Dram Hardware Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We design the digital foundations that power Micron’s DRAM products used around the world. Our team works at the intersection of circuit design, manufacturing, and systems, collaborating across global sites to solve real silicon problems. We value curiosity, technical depth, Artificial Intelligence and learning from one another as we build memory technology that matters. As a Design Engineer, you will play a critical role in shaping core digital circuits used across all DRAM products. This role offers hands-on ownership of RTL design and optimization while working closely with design, verification, and manufacturing partners. You will contribute directly to product quality, performance, and time-to-market in a collaborative hybrid environment. Responsibilities: Design and optimize RTL for DRAM-related digital circuits and block-level designs Perform STA and drive timing closure across critical paths Collaborate with verification, product engineering, test, and process teams to ensure robust designs Support circuit verification, layout checks, and parasitic extraction analysis Minimum Qualifications: Bachelor’s degree in Electrical Engineering or equivalent practical experience 6+ years of experience in digital or RTL circuit design Strong experience with RTL design, STA, and timing closure Experience with power delivery network circuit design and optimization Proficiency in UNIX and Cadence design env

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is a global DRAM leader whose innovative builds push the boundaries of future semiconductors. We seek a dynamic BEOL Process Integration Expert with proven experience in developing, transferring, and optimizing advanced DRAM technologies. Our team enjoys solving complex integration challenges and improving yield, reliability, and manufacturability. Known for technical leadership, strategic vision, and passion for semiconductor advancement, this role suits ambitious and determined candidates eager to make a big impact. Responsibilities In this role, you will need to have strong semiconductor Process Integration skills in an R&D department. You will be developing the future generation DRAM technologies. This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Define and implement BEOL process flows, build rules, and specifications for advanced DRAM products. Lead troubleshooting and resolution of complex integration issues spanning multiple modules and fields. Drive yield improvement and reliability enhancement initiatives using data-driven methodologies. Coordinate technology transfers, ensuring robust process qualification and rapid ramp to high-volume manufacturing. Engage in industry benchmarking and collaborative projects to maintain te

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Compute and Memory Business Unit (CMBU), driving the innovation behind Micron's next generation DRAM solutions for AI, data center, and client computing platforms. Our team collaborates across product architecture, design, validation, and system engineering to solve complex challenges in bandwidth, power, reliability, and scalability. Together, we help shape the future of memory technology for the world's most demanding compute environments. As a Product Architecture Engineer focused on Signal Integrity (SI) and Power Integrity (PI), you will define the electrical architecture that enables next-generation DRAM products. This highly visible role combines deep technical expertise with system-level thinking to influence product roadmaps, guide design decisions, and partner with industry-leading ecosystem stakeholders. Your work will help deliver memory solutions that power tomorrow's AI and high-performance computing platforms. Responsibilities: Lead SI/PI architecture pathfinding for next-generation DRAM products across AI, data center, and client platforms Define channel, package, board, and module-level SI/PI requirements and design targets for product development Evaluate DDR and LPDDR electrical performance, including timing, jitter, signal margin, crosstalk, impedance, reflections, and power delivery behavior Develop and apply modeling, simulation, and correlation methodologies using industry-standard EDA tools and validation data Partner across design, validation, package,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: Micron's DRAM organization focuses on designing and developing industry leading dynamic random access memory products. These teams drive R&D, product design, and technology development for cutting edge DRAM nodes, including DDR5, LPDDR, HBM, and GDDR products that form the foundation of Micron’s global revenue leadership. Our Process Integration team is at the center of advancing next‑generation memory technology. We work closely across engineering, manufacturing, and change management to turn data into action and keep programs moving forward. If you enjoy solving complex problems and seeing your impact on real products, you’ll find a home here! We’re hiring a Senior Process Integration Technician to partner with Module Engineers and help drive day-to-day execution. This role is essential to keeping experiments, conversions, and production priorities on track through strong coordination and clear communication. You’ll play a hands‑on role in data analysis, issue resolutions, and cross‑functional alignment to support key technology milestones. Responsibilities Collaborate with cross-functional teams to interpret and complete conversions for assigned PI Engineering Module. Serve as the primary point of contact for experiment coordination, conversion activities, and lot movement logistics. Partner with PI Module Owners, Process Area Owners, PI Conversion Coordinators, and Change Management teams to ensure alignment and execution of module support tasks

