Dram Power Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life. Our commitment to people, innovation, tenacity, collaboration, and customer focus enables us to deliver leading memory and storage solutions that power artificial intelligence, data centers, mobile devices, automotive applications, and other emerging technologies. The DRAM Lithography team develops and optimizes advanced photolithography processes tha t support current and future semiconductor manufacturing technology. As a DRAM Lithography Intern, you will contribute to projects focused on advancing next-generation semiconductor manufacturing processes. You will collaborate with engineers across Photolithography, Metrology, Dry Etch, Wet Process, and other process areas to develop innovative solutions for process optimization and technology development. During the internship, you will complete one or more technical projects with opportunities to apply AI and data-driven approaches to complex manufacturing challenges. Responsibilities Design and execute experiments (DOE) to optimize photolithography processes, including EUV lithography, photoresist performance, and related process technologies. Plan, run, and document experiments in a semiconductor cleanroom environment using advanced process equipment. Analyze process images and manufacturing data using commercial and in-house software tools, including AI-enabled methodologies where appropriate. Support projects focused on photolithography simulations, process window opti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an HBM Memory Design Engineer in Micron’s HBM Architecture Team, you will design, simulate, analyze, and floorplan digital and analog DRAM circuits used in advanced HBM technology. You will evaluate block-level and full-chip functionality, perform architectural pathfinding, and contribute to the development of next‑generation high‑bandwidth DRAM solutions. This role works across diverse engineering teams to deliver functionally accurate, low‑power, and high‑performance HBM products by bringing to bear 3D stacking and TSV-based integration. Responsibilities • Design, simulate, and optimize digital and analog DRAM circuits including data path, ECC, command/control, and high‑speed timing structures • Evaluate full‑chip and block‑level functionality and propose solutions to achieve correct circuit and system behavior • Perform timing, area, power, and complexity analysis for high‑speed DRAM and mixed‑signal circuits • Conduct pathfinding studies and feasibility analyses for future HBM architectures • Contribute to the development, layout, and optimization of memory, logic, and analog circuits • Analyze circuit behavior under varying PVT and parasitic conditions to ensure robust operation • Collaborate with multi-functional teams across build, verification, product engineering, process, and packaging • Support design reviews, documentation, and continuous improvement of design methodologies Minimum Qualifications • BSEE with 7+ years, or MSEE with 5+ years of releva

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 43 years, Micron Technology, Inc. has advanced the world’s most innovative memory and semiconductor technologies. As an HBM Memory Design Engineer within the HBM Architecture Team, you will design, simulate, and optimize digital and analog DRAM circuits for next‑generation high‑bandwidth memory products. You will evaluate block‑level and full‑chip functionality, solve complex challenges in building, and collaborate with a distributed team to deliver highly reliable, industry‑leading HBM solutions. This role provides the opportunity to contribute to groundbreaking DRAM design, TSV‑based 3D integration, and high‑speed mixed‑signal architectures supporting Machine Learning and AI applications. Responsibilities Design and analyze digital, analog, and mixed‑signal circuits for HBM DRAM products. Perform schematic entry, simulation, and optimization of DRAM blocks including data path, ECC, command control, and clocking circuits. Evaluate full‑chip and block‑level functionality and deliver solutions ensuring functional accuracy. Conduct pathfinding and feasibility studies for next‑generation HBM architectures. Optimize circuit timing, area, power, and complexity across high‑speed DRAM designs. Support design floor planning, layout reviews, and cross‑domain integration of memory, logic, and analog circuits. Collaborate with global engineering teams to drive innovation and support vertical integration across design

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the CMOS Device Integration Team at Micron, where we push the limits of memory technology every day. We work at the intersection of device physics, process integration, and product performance to enable the next wave of DRAM, HBM, and Compute-in-Memory innovation. If you’re excited by challenging technical problems and real-world impact, you’ll feel right at home here! In this role, you’ll serve as a technical leader shaping the future of Micron’s most advanced memory products. As a Distinguished Member of Technical Staff, you’ll drive CMOS device and module development that directly impacts array efficiency, data rates, and product scalability. Your expertise and influence will help guide technology decisions that power AI, high-performance computing, and emerging applications. Responsibilities: Develop and integrate advanced CMOS devices for next-generation DRAM, HBM, and emerging memory architectures Perform detailed electrical characterization of CMOS devices and circuits to drive performance improvements Partner with Design, TCAD, Modeling, Process, Reliability, and Layout teams to deliver integrated technology solutions Provide technical leadership, strategic recommendations, and clear presentations to guide technology direction Minimum Qualifications: Master’s degree or PhD in Electrical Engineering or equivalent practical experience 10 or more years of hands-on experience in advanced CMOS device design and/or integration 1

