Dram Layout Engineer Jobs

Sr. Engineer, Photo DRAM — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As an Engineering Execution Manager within Compute DRAM Product Engineering , you will lead engineering program execution for assigned DRAM products from pre-silicon readiness through qualification, production ramp, and transition to sustaining teams. This is an individual contributor leadership role, you will lead product execution across functional engineering teams through influence, technical judgment, and accountability. You will also collaborate across engineering and business organizations to build integrated plans, solve complex execution challenges, and deliver products that meet quality, yield, schedule, supply, and business requirements. Your work will have a direct impact on bringing innovative memory products to market! This technical leadership opportunity will allow you to develop broad product knowledge, strengthen your leadership skills across different functional groups, and learn across the semiconductor product lifecycle. Responsibilities Lead product execution from pre-silicon readiness through qualification and production ramp, building integrated schedules, dependencies, actions and decision points. Collaborate across Product Development, Design, Technology Development, Test, Package, Module, Quality, Manufacturing, Planning, and business teams to align technical and product achievements. Drive problem-solving for product risks and failures by facilitating issue triage, root-cause alignmen

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In HBM HIG (High Bandwidth Memory, DRAM Eng Group), we innovate and integrate end to end leading edge FE and BE process with state-of-the-art design, debug, test, and qualification techniques to develop the lowest power per bit solution to enhance customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a complex product such as HBM relies vastly on the vertical integration and the various engineering working in unison. As an Engineering Execution Lead/Manager in the HBM HIG organization you will be responsible for guiding a HBM product through various phases of a product i.e. concept, design, NPI and HVM by facilitating cross-functional life-cycle management. You will help build and maintain detailed development schedule and drive relevant tactical execution. In this position, you will provide leadership and direction for the Product Development Team (PDT

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in premier memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. The Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Create optimi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the ID1 fabrication site Process Integration and Yield Enhancement through test development, DOE data analysi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in the High Bandwidth Memory (HBM) Media Health (MH) team, you will work with Fab, Yield Improvement, Design, and other engineering groups passionately focused on HBM. You will develop, deploy, optimize, and innovate test strategies for Micron's DRAM in HBM products. The team acts as a key partner of these engineering groups and specialties, focusing on innovating new and improved test strategies and features. You will guide development for Probe (wafer level test), Burn-in, and ATE test code and testing techniques used to validate and ensure device performance. You will assist in debugging code and aiding other specialists in the characterization of applicable HBM devices. In this role, your additional responsibilities include an in-depth understanding of general device functionality specific to HBM products as well as schematics and signal integrity. Responsibilities: Work with Design Engineering to run simulations pre-silicon to validate DFT circuits and test modes as well as communicate design issues found. Work on pre-silicon tasks with MH and test teams to define required tester resources. Work with Test Engineering and HBM Product Engineering to ensure specific product requirements or limitations are comprehended, leading to silicon performance matching expectations. This work includes test program debug, examination of data, and test development. Support the fabrication sites and Process Integration through test development to increase effective process feedba

Everpure (NYSE: P) has evolved from storage pioneer to data platform, closing fiscal 2026 with $3.7 billion in revenue, its first billion-dollar quarter, and accelerating growth into FY27. Our strategic agenda spans the companies defining the next era of technology - hyperscalers, AI labs, the AI hardware supply chain, data platform providers, and the broader AI ecosystem. This type of work—work that changes the world—is what the tech industry was founded on. So, if you're ready to seize the endless opportunities and leave your mark, come join us. THE ROLE Drive the technical foundation and supply integrity of Everpure’s enterprise flash arrays, blades, and server building blocks as Component Engineering Manager. You will lead a high-performing engineering team and serve as the final authority on component qualification, ensuring every storage node, CPU, memory subsystem, and interconnect module meets uncompromising performance and reliability standards. By bridging Hardware Engineering, Quality, Supply Chain, and global semiconductor vendors, you will directly influence product architecture while safeguarding manufacturing continuity and operational scale. WHAT YOU'LL DO Engineering Leadership & Talent Development: Build, direct, and mentor a specialized team of component engineers spanning flash/SSD technologies and server platform hardware, fostering technical growth and setting execution priorities. End-to-End Component Qualification: Own the complete qualification lifecycle—defining rigorous test plans, analyzing supplier data, and issuing final approval for design-in and mass production across NAND flash, CPUs, DRAM, power systems, and interconnects. Strategic Flash & SSD Oversight: Drive roadmap alignment and technology node transitions with key storage suppliers, governing media characterization, firmware qualification, and long-term architectural integration. Supply Resilience & Risk Mitigation: Establish multi-sourcing strategies, lead s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In the Principal Engineer position, you will lead technical verification approaches to strengthen DRAM verification quality, standardization, and traceability throughout project families and pillars. You will invent the next generation of intelligent verification workflows and continuously advance scalable verification systems that align with new products, features, evolving design techniques (including RTL-focused flows), and scalable, family-based product development. This role is ideal for someone who excels in uncertain situations, enjoys forging new paths, and wants to impact verification across the DRAM roadmap. Responsibilities Verification Quality and Methodology Governance Define and drive DRAM verification methodology, quality standards, and AI-enabled strategies to improve coverage, traceability, efficiency, and defect prevention. Lead closed-loop silicon learning by identifying verification gaps, incorporating lessons learned into requirements and standard methodologies, and reducing recurring silicon issues. Own and continuously improve the JAMA requirements framework, ensuring alignment, scalability, and adoption across projects and teams. Simplify and optimize verification workflows through automation, AI, and process improvements that reduce cycle time and accelerate debug. Partner across engineering teams to drive methodology decisions, align collaborators, and scale verification approaches. <h2

