Dram Disability Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the fabrication sites and Process Integration through test development to increase effective process feedba

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead the architecture, design, integration, and silicon validation of complex analog and mixed-signal circuits for advanced DRAM products, including amplifiers, comparators, references, LDOs, charge pumps, oscillators, DLLs, I/O circuits, and on-chip monitors. Drive development of custom analog and digital IP from concept through tape-out, silicon bring-up, and production. Define architectures and design methodologies to optimize power, performance, area (PPA), reliability, yield, and manufacturability. Lead verification, modeling, parasitic analysis, silicon correlation, and design signoff across PVT and reliability corners. Guide physical implementation, including floorplanning, matching, placement, routing, and reliability-aware layout practices. Collaborate with Product, Process, Test, Probe, Assembly, and Manufacturing teams to ensure successful product qualification and high-volume production. Drive design quality, standardization, and continuous improvement through advanced CAD, modeling, automation, and verification methodologies. Mentor and develop engineering talent while providing technical leadership across projects and product generations. Drive innovation through reusable IP development, patents, technology roadmaps, and differentiated circuit architectures. Leverage engineering tools powered by AI and agentic AI workflows to improve build efficiency, accelerate verification, optimize PPA, and reduce p

Everpure (NYSE: P) has evolved from storage pioneer to data platform, closing fiscal 2026 with $3.7 billion in revenue, its first billion-dollar quarter, and accelerating growth into FY27. Our strategic agenda spans the companies defining the next era of technology - hyperscalers, AI labs, the AI hardware supply chain, data platform providers, and the broader AI ecosystem. This type of work—work that changes the world—is what the tech industry was founded on. So, if you're ready to seize the endless opportunities and leave your mark, come join us. THE ROLE Drive the technical foundation and supply integrity of Everpure’s enterprise flash arrays, blades, and server building blocks as Component Engineering Manager. You will lead a high-performing engineering team and serve as the final authority on component qualification, ensuring every storage node, CPU, memory subsystem, and interconnect module meets uncompromising performance and reliability standards. By bridging Hardware Engineering, Quality, Supply Chain, and global semiconductor vendors, you will directly influence product architecture while safeguarding manufacturing continuity and operational scale. WHAT YOU'LL DO Engineering Leadership & Talent Development: Build, direct, and mentor a specialized team of component engineers spanning flash/SSD technologies and server platform hardware, fostering technical growth and setting execution priorities. End-to-End Component Qualification: Own the complete qualification lifecycle—defining rigorous test plans, analyzing supplier data, and issuing final approval for design-in and mass production across NAND flash, CPUs, DRAM, power systems, and interconnects. Strategic Flash & SSD Oversight: Drive roadmap alignment and technology node transitions with key storage suppliers, governing media characterization, firmware qualification, and long-term architectural integration. Supply Resilience & Risk Mitigation: Establish multi-sourcing strategies, lead s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Principal Engineer position, you will lead technical verification approaches to strengthen DRAM verification quality, standardization, and traceability throughout project families and pillars. You will invent the next generation of intelligent verification workflows and continuously advance scalable verification systems that align with new products, features, evolving design techniques (including RTL-focused flows), and scalable, family-based product development. This role is ideal for someone who excels in uncertain situations, enjoys forging new paths, and wants to impact verification across the DRAM roadmap. Responsibilities Verification Quality and Methodology Governance Define and drive DRAM verification methodology, quality standards, and AI-enabled strategies to improve coverage, traceability, efficiency, and defect prevention. Lead closed-loop silicon learning by identifying verification gaps, incorporating lessons learned into requirements and standard methodologies, and reducing recurring silicon issues. Own and continuously improve the JAMA requirements framework, ensuring alignment, scalability, and adoption across projects and teams. Simplify and optimize verification workflows through automation, AI, and process improvements that reduce cycle time and accelerate debug. Partner across engineering teams to drive methodology decisions, align collaborators, and scale verification approaches. <h2

