Dram Product Engineer Yield And Quality Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Lead the architecture, design, integration, and silicon validation of complex analog and mixed-signal circuits for advanced DRAM products, including amplifiers, comparators, references, LDOs, charge pumps, oscillators, DLLs, I/O circuits, and on-chip monitors. Drive development of custom analog and digital IP from concept through tape-out, silicon bring-up, and production. Define architectures and design methodologies to optimize power, performance, area (PPA), reliability, yield, and manufacturability. Lead verification, modeling, parasitic analysis, silicon correlation, and design signoff across PVT and reliability corners. Guide physical implementation, including floorplanning, matching, placement, routing, and reliability-aware layout practices. Collaborate with Product, Process, Test, Probe, Assembly, and Manufacturing teams to ensure successful product qualification and high-volume production. Drive design quality, standardization, and continuous improvement through advanced CAD, modeling, automation, and verification methodologies. Mentor and develop engineering talent while providing technical leadership across projects and product generations. Drive innovation through reusable IP development, patents, technology roadmaps, and differentiated circuit architectures. Leverage engineering tools powered by AI and agentic AI workflows to improve build efficiency, accelerate verification, optimize PPA, and reduce p

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 ・Micronの安全方針に従い、必要な安全教育を完了し、安全を最優先に業務を遂行する。 ・DRAM製造におけるドライエッチプロセスの開発、最適化、および維持管理を担当する。 ・歩留まり、品質、生産性、およびコスト改善に向けたプロセス改善活動を主導する。 ・統計解析および問題解決手法を活用し、工程異常や製品不良の原因解析および是正を行う。 ・新製品導入、新技術ノード立上げ、およびプロセス変更評価を計画・実行する。 ・設備エンジニアおよび装置メーカーと協力し、装置性能向上および安定稼働を推進する。 ・工程能力改善、リスク低減、および生産性向上プロジェクトをリードする。 ・技術文書、標準作業手順書、工程仕様書および報告書を作成・維持管理する。 ・グローバル開発チームおよび社内関係部門と連携し、技術課題の解決とロードマップ推進に貢献する。 ・データ分析ツールおよび生成AIを活用し、技術解析、レポート作成、知見共有、プロジェクト推進および意思決定の迅速化を行う。 要件 ・工学、材料、化学、物理、電気電子、または関連分野の学士号以上。 ・半導体製造プロセスまたは装置技術に関する知識を有すること。 ・統計解析および問題解決能力を有すること。 ・多部門およびグローバルチームと協働できるコミュニケーション能力。 ・Microsoft Officeおよびデータ分析ツールの活用経験。 ・英語による基本的なコミュニケーション能力。 ・プログラミング、データベース、スクリプト作成の基礎知識を有することが望ましい。 ・AIツール（生成AIを含む）を活用して情報収集、データ分析、文書作成、業務効率化を行う能力、または新しいAI技術を積極的に学習し活用する意欲を有すること。 Responsibilities and Tasks • Complete all required safety training and perform work in accordance with Micron safety policies. • Develop, optimize, and sustain advanced dry etch processes for DRAM manufacturing. • Lead process improvement initiatives focused on yield, quality, productivity, and cost reduction. • Apply statistical analysis and structured problem-solving methodologies to identify, diagnose, and resolve manufacturing issues. • Plan and execute process evaluations supporting new product introduction, technology node transitions, and process changes. • Collaborate with equipment engineers a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As RAM Detection (RDA and Metrology) Detection Strategy Senor Engineer/ Principal Engineer at Micron Technology, Inc., you will be collaborating with process, equipment, as well as process integration team, responsible for starting up, developing and optimizing detection to improve product yield, quality, and cost! Responsibilities include working closely with the NAND and DRAM sites, HVM and TD, and even suppliers, to achieve Inline Visibility and Inline Control for Detection enablement and improvement. This position is responsible in setting up BKM (Best Known Method) related to RAM Detection performance, RAM detection cost and RAM supplier engagement. This position also ensures BKM alignment and deployment, hence RAM Standardization across sites! What’s Encouraged Daily: Lead Detection SWAT (System Workforce Allocation Team) in identifying BKM and strategies to meet Detection goal Lead RAM network in BKM standardization across all sites Develop metrics and KPI to measure success and performance of the team Lead a team of engineers in projects, see opportunities and risks, and find solutions to clear roadblocks. Devise strategy, plans and roadmap for team for short term and long term Apply organizational skill in job assignment and task allocation Prioritize resources in the team to accomplish goals. Maintain good working relationship with partn