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we build the memory and storage that powers everything from massive data centers to the devices people carry every day. Our DRAM IP Design team shapes the circuits at the heart of these products, carrying innovative designs from concept all the way to silicon. We work across global design, verification, and product teams, and the work we do here helps define where the semiconductor industry goes next! As a Principal Analog Design Engineer, you'll help shape the next generation of Micron's memory products, bringing circuit designs to life and directly influencing their performance, quality, and reliability. You'll partner with design, verification, and product teams around the world, operating with the independence and technical depth expected of a principal engineer. It's a role where your circuit decisions show up in silicon that ships at scale. Responsibilities: Design, optimize, and verify block-level analog and mixed-signal circuits for DRAM Propose, evaluate, and implement new or improved circuit topologies to enhance block PPAC Work with the internal data science team and EDA vendors to leverage agentic AI and AI-assisted design flows for circuit optimization Expand verification coverage to strengthen robustness and mass-production yield Partner with global design groups, guide layout through post-layout simulation, support silicon-to-simulation correlation, and operate independently to define solutions and methods Minimum Qualifications:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we build the memory and storage that powers everything from massive data centers to the devices people carry every day. Our DRAM IP Design team shapes the circuits at the heart of these products, carrying innovative designs from concept all the way to silicon. We work across global design, verification, and product teams, and the work we do here helps define where the semiconductor industry goes next! As a Principal Analog Design Engineer, you'll help shape the next generation of Micron's memory products, bringing circuit designs to life and directly influencing their performance, quality, and reliability. You'll partner with design, verification, and product teams around the world, operating with the independence and technical depth expected of a principal engineer. It's a role where your circuit decisions show up in silicon that ships at scale. Responsibilities: Design, optimize, and verify block-level analog and mixed-signal circuits for DRAM Propose, evaluate, and implement new or improved circuit topologies to enhance block PPAC Work with the internal data science team and EDA vendors to leverage agentic AI and AI-assisted design flows for circuit optimization Expand verification coverage to strengthen robustness and mass-production yield Partner with global design groups, guide layout through post-layout simulation, support silicon-to-simulation correlation, and operate independently to define solutions and methods Minimum Qualifications:

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we're not just designing chips. We're building the physical architecture that powers artificial intelligence, accelerates cloud computing, enables autonomous vehicles, and connects the world through mobile and edge devices. Every breakthrough in AI — from large language models to next-generation data centers — runs on memory. And every bit of that memory lives inside a package that someone like you designs! We're looking for a Senior Package Design Engineer who is passionate about sadvanced semiconductor packaging and ready to lead at the intersection of silicon, system, and scale. This is a high-impact, highly visible role where you'll work across the full product lifecycle — from early-stage co-design with silicon teams all the way to High Volume Manufacturing (HVM). If you thrive where precision meets innovation, where your decisions shape products reaching millions of users worldwide, and where your expertise directly influences how the AI era unfolds — this role is for you! Responsibilites: Lead Co-Design from Silicon to System - Partner with silicon design, Business Units, customers, and package architecture teams to define new product concepts from the earliest stages of chip development - Optimize die floorplans, interconnection schemes, and package architectures — from concept to HVM - Drive trade-off studies and architecture decisions for advanced DRAM products targeting AI/D

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Compute and Memory Business Unit (CMBU), where we shape how memory powers the world’s most demanding computing platforms. Our team works at the intersection of advanced DRAM technology, system architecture, and emerging AI workloads. We collaborate closely with customers, partners, and internal R&D teams to influence the future of memory-centric system design—and we have a lot of fun doing it! As a Product Architecture Engineer for DRAM, you will play a key role in defining how Micron memory technologies enable AI training and inference platforms. This role blends deep technical exploration with industry engagement and internal collaboration. You will help translate system-level challenges into differentiated DRAM solutions while influencing both customer designs and Micron’s product roadmap. Responsibilities : Explore and evaluate system architectures using modeling, simulation, and prototyping tools Engage customers and partners to identify system bottlenecks and future memory innovations Pathfind AI-focused architectures using LPDDR and DDR DRAM technologies Define and explore DRAM features that increase value in AI and high-performance systems Mentor and coach junior architects and engineers Minimum Qualifications : Bachelor’s degree in Electrical Engineering or equivalent practical experience 10+ years of experience in product engineering or product archit

DRAM Power Architect (MTS) — Boise, ID - Main Site. Apply via Workday.