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron research and development has an opening for Yield Analysis (DA) engineer to develop our next generation memory solution and to support production transfer for the next generation Micron products. As a DA engineer you will be responsible to characterize electrical data to identify and source out extrinsic and intrinsic device issues that are impacting yield. You will work closely with cross functional team from R&D and manufacturing to accelerate product to market timeline by applying device physics knowledge to develop end of line device performance prediction using machine learning. We need engineers who are passionate about detecting problems, making changes for the better, and seek out innovative ways in how predict end of line device performance. Your responsibilities will include, but are not limited to the following: Analyze end of line test, parametric and fab data to identify design, process, and test issues that are impacting yield Develop new tools for yield analysis and implement machine learning technique to improve analysis efficiency and accuracy, leveraging artificial intelligence (AI) to improve proficiency. Identify new creative and innovative ways to use existing tools to identify relevant process issues or device failures Identify interactions between process modules and/or equipment to detect fail mechanisms Use the data collected inline to drive process improvements Improve yield by standardizing methods and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Enable rapid learning and effective technology transfer across the organization through deep involvement in defect detection equipment applications and advanced data analysis. Analyze process challenges using defect data and equipment signals to identify root causes and improvement opportunities. Collaborate with cross-functional teams across process integration, process development, data science, and yield analysis to deliver solutions with global impact. Drive defect reduction and yield improvement efforts across multiple projects on Micron’s DRAM roadmap, including High Bandwidth Memory (HBM) and advanced DRAM technologies. Develop a comprehensive understanding of process flows, potential failure and defect modes through FMEA, and associated detection strategies for inline yield characterization. Define die loss paretos upon issue detection and partner with process and integration teams to design, execute, and analyze experiments and DOEs to resolve yield limitations. Monitor baseline inline yield health for owned process modules using SPC techniques to quickly identify excursions, process drift, and emerging risks. Protect line yield by proactively escalating issues and coordinating corrective actions. Apply advanced data science and data interpretation skills to analyze complex datasets, draw actionable conclusions, and communicate results effectively. Present findings and recommendations to internal teams and customers using analytical tools such as JMP and Python. Employer will accept a Master’s degree in Material Engineering, Chemical Engi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron's Boise R&D site, the DRAM Technology Development organization drives innovation in next-generation memory solutions. The team develops advanced DRAM cell architectures, access devices, materials systems, and integration technologies that enable future scaling, improved performance, enhanced reliability, and manufacturing readiness. Engineers work across device, materials, process integration, modeling, design, and product engineering teams to bring groundbreaking memory technologies from concept to production. As an intern in the Advanced DRAM Device & Cell Technology team, you will contribute to the development and characterization of future DRAM cell and access device technologies through experimental studies, data analysis, and collaboration with multidisciplinary engineering teams. This position combines semiconductor device physics, materials engineering, silicon experimentation, electrical characterization, and data-driven decision making to improve cell performance, density, retention, reliability, and manufacturability. The successful candidate will collaborate with multi-functional teams to evaluate novel materials, device architectures, and integration schemes supporting future memory technology development. Responsibilities Support the evaluation of DRAM access devices, capacitors, and cell stack elements through characterization, data analysis, and assessment of new device architectures, materials systems, and integration schemes. Design and implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners! The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the 3D DRAM organization, you will join a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology that enables the future of memory scaling. You will focus on performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process integration knowledge, this position requires a strong background in materials science and semiconductor device physics, along with a creative mindset and effective project management. The role interacts significantly with process development, simulation, characterization, and reliability groups. Responsibilities: Contribute to technology development activities to enable next generation DRAM, working on device components such as charge storage devices and thin-film transistors, among others. Optimize process flows and develop creative solutions to meet product requirements. Engage numerous cross-functional te

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a PYE Engineer, you will work on the Product Yield Enhancement Failure Analysis team to support legacy DRAM products throughout their manufacturing lifecycle. You will focus on yield improvement, product reliability, and component failure analysis to identify and resolve issues, enable stable production, and support quality requirements for industrial and automotive customers. Your responsibilities will require using electrical and physical characterization techniques combined with AI supported workflows and statistical data analysis to identify failures related to fabrication and assembly process, as well as testing marginalities. You will be responsible for communicating and coordinating component-level improvement activities with Product, Process, Quality and Test Engineering teams. Job Duties Perform electrical failure analysis to understand failure mechanisms Identify causes of component failures through statistical data analysis Work closely with cross-functional engineering teams to resolve fabrication and assembly process defect related issues and test flow marginalities Use statistical data analysis, data visualization, and AI tools to identify trends, accelerate root cause investigations, and improve component performance Communicate findings clearly through written reports and presentations Minimum Qualifications: At least a bachelor’s degree in Electrical or Computer Engineering, Physics, or Materials S

