Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Develop and standardize EMIR methodology that applies consistently across all DRAM products, ensuring alignment, repeatability, and high-quality analysis outcomes Perform static and dynamic EM/IR and PDN analysis using RedHawk or Totem or other industry‑standard tools; identify root‑cause issues such as high‑resistance segments, insufficient via density, and decap deficiencies, and provide clear, actionable recommendations to design and layout teams. Actively leverage AI‑based tools, agentic workflows, and automation frameworks for effective Power-delivery-network (PDN) analysis. Maintain a strong understanding of the full EMIR flow—from netlist preparation, extraction, simulation, and debug to reporting and silicon correlation—and ensure accurate evaluation across operating modes and temperatures. Partner across design, timing, physical implementation, architecture, modeling, and verification teams to understand real switching behavior, develop worst‑case vectors, and standardize analysis expectations across global teams. Collaborate with cross-geographical teams and also EDA tool vendors to evaluate and improve EMIR methodologies, and document Best Known Methods (BKMs) to enhance consistency and correlation across DRAM teams. Develop and maintain dashboards to track EMIR results, monitor trends, and support signoff progression for multiple designs. Qualifications: Master’s degree i
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About Micron For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. The DRAM Customer Enablement team serves as the bridge between Micron's newest memory technologies and the systems that deploy them. We help validate, characterize, and enable new DRAM products across hyperscale cloud, AI, enterprise, client, mobile, and next-generation computing platforms. We are seeking a highly motivated intern who is eager to gain hands-on experience working with cutting-edge memory technologies, cloud computing systems, and AI-assisted software development. This internship provides an opportunity to work alongside experienced engineers while contributing to real-world projects that help bring Micron's latest DRAM innovations to customers. (Disclaimer): While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly expanding your individual and collaborative skills in this exciting and outstanding opportunity. What You'll Do As a
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Photolithography Process Development Engineer at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory fab in the western hemisphere, Micron has been in the industry for over forty -five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and growing. As a Photo Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet Process, Metals, CVD, Diffusion, and CMP. You will work on state of the art and best in class </sp
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary This team member will focus on performing semiconductor design engineering assignments including engineering and designing chip layout circuits, circuit checking, documenting specifications, and modifying and evaluating semiconductor devices and components. Typically responsible for projects, or portions of projects, to design, fabricate, optimize, and validate memory circuit solutions while supporting advanced semiconductor technology development. Responsibilities Design, layout, and optimize memory circuits with a focus on performance, power, area, and manufacturability. Perform circuit simulation and analysis using industry-standard tools such as SPICE and Verilog to validate circuit functionality. Develop and support schematic blocks including memory arrays, control logic, address decoders, datapaths, and internal test circuitry. Evaluate design architecture tradeoffs and incorporate layout parasitics to ensure robust circuit operation and silicon success. Drive innovation through test chip development, silicon validation, and AI-enabled improvements to design methodologies and workflows. Minimum Qualifications Bachelor’s degree in Electrical Engineering (BSEE) or higher, or equivalent experience. Basic understanding of memory array architectures, circuits, and operation. Strong understanding of circuit simulation setup, analysis, and debug techniques. Strong written and verbal communication skills with the ability to convey technical concepts
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the DRAM Technology Development team at Micron, pushing the limits of memory scaling and performance. Our work spans cutting-edge lithography and tight collaboration across integration, etch, deposition, and CMP to bring new nodes to life. If you enjoy solving complex patterning challenges on advanced tools including EUV we’d love to have you! In this role, you will lead photolithography process development for next-generation DRAM. You’ll own process modules, drive roadmap decisions, and translate concept to manufacturable solutions on pilot lines and into high-volume fabs. This is a hands-on, high-impact position working closely with cross-functional teams and equipment/material partners! Responsibilities: Develop and optimize photo processes to meet device physical and electrical requirements while reducing cost and variability Lead a lithography module; create manufacturing-friendly solutions across 365nm, 248nm, 193i, and EUV Partner with integration and unit process teams; drive vendor engagement for new materials and equipment solutions Analyze failures and process limits; perform root cause and DOE-based improvements Document plans, results, and drive transfer to production fabs Minimum Qualifications: Bachelor’s degree in engineering, physics, or related field and 7+ years of semiconductor experience, or MS/PhD with 6+ years in photolithography Deep knowledge of imaging
Metrology Engineer - DRAM — Boise, ID - Main Site. Apply via Workday.
New College Grad - DRAM Design Engineer — Boise, ID - Main Site. Apply via Workday.
Design Methodology – Senior / Staff DRAM Power Integrity Engineer — Hyderabad - Phoenix Aquila, India. Apply via Workday.
MTS Lead DRAM Device Engineer — Boise, ID - ID1. Apply via Workday.