DRAM Power Architect, DEG — Boise, ID - Main Site. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of memory systems. Our DRAM Architecture organization works at the intersection of silicon, packaging, systems, and customers to build technologies that power next-generation platforms. If you enjoy solving ambiguous problems that matter at industry scale, this is the place. This role is a senior technical leadership position with broad architectural ownership. You will develop complete DRAM system architectures, impact industry direction, and engage directly with customers and executives to convert complex ideas into scalable products. Responsibilities: Define next-generation memory system builds focusing on performance, capacity, RAS, and telemetry Lead cross-stack co-optimization spanning silicon, package, module, board, and system Architect sophisticated RAS and telemetry features and translate system needs into silicon Drive long-range memory technology strategy and influence industry standards Act as a senior technical liaison to customers, executives, and partners Minimum Qualifications: Bachelor’s degree or relevant equivalent experience in EE, CE, CS, or a related field Extensive hands-on experience in DRAM or memory systems architecture Deep understanding of DRAM timing, signaling, power, and reliability mechanisms Proven ability to translate system requirements into silicon architecture Preferred Qualifications: Master’s degree or PhD, or equivalent experience, in a related technical field Recognized techn

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Unique Opportunities Complete ownership of verification and end to end analysis of complex full chip gate level custom designs with advanced low power and power management technologies spread across multiple categories such as DDR4,LPDDR4,DDR5 and LPDDR5 that are capable of operating at high speeds of up to 9600MT/s. Collaborate closely with design and verification team members spread across the globe, many of whom have decades of experience in memory design. Work on multi-functional tasks that can widen your skill set and experience in managing design verification of large and complex design Responsibilities Guide and set the broader direction for the verification effort of any project that the team undertakes. Lead cross-site efforts in developing verification methodology and verification environments for advanced DRAM and emerging memory products. Provide advice to senior management on significant technical issues. Strive to establish best known methods (BKM) within the group by driving development meetings, technical forums, etc. Provide verification support to design projects by simulating, analyzing and debugging pre-silicon full chip designs. Drive development of test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI</spa

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Within Micron’s Heterogeneous Integration Group (HIG), we are driving the next generation of High Bandwidth Memory (HBM) solutions that power advanced computing and AI applications. Our team brings together experts across design, product development, manufacturing, and ecosystem partnerships to solve complex technical challenges and deliver innovative memory technologies. The Design Development Technical Lead (DDTL) plays a critical role in enabling predictable, high-quality execution across the HBM design lifecycle. As the single-threaded technical program owner for HBM Build, you will coordinate cross-functional teams. You will manage technical dependencies and risks. You will provide clear leadership across build, product, and executive collaborators to ensure successful program delivery. Responsibilities: Lead end-to-end execution of HBM build achievements across DRAM, base die, test vehicles, interposers, IP, and sustaining development efforts Drive multi-functional alignment, manage dependencies, and maintain execution plans to achieve schedule, cost, and quality objectives Lead governance activities including design reviews, program reviews, risk management, and change control processes Partner with foundries, IP vendors, contractors, and procurement teams to resolve execution challenges and support design delivery Own roadmap communication, executive reporting, and collaborator alignment for HBM build programs Minimum Qualifications: Bachelor’s degree in Electri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Member of Technical Staff HBM Design Architect, you will be responsible for design and development of high-speed interface between DRAM and Base die in HBM cube! This includes designing the DRAM command and control logic, as well serializing and de-serializing scheme. You will collaborate with a highly creative and motivated development team applying brand-new memory technologies to build groundbreaking HBM products! Responsibilities: Responsible for the high-speed DRAM and Base die interface in HBM cube. Design the DRAM command and control logic, as well as serializing and de-serializing scheme at the interface. Conduct circuit simulations using standard industry simulators such as FINESIM, HSPICE and VERILOG Collaborate with data path design on floor planning and full chip testbench. Analyze timing/area/power in high-speed DRAM or mixed-signal design. Contribute to the development of new HBM product opportunities by assisting with the overall design, layout, and optimization of Memory, Logic, and Analog circuits. Qualifications: Extensive experience with DRAM operation and JEDEC specifications across DDR, LPDDR, GDDR, and HBM product families. Strong technical expertise in analog and mixed-signal circuit design. Hands-on proficiency in DRAM command decoding, bank logic, and RAS/CAS chain design. Demonstrated innovation and problem‑solving capabilities in

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s Global Procurement team and help shape the future of Advanced Packaging technology. In this role, you will drive global sourcing and procurement strategy for process equipment capital supporting Technology Development (TD), with a focus on cost leadership, supplier strategy, and technology enablement. Through strong partnerships with internal stakeholders and strategic suppliers, you will accelerate innovation and readiness for next-generation packaging solutions. As part of an inclusive, high-performing team, you will leverage your expertise to support Micron’s relentless pursuit of innovation for customers and partners, including enabling Generative AI and Agentic AI-driven solutions that power future Advanced Packaging technologies. At Micron, you will contribute to a culture built on integrity, sustainability, collaboration, and community impact while helping drive the breakthroughs that fuel the next era of innovation About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G