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of a pathfinding organization focused on developing the technologies that will enable the next generation of memory solutions. Our team brings together engineers, scientists, and innovators working at the forefront of semiconductor research and development to solve sophisticated scaling, performance, and power challenges for future memory products. In this role, you will help develop the future of advanced memory technology by driving the development of first in industry Advanced DRAM solutions! You will collaborate across process integration, device engineering, materials science, characterization, and reliability teams to transform innovative concepts into silicon and deliver breakthrough memory architectures. Responsibilities: Lead process integration efforts for Advanced DRAM technologies, including charge storage devices, thin-film transistors (TFTs), and related device components Develop and integrate new memory device architectures from concept through silicon implementation and productization Design and implement experiments to evaluate device performance, variability, reliability, and failure mechanisms Partner with cross-f

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Data Center Business Unit (CDBU) is at the forefront of enabling next-generation server solutions that power AI and high-performance computing workloads. We work on ground breaking DRAM technologies that directly impact a significant portion of Micron’s revenue. Join a team that is crafting the future of data infrastructure and driving innovation in one of the fastest-growing technology segments! We are looking for a Principal Product Manager to lead DRAM product strategy and lifecycle management for data center applications. In this role, you will translate customer needs into product requirements, influence roadmap decisions, and partner closely with engineering, marketing, and customers to deliver high-impact solutions. This is a highly visible role where your expertise will shape product direction and help drive adoption across the server ecosystem. Responsibilities: Define and drive multi-year DRAM product strategy, roadmap, and lifecycle execution Translate customer and market needs into clear product requirements and value propositions Serve as the DRAM product expert with customers and industry partners Lead demand forecasting strategy, including competitive analysis and market modeling Identify and integrate high-value AI use cases into product planning and workflows Minimum Qualifications: Bachelor’s degree

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. The 3D DRAM Technology Development organization is responsible for advancing next-generation memory technologies that enable future computing innovations. Engineers within this team work in a brand new 300mm R&D facility, collaborating across process development, characterization, reliability, design, and simulation fields to drive memory scaling and manufacturability. As a 3D DRAM Process Integration Engineer Intern, you will support the development of next-generation DRAM technologies with a focus on device performance, reliability, and manufacturability. This role involves working on advanced memory structures, including charge storage devices and thin-film transistors, while partnering with multi-functional engineering teams to solve challenging integration and circuit-related issues. The ideal candidate will have a strong foundation in semiconductor device fabrication, materials science, and device physics, combined with data-driven problem-solving skills and a passion for technology innovation. Responsibilities Contribute to the development of next-generation DRAM technologies, including advanced memory device components such as charge storage structures and thin-film transistors. Design, complete, and analyze experiments within the R&D fabrication environment to support technology development objectives. Collaborate with process

New College Grad - DRAM Design Engineer — Boise, ID - Main Site. Apply via Workday.

Intern - Advanced DRAM Cell/Device Engineer — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Develop and standardize EMIR methodology that applies consistently across all DRAM products, ensuring alignment, repeatability, and high-quality analysis outcomes Perform static and dynamic EM/IR and PDN analysis using RedHawk or Totem or other industry‑standard tools; identify root‑cause issues such as high‑resistance segments, insufficient via density, and decap deficiencies, and provide clear, actionable recommendations to design and layout teams. Actively leverage AI‑based tools, agentic workflows, and automation frameworks for effective Power-delivery-network (PDN) analysis. Maintain a strong understanding of the full EMIR flow—from netlist preparation, extraction, simulation, and debug to reporting and silicon correlation—and ensure accurate evaluation across operating modes and temperatures. Partner across design, timing, physical implementation, architecture, modeling, and verification teams to understand real switching behavior, develop worst‑case vectors, and standardize analysis expectations across global teams. Collaborate with cross-geographical teams and also EDA tool vendors to evaluate and improve EMIR methodologies, and document Best Known Methods (BKMs) to enhance consistency and correlation across DRAM teams. Develop and maintain dashboards to track EMIR results, monitor trends, and support signoff progression for multiple designs. Qualifications: Master’s degree i