Dram Disability Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications! We stack multiple DRAM chips on a high-speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Micron’s High Bandwidth Memory (HBM) Design Verification team is responsible for ensuring the functionality, performance, and quality of next‑generation memory products that enable advanced computing applications. As a Senior Design Verification Engineer, you will collaborate closely with design, architecture, and product engineering teams to verify complex, high‑density DRAM circuits and deliver robust, production‑ready designs. This role combines deep technical verification expertise with cross‑functional collaboration in a global environment. You will be challenged by the complexity and difficulty of verifying high density memory chips (up to 32Gb) with huge scale of circuit capability (over 4M transistors), ultra-high speed designs, sophisticated functionality which includes next Generation DDR/LPDDR (ex: DDR5, LPDDR5) and advanced low power and power management technologies. You will be responsible to evaluate the functionality and performance of the Full-chip and block-level circuit designs using different verification tools, techniques, and strategies. In addition, you will also n

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Job Description We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward! In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive. Candidates are expected to demonstrate relevant experience in at least three of the five focus areas outlined below. Job Responsibilities Foundry Interface and Technology Alignment Act as the primary technical interface between foundry partners and Micron design organizations. Drive closure of design-process gaps through collaborative engagement with foundry process teams. Influence foundry

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Process and Equipment Engineering Manager at Micron Technology, you will lead top process and equipment groups to expand manufacturing capacity in the newest Memory Fab in the United States. Your primary responsibility over the next 1-2 years will be leading the hiring of the process teams for the Dry Etch area, developing and managing the training plans for these new engineers, and partnering closely with our global DRAM manufacturing teams to startup the new high volume manufacturing (HVM) facility in Boise, ID (ID1). This position requires collaborating with the ID1 Leadership Team, University Relations, Global HVMs, TD, Procurement, Facilities as well as interaction with equipment and materials suppliers to drive area manufacturing alignment. Responsibilities: Complete all required safety training and ensure adherence to Micron safety policies while encouraging a positive work environment Develop the strategic vision for establishing the ID1 Process and Equipment Engineering Dry Etch Process team Set and communicate ambitious performance targets and line-of-sight goals to team members Partner with Manufacturing Engineering (ME) and Industrial Engineering (IE) teams to validate capacity planning and achieve required wafer output Support department business processes for process qualification on new tools Serve as a key resource for technical support, working with global counterparts to identify and implement best-known methods

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description We are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward! In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making. Responsibilities: Job Description The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive. Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below. Foundry Interface and Technology Alignment Act as the primary technical interface between foundry partners and Micron design organizations. Drive closure of design-process gaps through collaborative engagement with foundry process teams. Influence foundr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Complete ownership of verification and end to end analysis of sophisticated full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR4,LPDDR4,DDR5 and LPDDR5 that can operate at high speeds of up to 6400MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skills. Responsibilities: • Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops • Strong judgment to validate AI outputs before use (review assumptions, align with specs/standards, cross-check with simulations, waveforms, assertions, and coverage reports, and document what was accepted/changed) prior to incorporating results into design decisions, verification plans, or debug conclusions • Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Sti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall design, layout, and optimization of DRAM Memory array/Peripheral Logic/Analog circuits Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate schematic optimization and design‑space exploration Assist in parasitic analysis, sensitivity studies, and corner coverage Improve debug efficiency across simulation and silicon learning loops Define semicustom methodology for memory design Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments. Oversee and manage the layout process including floor-planning, placement, and routing Perform circuit-level verification including functional, timing, power and reliability analysis using industry standard and Micron-specific simulators and tools. Contribute to cross-group communication to work towards standardization and group success Drive innovation into the future memory generations and design methodology within a dynamic work environment Minimum Qualifications Master’s degree in electrical or computer engineering with 4-8 years of experience in memory design. Strong fundamentals in CMOS circuit design, device physics and memory operation. Experience with SPICE-based simulation and parasitic extraction. </

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Taiwan Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM. Micron’s Taiwan sites include sales and technical support in Taipei along with state-of-the-art fabrication facilities in Taichung and Taoyuan that together comprise the company’s DRAM Center of Perfection. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles. Job Description The AMHS Shift Technical Engineer is responsible for maintaining and sustaining the OHT (Overhead Transport), OHS system(Overhead Shuttle), Normal Stockers, Tower Stockers, BWS (Bare Wafer Stockers), Sorters, N2 purge tools, Carriers, Carrier/Wafer Packing Tools, and ASRS. Responsibilities and Tasks 1. Work with supplier for regular AMHS maintenance (PM). 2. Work with IT and vendor as automation on duty help desk for production trouble shooting (include Micron system and AMHS system, AMHS H/W). 3. Automation project support 4. Regular report update 5. Using AI Other Requirement&#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon IP designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Co-work with international colleagues on developing new verification flows to take on the challenges in DRAM and emerging memory design. Participate in developing verification methodology and verification environments for advanced DRAM and emerging memory products. Good understanding of analog / mixed signal circuits. Experience in Analog and Mixed signal Verification , understand the usage of tools like Virtuoso, primesim/ Finseim, Hspice, Xcellium, Simvision, Waveview. Hands on experience in writing Verilog Models. Verilog A/MS, RVM model writing experience is encouraged. Hands on experience in building SPICE testbenches at Block, Fullchip Level. Hands-on experience in building the COSIM/ Mixed signal verification environment is encouraged. Hands on experience in SV, UVM based Verification Hands on experience in SV/PSL assertions. Good scripting skills us

