Dram Design Working Student In Munich Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) within Micron's Technology and Products Group (TPG) leads the development of High Bandwidth Memory (HBM) solutions for AI and ML applications. Our modern builds use Through Silicon Via (TSV) technology. We stack multiple DRAM chips on a high-speed memory controller with a coordinated logic chip in one package. This new way improves memory density and bandwidth through parallelization. It aims to deliver the lowest power per bit solutions in the industry. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. You will contribute to the design and delivery of next‑generation memory products by working across circuit design, layout, and validation. You will apply simulation, modeling, and verification skills to improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for designing and analyzing digital and analog circuits used in the development of memory products. Engage in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. Collaborate with various internal design and verification teams all over the world and support the efforts of groups, including Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. Responsible for power delivery network evaluation and optimization of DRAM designs, as well as design and optimization block level power generators. Utilize both analog and digital CMOS design skills to work on the analog circuits. Responsible for working with Product Engineering to verify silicon performance vs simulation performance of circuits you design. Work with Process integration and transistor modeling personnel in designing the circuits to be used on Micron's next groundbreaking process node. Review product requirements and logic diagrams for device definition. Responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor devices and components. Employer will accept a Bachelor's degree in Computer Engineering, Electrical Engineering, Electronics Engineering, or related field, followed by fi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most ambitious due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: As a Mixed-Signal Design Engineer in Micron’s Pathfinding Design Team, you will play a key role in crafting next-generation memory technologies. This position involves contributing to defining, developing, and analyzing high-speed logics to operate the memory. These paths span from the memory array to the interface block for memory technologies, including DRAM and emerging memories. You will work on novel concept development, circuit simulation, optimization, and floor planning to enable groundbreaking memory solutions! Responsibilities: Provide technical direction and design implementation for a memory control circuits (both of digital and analog) from the memory array to the interface block. Collaborate closely with physical design teams to ensure timing closure, CDC robustness, and power intent alignment. Demonstrated experience working with custom mixed-signal IC build and development for volatile or nonvolatile memory technology. Experience with modeling and simulation of ICs using HSPICE/finesim. Minimum Qualifications: Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or related field. 7&#43; years of experience in custom mixed-signal circuit design. Proficiency with UNIX and CADENCE design environment (Simulation, Schematic entry, SPF extraction) </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The 3D DRAM Technology Development organization is responsible for advancing next-generation memory technologies that enable future computing innovations. Engineers within this team work in a brand new 300mm R&D facility, collaborating across process development, characterization, reliability, design, and simulation fields to drive memory scaling and manufacturability. As a 3D DRAM Process Integration Engineer Intern, you will support the development of next-generation DRAM technologies with a focus on device performance, reliability, and manufacturability. This role involves working on advanced memory structures, including charge storage devices and thin-film transistors, while partnering with multi-functional engineering teams to solve challenging integration and circuit-related issues. The ideal candidate will have a strong foundation in semiconductor device fabrication, materials science, and device physics, combined with data-driven problem-solving skills and a passion for technology innovation. Responsibilities Contribute to the development of next-generation DRAM technologies, including advanced memory device components such as charge storage structures and thin-film transistors. Design, complete, and analyze experiments within the R&D fabrication environment to support technology development objectives. Collaborate with process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Design Engineering Group (DEG) is where bold ideas become real technology. We push the limits of memory and storage innovation, and we thrive in a collaborative environment where engineers learn, build, and solve challenges together. We are driven by curiosity, creativity, and the pursuit of better solutions every day! As a Design Engineer, you will help shape the next generation of Micron’s memory products. You’ll work closely with global design, verification, and product teams to bring innovative circuit designs from concept to silicon. Your work will directly influence product performance, quality, and reliability—and contribute to advancements that define the semiconductor industry. Responsibilities: Design, optimize, and verify block‑level circuits for DRAM projects Compare silicon performance with simulation results and support correlation activities Collaborate with process integration and modeling teams on new process node development Partner with global design groups and provide layout guidance through post‑layout simulation Minimum Qualifications: Bachelor’s degree in Electrical Engineering with 2&#43; years of semiconductor design or manufacturing experience Demonstrated experience in mixed-signal, digital, or analog IC design Experience designing regulators, charge pumps, oscillators, current references, bandgaps, or comparators Proficiency with SPICE and Verilog modeling and simulation Experience working wi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Customer Engineering team at Micron, where we partner directly with leading datacenter customers to solve complex challenges and bring cutting-edge memory solutions to life. Our work sits at the intersection of innovation and real-world impact—enabling faster computing, smarter systems, and breakthroughs across industries. This role is a key bridge between Micron and our customers. As a Datacenter DRAM Customer Engineer, you’ll act as a primary technical advisor, helping customers design, qualify, and deploy memory solutions that power next-generation compute platforms. You’ll collaborate across engineering, sales, and product teams while influencing both customer success and Micron’s product direction. Responsibilities: Drive design wins and product qualifications for DRAM, HBM, SSD, and compute-focused solutions Partner with sales and cross-functional teams to execute strategic customer plans and track progress Resolve system configuration, setup, and performance issues in customer environments Guide customers on memory architecture, system configuration, and optimization for cloud/datacenter workloads Support validation and deployment through lab activities, design reviews, and system-level testing utilize AI proficiency or AI‑enabled ways of working where applicable Minimum Qualifications: <s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . As a team member of technology development reliability group, you will be working with DRAM device/process development team and circuit design team. You will be responsible for analyzing reliability performance of hot carrier, bias temperature instability, electromigration etc. for each cell transistor, high performance CMOS and advanced interconnect. Also, you will be responsible for reliability model building and the consultation from device development team and circuit design team. The reliability is one of the important pillar for device scaling and state of the art technology development. Its work is based on understanding the semiconductor device physics, DRAM architecture knowledge, DRAM process integration knowledge. For the new reliability findings during the technology development phase, to point in the right direction is required. Responsibilities and Tasks: Develop and implement test methodologies to evaluate wafer-level & circuit-level reliability behavior and performance. Analyze results and create reports to deliver decision-ready, actionable recommendations for guiding technology development. Collaborate with Process Integration and characterization teams to correlate reliability signature with process conversions and parametric test data. Integrate other data sources (inline metro, param,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Validation Product Engineer on High Bandwidth Memory (HBM) technology you will be tasked with developing next-generation HBM products. Product Engineers are a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. We take ownership of HBM products; starting at the Design phase, through initial bring-up, qualification, and into volume production. The seniority level offered will be based on a combination of experience and education. In HBM HIG or equivalent experience (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI. The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, &#34;high bandwidth&#34;; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design on

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's ASIC Logic Design team develops next-generation ASICs and controller IP that enable industry-leading memory solutions. Working across advanced process technologies, the team collaborates with architecture, analog, verification, physical design, and validation engineers to deliver high-performance, production-ready silicon for future DRAM products. As an ASIC Digital Design Engineer, you will contribute to the design and development of RTL for next-generation DRAM memory controllers and subsystems. You will work in a collaborative engineering environment supporting design implementation, simulation, validation, and chip bring-up activities while leveraging AI-enabled tools to improve productivity and design quality. Responsibilities Design and develop RTL for DRAM memory controllers and subsystem components using SystemVerilog. Collaborate with analog, verification, physical design, validation, and other cross-functional teams to support successful product development. Develop and validate HDL models, support simulation and co-simulation activities, and analyze design functionality and performance. Support chip bring-up, debugging, and validation activities to identify and resolve design issues. Use scripting, automation, and AI-enabled tools to improve design workflows, productivity, and engineering efficiency. Minimum Qualifications 0-2 years of relevant experience through intern