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Drive and develop reliability verification with design and product teams by planning, overseeing, and developing stress patterns for increased reliability coverage. Be proficient on product reliability requirements and customer usage conditions for different DRAM products. Perform Verification Processes with Modeling and Simulation Using Industry Standard Simulators. Contribute to Cross Group Communication To Work Towards Standardization And Group Success. Working with Marketing, Quality, And Product Engineering Groups To Ensure Accurate Manufacturability Of Product. Proactively Solicit Guidance From Standards, Cad, Modeling, And Verification Groups To Improve The Design Quality. Drive Innovation Into The Future Memory Generations Within A Dynamic Work Environment. Drive customer usage model alignment across different functional teams. Work with technology teams to ensure high-risk reliability mechanisms are evaluated. Be advised on all silicon reliability related issues. Support product teams during silicon validation and qualification phase. Analyze and debug circuit down to device level in relation to degradation mechanism. Develop and improve reliability verification tools and methodologies. Engage in technical forums for continuous improvement of design for reliability methods. Train and mentor junior engineers. Employer will accept a Bachelor’s degree in Electrical Engineering, Computer Engineering or related field and 60 months of progressive, post-baccalaureate experience in the job offered or in a related occupation. Position r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Focus on technology node development to advance next-generation DRAM technologies. Contribute to DRAM product design to enable effective transfer of node development innovations into production products. Collaborate with product engineering and process technology teams to validate designs and help guide technology direction. Perform circuit design and floor planning, including power delivery network (PDN) design. Conduct simulation, debugging, and root cause analysis of design and process issues. Identify failures and provide corrective feedback to block design owners. Deliver design insights and recommendations to Technology Development process teams. Validating device and schematic functionality using memory testing systems. Requirements: Employer will accept a Master’s degree in Electrical Engineering, Computer Engineering, or related field and 2 years of work experience in job offered or in a related occupation. Position requires: 1. CMOS Circuit Design; 2. Digital Logic; 3. Mixed Signal Design; 4. Sense Amplifier; 5. Clock or Data Path; 6. AOCV; 7. Power, IR Drop, or PDN; 8. DFT; 9. Spice or Spectre; 10. Verilog; 11. Parasitic Extraction or SPEF; 12. Floor planning or Routing; 13. Cadence Virtuoso; 14. Python; and 15. Data Analysis (JMP). As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and profes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior Dry Etch Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Strong process area knowledge DRAM development and manufacturing experience

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務概要 メトロロジー プロセス開発エンジニアは、次世代DRAMおよびHBM技術を支える先端計測技術の開発・導入を担当します。 測定レシピ開発、データ解析、計測装置の評価・立上げに加え、装置サプライヤーと連携した新規計測装置の開発にも携わります。 半導体業界での経験は必須ではなく、製造業で培った分析力や問題解決力を活かしながら、世界中のエンジニアと協働し、最先端メモリ技術の開発に挑戦できるポジションです。 職務内容 先端DRAM/HBM技術向けの新規計測手法および測定レシピの開発・認定 測定結果の解析および測定精度改善に向けた問題解決活動 新規計測装置および測定技術の評価・導入 計測装置の開発業務&#xff08;要求仕様の検討・策定、サプライヤーとの調整・開発推進、完成後の装置立ち上げ・導入までを一貫して担当&#xff09; プロセス管理戦略の策定およびモニタリング計画の構築 実験データおよび量産データを活用したプロセス改善・歩留まり改善支援 プロセスインテグレーション、製造、歩留まり改善、装置エンジニアリング部門との協業 計測装置サプライヤーとの技術レビューおよび開発推進 設備投資計画&#xff08;Capital Planning&#xff09;、設備設置、立ち上げ、認定活動の支援 AIツールを活用した業務効率改善およびデータ活用の推進 必須条件 修士卒以上&#xff08;電気・電子、材料、物理、化学、化学工学、機械工学などの理工系関連分野&#xff09; 製造業または技術系職種における業務経験 論理的思考力および問題解決能力 データを基に課題を分析し、改善策を検討できる能力 日本語による円滑なコミュニケーション能力&#xff08;目安&#xff1a;JLPT N2以上&#xff09; 英語によるコミュニケーションに抵抗がないこと AIツール&#xff08;Anthoropic Claude、Microsoft 365 Copilot等&#xff09;を活用しながら業務効率向上や課題解決に取り組めること 歓迎条件 半導体業界における実務経験 自動車、化学、精密機械、電子部品等の製造業での経験 計測機器、分析装置、生産設備に関する知識または経験 XRD、SIMS、OCD、Scatterometry、CD-SEM、Film Metrology等に関する知識 統計解析や工程管理手法に関する経験 DRAM、HBM、NANDなど先端メモリ技術への興味・関心 海外メンバーとのプロジェクト経験 求める人物像 論理的に物事を整理し、課題解決に取り組める方 指示待ちではなく、自ら考え行動できる方 多様なバックグラウンドを持つメンバーと協働できる方 新しい技術やAIツールの活用に前向きな方 グローバルな環境で成長したい方 <li