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Drive and develop reliability verification with design and product teams by planning, overseeing, and developing stress patterns for increased reliability coverage. Be proficient on product reliability requirements and customer usage conditions for different DRAM products. Perform Verification Processes with Modeling and Simulation Using Industry Standard Simulators. Contribute to Cross Group Communication To Work Towards Standardization And Group Success. Working with Marketing, Quality, And Product Engineering Groups To Ensure Accurate Manufacturability Of Product. Proactively Solicit Guidance From Standards, Cad, Modeling, And Verification Groups To Improve The Design Quality. Drive Innovation Into The Future Memory Generations Within A Dynamic Work Environment. Drive customer usage model alignment across different functional teams. Work with technology teams to ensure high-risk reliability mechanisms are evaluated. Be advised on all silicon reliability related issues. Support product teams during silicon validation and qualification phase. Analyze and debug circuit down to device level in relation to degradation mechanism. Develop and improve reliability verification tools and methodologies. Engage in technical forums for continuous improvement of design for reliability methods. Train and mentor junior engineers. Employer will accept a Bachelor’s degree in Electrical Engineering, Computer Engineering or related field and 60 months of progressive, post-baccalaureate experience in the job offered or in a related occupation. Position r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Focus on technology node development to advance next-generation DRAM technologies. Contribute to DRAM product design to enable effective transfer of node development innovations into production products. Collaborate with product engineering and process technology teams to validate designs and help guide technology direction. Perform circuit design and floor planning, including power delivery network (PDN) design. Conduct simulation, debugging, and root cause analysis of design and process issues. Identify failures and provide corrective feedback to block design owners. Deliver design insights and recommendations to Technology Development process teams. Validating device and schematic functionality using memory testing systems. Requirements: Employer will accept a Master’s degree in Electrical Engineering, Computer Engineering, or related field and 2 years of work experience in job offered or in a related occupation. Position requires: 1. CMOS Circuit Design; 2. Digital Logic; 3. Mixed Signal Design; 4. Sense Amplifier; 5. Clock or Data Path; 6. AOCV; 7. Power, IR Drop, or PDN; 8. DFT; 9. Spice or Spectre; 10. Verilog; 11. Parasitic Extraction or SPEF; 12. Floor planning or Routing; 13. Cadence Virtuoso; 14. Python; and 15. Data Analysis (JMP). As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and profes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior Dry Etch Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Strong process area knowledge DRAM development and manufacturing experience

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 メトロロジー プロセス開発エンジニアは、次世代DRAMおよびHBM技術を支える先端計測技術の開発・導入を担当します。 測定レシピ開発、データ解析、計測装置の評価・立上げに加え、装置サプライヤーと連携した新規計測装置の開発にも携わります。 半導体業界での経験は必須ではなく、製造業で培った分析力や問題解決力を活かしながら、世界中のエンジニアと協働し、最先端メモリ技術の開発に挑戦できるポジションです。 職務内容 先端DRAM/HBM技術向けの新規計測手法および測定レシピの開発・認定 測定結果の解析および測定精度改善に向けた問題解決活動 新規計測装置および測定技術の評価・導入 計測装置の開発業務&#xff08;要求仕様の検討・策定、サプライヤーとの調整・開発推進、完成後の装置立ち上げ・導入までを一貫して担当&#xff09; プロセス管理戦略の策定およびモニタリング計画の構築 実験データおよび量産データを活用したプロセス改善・歩留まり改善支援 プロセスインテグレーション、製造、歩留まり改善、装置エンジニアリング部門との協業 計測装置サプライヤーとの技術レビューおよび開発推進 設備投資計画&#xff08;Capital Planning&#xff09;、設備設置、立ち上げ、認定活動の支援 AIツールを活用した業務効率改善およびデータ活用の推進 必須条件 修士卒以上&#xff08;電気・電子、材料、物理、化学、化学工学、機械工学などの理工系関連分野&#xff09; 製造業または技術系職種における業務経験 論理的思考力および問題解決能力 データを基に課題を分析し、改善策を検討できる能力 日本語による円滑なコミュニケーション能力&#xff08;目安&#xff1a;JLPT N2以上&#xff09; 英語によるコミュニケーションに抵抗がないこと AIツール&#xff08;Anthoropic Claude、Microsoft 365 Copilot等&#xff09;を活用しながら業務効率向上や課題解決に取り組めること 歓迎条件 半導体業界における実務経験 自動車、化学、精密機械、電子部品等の製造業での経験 計測機器、分析装置、生産設備に関する知識または経験 XRD、SIMS、OCD、Scatterometry、CD-SEM、Film Metrology等に関する知識 統計解析や工程管理手法に関する経験 DRAM、HBM、NANDなど先端メモリ技術への興味・関心 海外メンバーとのプロジェクト経験 求める人物像 論理的に物事を整理し、課題解決に取り組める方 指示待ちではなく、自ら考え行動できる方 多様なバックグラウンドを持つメンバーと協働できる方 新しい技術やAIツールの活用に前向きな方 グローバルな環境で成長したい方 <li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Wet Etch Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Strong process area knowledge DRAM development and manufacturing experience Collaborate with e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities of your team will include, but are not limited to: 1. Contributing to the development of new DRAM, emerging memory products and IP’s by enabling the overall design, layout, and optimization of Memory/Logic/Analog circuits 2. Supporting design validation & verification, reticle experiments and required tape-out revisions 3. Performing verification processes with modeling and simulation using industry standard simulators 4. Contributing to cross group communication to work towards standardization and group success 5. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure proper manufacturability of product 6. Proactively solicit inputs from Standards, CAD, modeling, Technology Development groups to ensure the design quality and reliability 7. Driving innovation into the future Memory generations within a dynamic work environ