory Group, you will be instrumental in developing Micron's core memory technology critical for AI-enabled customers. The R&D development takes place in an industry-leading 300mm facility which is adjacent to our newly announced Manufacturing facility (currently under construction). Your focus will be on driving front-end process integration for future DRAM technology nodes, owning integration schemes, DOEs, and silicon learning from development through transfer to manufacturing. You will strengthen that work with device and process modeling, using simulation and device physics to build predictive insight, shorten learning cycles, and guide integration decisions. This is an integration role first; modeling is a tool you bring to it, not a standalone assignment. Responsibilities include, but not limited to: Own process integration for assigned DRAM FEOL modules: define integration schemes, drive unit process and module interactions, and deliver on technology node milestones. Design and execute DOEs on silicon, analyze inline, parametric, and yield data, and drive root cause to resolution. Apply device and process modeling (TCAD, Silvaco, Sentaurus, or comparable) to evaluate process interactions, device behavior, and scaling options, and to prioritize experiments before committing silicon. Correlate simulation results with experimental and silicon data to improve model accuracy and deepen process understanding.</li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join our Advanced DRAM organization and help shape the future of memory technology! We are a team of world class engineers and scientists working in a leading-edge R&D environment to solve some of the industry's most sophisticated semiconductor challenges and to transform breakthrough concepts into manufacturable solutions. As a Process Integration Engineer, you will help define the future of memory technology by identifying novel solutions to scaling, performance, and power challenges in advanced semiconductor devices. You will work with experts in process development, device engineering, modeling, characterization, and reliability to develop and integrate new technologies from concept through implementation in silicon. Responsibilities: Lead integration activities for advanced semiconductor devices, including charge storage devices, thin-film transistors (TFTs), and related device structures Evaluate device operating mechanisms, failure modes, noise sources, and variability to improve device performance and reliability Partner with cross-functional teams to identify and resolve performance, yield, reliability, and product margin challenges Design, implement, and analyze experiments in the R&D fab to optimize process flows and meet product requirements Analyze inline, parametric, and probe data to drive yield improvement, process margin, and cost reduction Communicate sophisticated technical issues and lead teams toward achieving project goals <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. RESPONSIBILITIES AND TASKS: Develop new tests and test algorithms for products, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times Develop test programs for products using primarily Python and C coding on automated test equipment in the given area followed by test program release to manufacturing area Be a lead to new product introduction (NPI) as well as pre/post silicon check out Develop test Automation solutions as well as electrical validation and qualification of new test equipment and tools Independently debug and identify root causes on test issues and provide feedback to external groups Provide statistical data analysis, analytics and justification on program validation and its release to ensure program quality Evaluate and verify yields/quality with global teams to ensure we are shipping the highest quality product to our customers with enforce to all data sheet specification Support both internal and external groups on experiments designed to improve yield or capacity by resolving test issues that impact site in a timely manner Maintain tactical and project updates on daily and weekly basis, respectively. Updates should show progress against the timelines. Drive Innovation and Improvement with the end goal of reducing the Cost of Test for Micron in the Test Department Support intra-departmental (and multi-site) teams in dev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Lead DRAM technology transfer efforts between development and manufacturing locations. Coordinate transfer achievements, qualification plans, and execution readiness reviews. Drive issue resolution during transfer ramp and production transition. Analyze process interactions across modules to optimize device performance and manufacturability. Conduct process change assessments and identify potential manufacturing risks. Minimum Qualifications: Bachelor’s degree in Engineering or a related technical field, or equivalent practical experience. Proven experience in semiconductor process integration. Knowledge of DRAM technology and manufacturing. Strong analytical skills with experience in yield analysis and statistical data analysis. Ability to work effectively by AI Assisted tools in cross-functional and global teams. Preferred Qualifications: Master’s degree or PhD in Engineering or a related technical field, or equivalent experience. Experience in risk assessment and problem-solving within semiconductor manufacturing. Experience in tech node transfer from NPI to HVM phase. Strong project management and communication skills. Demonstrated ability to successfully implement corrective actions for manufacturing issues. Familiarity with FMEA and risk mitigation planning. About Micron Technology, Inc. <p style="tex

DRAM Device & Process Modeling Engineer — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of memory systems. Our DRAM Architecture organization works at the intersection of silicon, packaging, systems, and customers to build technologies that power next-generation platforms. If you enjoy solving ambiguous problems that matter at industry scale, this is the place. This role is a senior technical leadership position with broad architectural ownership. You will develop complete DRAM system architectures, impact industry direction, and engage directly with customers and executives to convert complex ideas into scalable products. Responsibilities: Define next-generation memory system builds focusing on performance, capacity, RAS, and telemetry Lead cross-stack co-optimization spanning silicon, package, module, board, and system Architect sophisticated RAS and telemetry features and translate system needs into silicon Drive long-range memory technology strategy and influence industry standards Act as a senior technical liaison to customers, executives, and partners Minimum Qualifications: Bachelor’s degree or relevant equivalent experience in EE, CE, CS, or a related field Extensive hands-on experience in DRAM or memory systems architecture Deep understanding of DRAM timing, signaling, power, and reliability mechanisms Proven ability to translate system requirements into silicon architecture Preferred Qualifications: Master’s degree or PhD, or equivalent experience, in a related technical field Recognized techn

DRAM Device Engineer ID1 — Taichung - Fab 16, Taiwan. Apply via Workday.

DRAM Power Architect (MTS) — Boise, ID - Main Site. Apply via Workday.

DRAM Architect – Principal Engineer | MTS - TPG — Boise, ID - Main Site. Apply via Workday.

DRAM Power Architect, DEG — Boise, ID - Main Site. Apply via Workday.