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role supports a high-visibility manufacturing expansion in Boise, where Micron is investing approximately $15 billion to establish leading-edge DRAM manufacturing capabilities. The team plays a critical role in driving operational excellence, process stability, yield improvement, and manufacturing output while supporting Micron's long-term global growth strategy in semiconductor manufacturing. The ID1 High Volume Manufacturing Shift Process Engineer is responsible for optimizing semiconductor manufacturing processes, improving product quality, increasing equipment and process efficiency, and supporting area throughput goals. This position partners closely with equipment engineers, shift operations teams, process owners, and cross-functional stakeholders to rapidly resolve issues, implement continuous improvement initiatives, and ensure manufacturing objectives are achieved safely and effectively. Responsibilities Monitor and optimize manufacturing processes to improve yield, quality, throughput, and overall equipment effectiveness while supporting area KPIs and wafer output goals. Analyze process performance using SPC, FDC, DOE, and other engineering methodologies to identify trends, resolve excursions, and drive systematic problem solving. Lead issue resolution activities by identifying, escalating, and addressing process, tool, defect, yield, and output-related concerns in a timely manner. Develop, update, and main

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are passionate about advancing semiconductor manufacturing through innovation, collaboration, and continuous improvement. Our Process Integration team plays a critical role in enabling leading-edge DRAM technologies by optimizing processes, improving yield, and driving manufacturing excellence. We foster a culture of technical curiosity, data-driven decision making, and cross-functional partnership. As a Fab RegE Process Integration Engineer (Bevel/Backside Focus), you will lead the development, optimization, and sustainment of RegE, bevel, and backside processes that directly impact product quality, yield, and reliability. This role offers the opportunity to solve complex manufacturing challenges, influence future technology nodes, and work closely with Process, Equipment, RDA, and Manufacturing teams to deliver innovative process solutions. Responsibilities: Develop and optimize RegE, bevel, and backside process technologies to improve yield, quality, reliability, and cost performance Lead process improvement initiatives, utilizing data-driven methodologies to identify, diagnose, and resolve manufacturing challenges Monitor and improve process health metrics, defect control strategies, and process capability to strengthen manufacturing robustness Partner with cross-functional teams to investigate process abnormalities, implement corrective actions, and mitigate manufacturing risks Support technology development, qualification, and transfer activities by deploying best-known methods

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff DFT Design Engineer, you will work on design, simulation, and validation of next generation High Bandwidth Memory (HBM) architectures and circuit blocks. The HBM DFT Design Engineer is responsible for defining, designing, and integrating Design for Test (DFT) architectures for next generation High Bandwidth Memory (HBM) products. This role ensures robust test coverage across wafer, die, stack, and system in package (SiP) test stages while balancing performance, power, area, and manufacturing cost. The engineer works in a multi-functional manner with HBM build, verification, product engineering, test enablement, packaging, and external partners to deliver manufacturable, high quality HBM solutions. Responsibilities will include, but are not limited to: Define and implement HBM DFT architectures, including scan, MBIST, JTAG, boundary scan, TSV test, redundancy test, and at‑speed test structures. Develop DFT solutions for both base die and DRAM die, considering stacked‑die and cube‑level test requirements. Design and integrate test access mechanisms to support wafer probe, cube test, and SiP/system test flows. Collaborate with Product Engineering and Test Enablement teams to align DFT features with manufacturing test flows and cost targets. Support yield learning, failure analysis, and debug by enabling observability and controllability in silicon. Work closely with logic, analog, layout, verification, and physical design teams to ensure DFT is

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Leveraging AI for design quality

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand groundbreaking manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. As a Dry Etch Process Engineer, you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a brand new fabrication environment, working with multi-functional teams to improve yield, quality, reliability, and productivity. This is an excellent opportunity to apply engineering fundamentals, develop technical expertise, and grow your career in semiconductor manufacturing. Responsibilities Support the development and optimization of dry etch processes to improve product performance, yield, and manufacturing efficiency. Analyze process and manufacturing data to identify trends, solve issues, and implement corrective actions. Partner with process integration, equipment,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s vision is to transfer how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a process integration and device engineer Intern at Micron Technology, Inc., you will have opportunities to work with an industry leading team on cutting edge technologies to enable next generation DRAM in the manufacturing Fab, ramp up production yield and deliver high quality DRAM products to customers. You will be offered hands-on experience in semiconductor process integration, electrical data analysis, with exposure to advanced technology development, yield improvement, and cross-functional collaboration. Responsibilities Support integration of process modules across various DRAM module loops. Analyze electrical and inline data to identify yield detractors and process anomalies. Collaborate with cross-functional teams (YE, Device, PI, process et al) to drive continuous improvement. Document findings and present updates to engineering and leadership teams. Leveraging AI tool to improve problem solving efficiency and productivity Requirements: Strong knowledge of semiconductor devices is required. Advanced CMOS or capacitor knowledge is preferred. Basic Knowledge of mainstream memory such as DRAM, NAND, NOR et al. Knowledge of sta

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s vision is to transfer how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a process integration and device engineer Intern at Micron Technology, Inc., you will have opportunities to work with an industry leading team on cutting edge technologies to enable next generation DRAM in the manufacturing Fab, ramp up production yield and deliver high quality DRAM products to customers. You will be offered hands-on experience in semiconductor process integration, electrical data analysis, with exposure to advanced technology development, yield improvement, and cross-functional collaboration. Responsibilities Support integration of process modules across various CMOS module loops. Analyze inline data to identify yield detractors and process anomalies. Collaborate with cross-functional teams (YE, Device, PI, process et al) to drive continuous improvement. Document findings and present updates to engineering and leadership teams. Leveraging AI tool to improve problem solving efficiency and productivity Requirements: Knowledge of semiconductor process flow. Knowledge of DRAM process flow is a plus. Basic Knowledge of mainstream memory such as DRAM, NAND, NOR et al. Some knowledge of individual processes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop, debug, and maintain code that enables the parallel testing of advanced memory devices. Support R&D, interacting closely with global teams, as well as taking part in the designing and debugging of test hardware. Develop efficient and innovative solutions of production test flows through test algo optimization. Design test plans for new tests and test algorithms for DRAM, which cover test software and hardware requirements, defect coverage, characterization, trending, process flow, and test times. Develop test programs for products using primarily C++ coding and Python on Automated Test Equipment (ATE) in the given area followed by test program release to manufacturing areas. Drive innovation and improvement through optimizing test programs by applying more efficient testing methods to reduce product test times and manufacturing costs. Demonstrate a thorough understanding of the device/part as it applies to device/part testing. Automate test processes by writing software to improve work efficiency. Develop tools to help provide better analysis and insight of the terabytes of probe data. Develop new Design for Test (DFT), Design For Manufacturability (DFM), and Design For Reliability (DFR) capabilities. Independently debug and identify root causes of test issues and provide solutions across internal/external groups. Provide meaningful statistical data analysis, analytics and justification of program validation and its release to ensure program quality and data integrity. Evaluate and verify yields/quality with global teams to ensure shipping

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an MTB Assembly Equipment Engineer, you will be responsible for evaluating and optimizing manufacturing processes, leading equipment selection and implementation, and driving qualification and ramp-up of new processes equipment. You will collaborate closely with process, quality, procurement, and vendor teams to ensure equipment performance meets yield and productivity targets. In addition, you will lead root cause analysis of equipment issues, drive continuous improvement initiatives, implement automation and smart monitoring systems, participate in cross-functional technical assessments and strategic planning to enhance overall manufacturing competitiveness, using and applying AI in job also. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. <span

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for monitoring yield performance and performing CA/PA on your assigned area. Use AI agent for defect analysis and yield improvement. Assist with function team through systematic problem-solving and data mining, quality workmanship, and routine reviews of maintenance checklists and procedures About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we build the memory and storage that powers everything from massive data centers to the devices people carry every day. Our DRAM IP Design team shapes the circuits at the heart of these products, carrying innovative designs from concept all the way to silicon. We work across global design, verification, and product teams, and the work we do here helps define where the semiconductor industry goes next! As a Principal Analog Design Engineer, you'll help shape the next generation of Micron's memory products, bringing circuit designs to life and directly influencing their performance, quality, and reliability. You'll partner with design, verification, and product teams around the world, operating with the independence and technical depth expected of a principal engineer. It's a role where your circuit decisions show up in silicon that ships at scale. Responsibilities: Design, optimize, and verify block-level analog and mixed-signal circuits for DRAM Propose, evaluate, and implement new or improved circuit topologies to enhance block PPAC Work with the internal data science team and EDA vendors to leverage agentic AI and AI-assisted design flows for circuit optimization Expand verification coverage to strengthen robustness and mass-production yield Partner with global design groups, guide layout through post-layout simulation, support silicon-to-simulation correlation, and operate independently to define solutions and methods Minimum Qualifications: