Dram Ip Development Layout Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join our Advanced DRAM organization and help shape the future of memory technology! We are a team of world class engineers and scientists working in a leading-edge R&D environment to solve some of the industry's most sophisticated semiconductor challenges and to transform breakthrough concepts into manufacturable solutions. As a Process Integration Engineer, you will help define the future of memory technology by identifying novel solutions to scaling, performance, and power challenges in advanced semiconductor devices. You will work with experts in process development, device engineering, modeling, characterization, and reliability to develop and integrate new technologies from concept through implementation in silicon. Responsibilities: Lead integration activities for advanced semiconductor devices, including charge storage devices, thin-film transistors (TFTs), and related device structures Evaluate device operating mechanisms, failure modes, noise sources, and variability to improve device performance and reliability Partner with cross-functional teams to identify and resolve performance, yield, reliability, and product margin challenges Design, implement, and analyze experiments in the R&D fab to optimize process flows and meet product requirements Analyze inline, parametric, and probe data to drive yield improvement, process margin, and cost reduction Communicate sophisticated technical issues and lead teams toward achieving project goals <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. RESPONSIBILITIES AND TASKS: Develop new tests and test algorithms for products, which covers test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times Develop test programs for products using primarily Python and C coding on automated test equipment in the given area followed by test program release to manufacturing area Be a lead to new product introduction (NPI) as well as pre/post silicon check out Develop test Automation solutions as well as electrical validation and qualification of new test equipment and tools Independently debug and identify root causes on test issues and provide feedback to external groups Provide statistical data analysis, analytics and justification on program validation and its release to ensure program quality Evaluate and verify yields/quality with global teams to ensure we are shipping the highest quality product to our customers with enforce to all data sheet specification Support both internal and external groups on experiments designed to improve yield or capacity by resolving test issues that impact site in a timely manner Maintain tactical and project updates on daily and weekly basis, respectively. Updates should show progress against the timelines. Drive Innovation and Improvement with the end goal of reducing the Cost of Test for Micron in the Test Department Support intra-departmental (and multi-site) teams in dev

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Lead DRAM technology transfer efforts between development and manufacturing locations. Coordinate transfer achievements, qualification plans, and execution readiness reviews. Drive issue resolution during transfer ramp and production transition. Analyze process interactions across modules to optimize device performance and manufacturability. Conduct process change assessments and identify potential manufacturing risks. Minimum Qualifications: Bachelor’s degree in Engineering or a related technical field, or equivalent practical experience. Proven experience in semiconductor process integration. Knowledge of DRAM technology and manufacturing. Strong analytical skills with experience in yield analysis and statistical data analysis. Ability to work effectively by AI Assisted tools in cross-functional and global teams. Preferred Qualifications: Master’s degree or PhD in Engineering or a related technical field, or equivalent experience. Experience in risk assessment and problem-solving within semiconductor manufacturing. Experience in tech node transfer from NPI to HVM phase. Strong project management and communication skills. Demonstrated ability to successfully implement corrective actions for manufacturing issues. Familiarity with FMEA and risk mitigation planning. About Micron Technology, Inc. <p style="tex

DRAM Device & Process Modeling Engineer — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Develop system-level solutions, tools, and methodologies to optimize DRAM performance, power efficiency, and cost. Collaborate with multi-functional teams to ideate, evaluate, and implement innovative DRAM and memory system solutions. Analyze system behavior and assess solution effectiveness, making data-driven optimizations and trade-offs. Drive architectural innovation for current and future generations of DRAM technologies. Communicate complex technical concepts clearly and mentor team members through training and technical guidance. Using AI in applicable job functions Minimum Qualifications: Proven experience in memory design and product engineering, memory specifications and operations, or memory system architecture and usage. Minimum of 7 years of experience in the memory or semiconductor industry. Strong understanding of DRAM architectures and system-level interactions. Ability to analyze complex technical problems and drive solutions. Bachelor’s degree in Electrical Engineering, Physics, Computer Engineering, or a related field, or equivalent experience. Preferred Qualifications: Experience with advanced memory technologies such as LPDDR5/6, DDR5/6, GDDR6/7, or HBM3E/4. Strong analytical and problem-solving skills with a passion for innovation. Ability to identify complex technical challenges and develop creative, scalable solutions. Deep under

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are shaping the memory technologies that power today's most advanced computing platforms, from AI accelerators to mobile and client devices. Our DRAM Engineering team brings together skilled engineers across the globe to solve complex technical challenges, drive innovation, and deliver high-performance memory solutions. If you enjoy tackling difficult problems and turning ideas into products, you'll find exciting opportunities to make an impact here. As a Semiconductor Design Engineer (Principal / Member of Technical Staff / Senior Member of Technical Staff), you will play a key role in designing and optimizing next-generation DRAM products. You will work closely with global design, verification, and multi-functional teams to develop innovative circuit solutions that balance performance, power, quality, reliability, and cost. This role also offers the opportunity to influence technical direction, mentor engineers, and help advance future memory technologies. Responsibilities: Design and optimize digital and analog circuits for next-generation DRAM products, including memory arrays, control logic, datapaths, address decoding, and I/O circuitry. Lead circuit development, simulation, verification, and silicon validation to achieve performance, power, area, and quality targets. Drive floor-planning, layout optimization, parasitic analysis, and tape-out activities. Advance AI-assisted design, automation, and design-space exploration through collaboration with internal and external partne

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Overview At the Munich Development Center, we develop high-performance memory solutions for the graphics and AI markets. As part of the DRAM Design Engineering Group (DDEG), we collaborate closely with Micron’s global development and manufacturing teams. Our mission is to push the boundaries of memory technology through innovation, precision, and partnership. Role Overview We are looking for a motivated and curious working student or Master’s thesis candidate to join our DRAM design team. This is an outstanding opportunity to gain hands-on experience in integrated circuit (IC) design while working alongside expert engineers in a collaborative, startup-like environment. You will contribute to real-world projects and receive mentorship to support your academic and professional growth. Responsibilities Support the design and simulation of analog or digital circuit blocks under guidance Assist in developing schematics at the transistor level or RTL Participate in functional verification and layout reviews Contribute to testbench development and simulation setup Document design processes and results for internal use or academic reporting Collaborate with cross-functional teams to understand the full memory design flow Leverage generative AI tools to complete tasks in effective manner Optionally: define and complete a master’s thesis project aligned with team goals Required Qualifications Enrolled in a Bachelor’s or Master’s program in Ele

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Depending on the expertise, the below set of responsibilities can be interpreted for fastspice(Primesim/Finesim) or Verilog (Xcelium/VCS) based verification. Guide and set the direction for the verification effort within your areas of expertise in any project that the team undertakes. Provide verification support to design projects by simulating, analyzing and debugging pre-silicon full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Participate in developing verification methodology and verification environments for advanced DRAM and emerging memory products. Co-work with international colleagues on developing new verification flows to take on the challenges in DRAM and emerging memory design. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Enhancing the efficiency of design and verification through leveraging Artificial Intelligence. Your Experience and Qualification: Common Familiarity with DRAM operation Familiarity with Claude Code Schematic analysis Digital Design and Verification Expertise of the following area: System Verilog UVM</l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. You will contribute to innovative silicon-to-systems solutions, spanning technology development, advanced memory design, product development, systems design, and validation. This role requires collaboration with global multi-functional teams including invent, verification, product engineering, test, probe, process integration, assembly, and marketing. You will provide high-quality, efficient, and reliable memory solutions that optimize time-to-market and promote strong customer happiness. Responsibilities Contribute to new product development by supporting circuit design, layout, and optimization across memory, logic, and analog domains Assist with parasitic modeling, design validation, reticle experiments, and tape-out revisions Oversee layout activities including floor-planning, placement, and routing Perform circuit verification using modeling and simulation tools with industry-standard simulators Collaborate multi-functionally to support manufacturability, standardization, and overall product success Minimum Qualifications Bachelor’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or a related field Familiarity with digital and/or analog circuit design concepts Experience with circuit simulation and modeling tools Understanding of semic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary As a DRAM Architect, you will optimize DRAM solutions for power, performance, and cost while pioneering new memory features and system-level innovations. You will collaborate with global, multi-functional teams to deliver high-quality, reliable, and power-efficient DRAM solutions that meet aggressive performance and time-to-market goals. Responsibilities: Develop comprehensive DRAM system/component solutions, specifications, and methodologies to optimize DRAM performance, power efficiency, and cost. Collaborate with multi-functional teams to brainstorm and implement innovative ideas, assess solution efficiency, and make necessary adjustments. Drive innovation in future memory generations within a dynamic work environment. Analyze system behavior and assess solution effectiveness, make data-driven optimizations and trade-offs. Communicate complex technical concepts to engineers from various backgrounds. Minimum Qualifications: 3&#43; years of proven experience in memory design, product engineering, or system architecture and usage Self-motivated with exceptional problem-solving skills and a drive to discover new solutions. Excellent communication and interpersonal skills. Bachelor’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or a related field. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of memory systems. Our DRAM Architecture organization works at the intersection of silicon, packaging, systems, and customers to build technologies that power next-generation platforms. If you enjoy solving ambiguous problems that matter at industry scale, this is the place. This role is a senior technical leadership position with broad architectural ownership. You will develop complete DRAM system architectures, impact industry direction, and engage directly with customers and executives to convert complex ideas into scalable products. Responsibilities: Define next-generation memory system builds focusing on performance, capacity, RAS, and telemetry Lead cross-stack co-optimization spanning silicon, package, module, board, and system Architect sophisticated RAS and telemetry features and translate system needs into silicon Drive long-range memory technology strategy and influence industry standards Act as a senior technical liaison to customers, executives, and partners Minimum Qualifications: Bachelor’s degree or relevant equivalent experience in EE, CE, CS, or a related field Extensive hands-on experience in DRAM or memory systems architecture Deep understanding of DRAM timing, signaling, power, and reliability mechanisms Proven ability to translate system requirements into silicon architecture Preferred Qualifications: Master’s degree or PhD, or equivalent experience, in a related technical field Recognized techn

DRAM Device Engineer ID1 — Taichung - Fab 16, Taiwan. Apply via Workday.

DRAM Power Architect (MTS) — Boise, ID - Main Site. Apply via Workday.

DRAM Architect – Principal Engineer | MTS - TPG — Boise, ID - Main Site. Apply via Workday.

DRAM Power Architect, DEG — Boise, ID - Main Site. Apply via Workday.