Sr BEOL Engineer - DRAM Process Integration — Boise, ID - Main Site. Apply via Workday.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Technology Node Development team is responsible for bringing next-generation DRAM products from concept to production by improving yield, validating new features, and driving product quality. The team collaborates across design, process integration, manufacturing, and test engineering to solve complex technical challenges and deliver innovative memory solutions that power the future of computing. As a Product Engineer Intern in the DRAM Technology Node Development group, you will work alongside experienced engineers to support the development of next-generation DRAM products. You will gain hands-on experience in product characterization, test development, yield analysis, and design validation while applying analytical and problem-solving skills to real-world engineering challenges. Responsibilities Support new DRAM product development through electrical characterization, test development, circuit analysis, and design validation activities. Analyze product, test, and yield data to identify performance issues and drive continuous improvement initiatives. Collaborate with process, design, manufacturing, and test engineering teams to investigate and resolve product and process-related issues. Develop and improve test methodologies, automation scripts, and data analysis tools to enhance product quality and testing efficiency. Apply engineering tools, statistical analysis techniques, and AI-enabled technologies to support product c
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 世界最先端技術を使用した半導体部品の開発・設計・製造を行っている会社です。 マイクロンメモリ ジャパン㈱の就業環境の特徴として下記が挙げられます。 障がい者向け エンジニア 職* 外資系企業ですが、英語が出来なくても問題ありません。 ※キャリアアップを目指したい方に最適なお仕事です。 主な業務内容 障害特性を考慮の上、以下のいずれか1つの業務を中心に、その業務に付随する関連業務をご担当いただきます。(AIの活用(Using AI)も行いながら業務を遂行いただきます) ・次世代メモリの設計開発 ・デザインツールを用いて回路パターンのデザイン ・試作品の評価 *詳細は面接時にお伝えします。 *すべての業務について、社内外関係者と業務を円滑に行うため、 電話やメールによるコミュニケーションが必要となります(聴覚 障害がある方にも支援・配慮いたします)。 【仕事範囲の変更範囲:会社の定める範囲】 応募条件: 障がい者手帳をお持ちの方 勤務地: 神奈川県相模原市 橋本技術センター 選考プロセス: 書類選考、面接(1~3回)、 実技(PCスキル等) 必須条件: ・高校卒業以上 ・Microsoft office(Word, Excel, PowerPoint, Outlookなど)基本的なソフトウエアを 使用できる。 ・日本語でのコミュニケーション must have Japanese language skills 勤務時間: 日勤 8:30~17:15 休日・休暇 日勤 年間126日(2025年度) (制度) 有給年間休暇 年間最大22日(年の途中で入社した場合は、按分した日数を付与) ファミリーフレンドリー休暇 年間最大8日(年の途中で入社した場合は、按分した日数を付与) 制度・福利厚生: ◆交通費支給(車通勤の場合、ガソリン代支給) ◆転居費用補助※入社時のみ、会社規定あり ◆単身赴任者の帰省時の交通費負担※会社規定あり ◆ファミリーフレンドリー休暇、結婚休暇、忌引、産前産後、育児休職、介護休職など ◆退職給付制度(確定給付企業年金・確定拠出年金での給付) ◆フレックスタイム制度※職種・業務内容により異なります<b
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Customer Engineering team at Micron, where we partner directly with leading datacenter customers to solve complex challenges and bring cutting-edge memory solutions to life. Our work sits at the intersection of innovation and real-world impact—enabling faster computing, smarter systems, and breakthroughs across industries. This role is a key bridge between Micron and our customers. As a Datacenter DRAM Customer Engineer, you’ll act as a primary technical advisor, helping customers design, qualify, and deploy memory solutions that power next-generation compute platforms. You’ll collaborate across engineering, sales, and product teams while influencing both customer success and Micron’s product direction. Responsibilities: Drive design wins and product qualifications for DRAM, HBM, SSD, and compute-focused solutions Partner with sales and cross-functional teams to execute strategic customer plans and track progress Resolve system configuration, setup, and performance issues in customer environments Guide customers on memory architecture, system configuration, and optimization for cloud/datacenter workloads Support validation and deployment through lab activities, design reviews, and system-level testing utilize AI proficiency or AI‑enabled ways of working where applicable Minimum Qualifications: <s
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Are you excited to drive Quality initiatives on new product from Design through Qualification? Collaborating across multi-functional teams to deep dive and actively drive resolution and ensure customer satisfaction in a fast paced and dynamic environment? Innovate and develop Quality and Reliability Strategies and enhancements? All while being part of a fun and supportive team? As a Development Quality Engineer in DEMQRA DQA Design Team at Micron Technology, Inc., your responsibilities will include the following: Work with key development partners in Design, Product Engineering, Technology Development, Quality Assurance and Manufacturing to identify and mitigate potential quality and reliability issues during the Design and pre-qualification phase of new product Identify Design specific risks for new High Performance Memory product and collaborate with the Design, PE, TD and QA teams to ensure correct verification, validation and detection specs are in place to ensure visibility to the status and success of mitigation efforts Drive deep-dive problem solving and mitigation/resolution alignment across the portfolio for DRAM related quality and reliability issues Act as the Subject Matter Expert on Design related quality and Live Die reliability issues and advise Global Quality leadership on risk and mitigation strategies Partner with Design, PE, and QA to align and recommend changes to verification and/or validation flows to ensure they are optimized to meet Micron’s QR nee
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic
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