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage: T

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, focused on building and scaling advanced wet process equipment that enables next-generation DRAM. We partner closely with vendors, process teams, and manufacturing to bring new tools from concept to high-volume production. Our work blends hands-on engineering with real impact on performance, cost, and sustainability—making this an exciting place to shape the future of memory! In this role, you will develop, optimize, and sustain liquid-phase processing equipment used in advanced semiconductor manufacturing. You will work across R&D and manufacturing environments, solve complex hardware challenges, and help drive tools to meet aggressive performance and reliability targets. This is a high-ownership role with strong multi-functional exposure and direct impact on tool development at scale. Responsibilities: Develop and optimize wet process equipment for advanced DRAM nodes Partner with vendors and internal teams to resolve hardware gaps Drive installation, qualification, and upgrades of new tools Apply data analysis to monitor tool performance and solve issues Support transfer of processes from development to manufacturing Minimum Qualifications: Bachelor’s degree in Mechanical Engineering, Chemical Engineering, or related field 3&#43; years of experience in semiconductor equipment or process engineering Knowledge of wet process equipment and semiconductor fabric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Participate in simulating, analyzing, and debugging pre-silicon full chip designs by applying leading edge verification technique Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Co-work with international colleagues on developing new verification flows to take on the challenges in DRAM and emerging memory design. Participate in developing verification methodology and verification environ

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will involve in both intrinsic and extrinsic reliability test program coding for Micron’s latest HBM products. Your responsibility is to develop new reliability test flow (eg: extended wafer level burn in, pWLRx, ELFR etc), both on DRAM and Interface die and a stacked product for extrinsic DPM (Time0 and Field DPM) and intrinsic reliability assessment to meet critical KPI’s Quality, Cost and Cycle Time. You will play pivotal role in ensuring the reliability and robustness of our products through advanced coding practices and comprehensive testing. This position demands a strong grasp of engineering principles, adept problem-solving skills, and a relentless dedication to maintaining high-quality standards. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Reliability Test Program Coding: Writing and debugging test programs for HBM device and package qualification

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Optimized Test Coverage

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 先端DRAM半導体製品において、生産技術部門 DRYエッチプロセスの一員として、量産技術改善から生産技術・管理を横断的に担い、ものづくりを推進する役割になります。 業務詳細 安全トレーニングを受講し、マイクロンの安全ポリシーに従い業務を遂行してもらいます。 生産技術部門DRY グループ内において、Process&#xff06;Equipment担当エンジニアの役割を担います。 Process&#xff06;Equipment担当エンジニアは、より高い生産性と高品質の量産技術の確立に向けて、多角的に活動し、業務・改善を進めて行きます。 良品率の改善や管理システムの改善、生産性向上の改善を進めて行く必要があります。 また、新規最先端装置の導入や改修もサポートし、より生産計画の向上を進めて行きます。 開発製品の導入時には、製品や生産技術の問題点を洗い出し、関連部門と連携しながら、量産化を実現して行きます。 DRY内において、装置担当エンジニアや、他のプロセス担当エンジニア、そしてシフト勤務に従事するテクニシャンと、コミュニケーションをとり、改善活動を牽引する。 日々の問題から、長期的なプロジュクトまで参画しながら、上司、チームメンバーそして関係者への報告を行う。マイクロンの海外生産拠点と技術交流にも参加して、情報の共有から、標準化を進めて行きます。 要件&#xff08;全て満たしている必要は無い&#xff09; ・先端の技術に興味を持ち、仕事に前向きに取り組むことができる。 ・課題を整理し、解決できる能力を有する。 ・関係部門と協議しプロジェクトを補佐する能力を有する。 ・社内外の人とコミュニケーションを円滑に取ることができる。 ・Microsoft Office (Excel, PowerPoint, Word) などのソフトウェアを使用できる。 ・自己管理&#xff08;業務、健康&#xff09;ができる。 ・物理化学、機械、電気等の基礎知識について、大学卒業以上の知識を有することが望ましい。 About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel