Dram Layout Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Dry Etch Process Development team develops advanced plasma etch technologies that enable future memory scaling, improved device performance, and next-generation semiconductor manufacturing. Our engineers work closely with integration, equipment, and process teams to solve complex challenges and accelerate technology development. As a DRAM Dry Etch Process Development Intern, you will gain hands-on experience developing and optimizing advanced semiconductor etch processes that support future DRAM technologies. Working under the mentorship of experienced engineers, you will complete a technical project focused on process development, experimentation, and data analysis in a collaborative research and development environment. At the conclusion of the internship, you will present project results and recommendations to technical teams and leadership. Responsibilities Research and develop innovative solutions that support next-generation memory technologies and advanced dry etch processes. Design, implement, and analyze experiments to improve etch process performance, manufacturability, and product quality. Perform statistical analysis of technology development and pilot manufacturing data to identify trends, process opportunities, and root causes. Collaborate with process, equipment, and integration engineering teams to resolve technical challenges and drive pro

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We’re driving the next wave of memory innovation at Micron, pushing the boundaries of DRAM and enabling future scaling! Our team works at the intersection of science and manufacturing, turning advanced concepts into high-volume solutions that power a data-driven world. As a Principal/ MTS Wet Process Development Engineer, you will lead critical process innovation and integration for next-generation nodes. This role shapes wet process technology direction, influences roadmap decisions, and delivers scalable, manufacturable solutions that enable high-volume success. Key Responsibilities Technical Leadership and Problem Solving - Lead development, optimization, and troubleshooting of advanced wet process applications from Wet cleans and etches, Vapor-phase processes, Strip processes, Bevel etch, to Copper plating. Perform rigorous root cause analysis and implement robust, fab-ready and HVM-compatible solutions. Apply strong fundamentals in fluid dynamics, reaction kinetics, thermodynamics, transport phenomena. Evaluate interactions between upstream and downstream processes to ensure integration and yield success. Technology Development and Road-mapping - Translate device scaling requirements into actionable wet process technology roadmaps. Identify technical gaps and define solutions to meet critical specifications (CSPEC). Drive innovation in chemistry, process architecture, and tooling to support future technology nodes. Contribute to the development

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Dry Etch Lead Principal Engineer at Micron Technology, Inc. Micron is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions—starting with foundational DRAM, NAND, and NOR Flash memory, extending to SSDs, MCPs, HBM, and other memory-based systems. As the only memory fab in the western hemisphere, Micron is in the industry for over forty-five years and continues to stay as the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted and still growing. Responsibilities: Develop dry etch processes to meet physical and electrical product requirements Optimize processes to reduce cost, variability, and improve capability Collaborate with integration and process teams to develop innovative solutions Perform root cause and failure mode analysis and drive vendor improvements Support pilot line operations and transfer processes to production sites Minimum Qualifications: Bachelor’s degree in Engineering, Physics, or related field 3+ years of relevant experience including internships Strong analytical and creative problem‑solving skills Working knowledge of statistics and statistical process control Ability to manage multiple projects and work independently Preferred Qualifications:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are accelerating the transformation of information into intelligence through industry-leading memory and storage solutions. The 3D DRAM Photolithography team develops advanced patterning technologies that enable future memory scaling and support next-generation products powering AI, cloud computing, and data-intensive applications. Our work combines innovative research, semiconductor process development, and high-volume manufacturing innovation. As a 3D DRAM Photolithography Process Development Intern, you will gain hands-on experience in semiconductor process development while working on a dedicated technical project within the 3D DRAM Photo team. Under the mentorship of experienced engineers, you will collaborate across process and equipment subject areas to solve complex manufacturing challenges and develop innovative solutions that meet demanding product requirements. The internship culminates in a presentation of project results to technical and leadership teams. Responsibilities Develop and optimize photolithography processes that meet product requirements for physical and electrical performance. Partner with multi-functional process and equipment teams to find opportunities for process improvements and technology advancement. Conduct root-cause and failure-mode analyses to identify process limitations and implement corrective actions. Perform statistical analysis of pilot manufacturing and technology development data to support process optimization and decision-making

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a global leader in innovative memory and storage solutions that accelerate the transformation of information into intelligence. The 3D DRAM Metals team is at the forefront of developing next-generation DRAM technologies, working at the intersection of advanced materials science, process engineering, and semiconductor manufacturing. Team members collaborate across fields to develop scalable solutions that enable future memory innovations. Micron internships provide hands-on exposure to semiconductor process development and manufacturing technology. Interns work closely with experienced engineers on impactful projects that contribute to future product development while gaining valuable technical and professional experience. The internship culminates with the presentation of project findings and recommendations to engineering leadership and team members. Responsibilities Develop and optimize semiconductor processes to meet product requirements for physical and electrical performance. Partner with multi-functional process and equipment engineering teams to identify, evaluate, and implement process improvements. Perform root-cause analysis, failure-mode analysis, and experimental investigations to address process challenges and improve manufacturing outcomes. Analyze statistical data from pilot-scale technology development manufacturing lines and communicate findings through technical reports and presentations. Apply Artificial Intelligence and AI-Assisted tools, where approp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Overlay Strategy, Roadmap & Technical Leadership Own the overlay roadmap including bond overlay technologies. Serve as the technical authority for overlay, defining overlay specifications, error budgets, mark strategies, technical signoff criteria, and scaling requirements for future technology nodes. Develop innovative overlay solutions that enable advanced bonding while meeting performance, yield, manufacturability, and scaling objectives. Drive advancement of overlay metrology, automation, process control, modeling, and analytics capabilities in partnership with Process and Metrology teams. Apply advanced analytics, Artificial Intelligence, simulation, and experimental methodologies to accelerate learning, identify root causes, and improve overlay performance. Technology Development & Problem Solving Lead simulation and experimental process development activities, balancing modeling with hands-on characterization and technology development. Develop and maintain overlay error budgets, validation plans, experiments, and technical assessments that connect process behavior to device and integration requirements. Solve complex overlay challenges involving alignment, distortion, deformation, process interactions, and bonded wafers. Translate technical findings into actionable process improvements, technology decisions, and roadmap recommendations. <

Intern – Process Development Engineer, 3D DRAM Wet Etch — Boise, ID - Main Site. Apply via Workday.

Sr. Node Development Product Engineer - DRAM Technology — Boise, ID - Main Site. Apply via Workday.

New College Grad - Semiconductor Design Engineer, DRAM Products Group — Boise, ID - Main Site. Apply via Workday.

New College Grad - Design Engineer, DRAM Technology and Products — Boise, ID - Main Site. Apply via Workday.

Principal/Sr/Staff BEOL Engineer, DRAM PI — Hiroshima - Fab 15, Japan. Apply via Workday.

Principal / Senior / Engineer, E-characterization DRAM — Hiroshima - Fab 15, Japan. Apply via Workday.

New College Grad - Device Engineer, DRAM — Boise, ID - ID1. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking an experience high-speed high-speed IO/Clocking Design Engineering at a Principal/Sr Member of Technical Staff (SMTS) level to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the architecture, design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop core strategy and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Define, innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply robust high-speed circuit design techniques and enhance critical performance evaluation, including timing and jitter sensitivity, of the IO data path and clock path at circuit and full-chip level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation resu

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal/Member of Technical Staff (MTS) IO/Clock Design Engeer to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply robust high-speed circuit design techniques and enhance critical performance evaluation, including timing and jitter sensitivity, of the IO data path and clock path at circuit and full-chip level. Develop accurate modeling, analysis and simulation methodology to capture key circuit performance metrics and their impact to product specifications at full-chip and system level. Work with Product Engineering and SI team to compare silicon performance with simulation results and support correlation activities. Collaborate with process integration and transistor