Dram Systems Architecture Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where bold ideas become real technology. We push the limits of memory and storage innovation, and we thrive in a collaborative environment where engineers learn, build, and solve challenges together. We are driven by curiosity, creativity, and the pursuit of better solutions every day! We are seeking a Principal or Member of Technical Staff (MTS) in Analog Design to join our DRAM IP Design team. As a Principal/ MTS, you will help shape the next generation of Micron's memory products, while working closely with global design, verification, and product teams to bring innovative circuit designs from concept to silicon. Your work will directly influence product performance, quality, and reliability—and contribute to advancements that define the semiconductor industry. Responsibilities: Design, optimize, and verify block‑level analog and mixed-signal circuits for DRAM projects. Work with the internal data science team and EDA vendors to leverage and improve AI-assisted design flow and circuits optimization. Propose, evaluate and implement new or improved circuit topology to further enhance PPAC of the circuit block. Improve design verification scope and coverage to increase circuit robustness to enhance mass production yield. Partner with global design groups and provide layout guidance through post‑layout simulation. Compare silicon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Execution & PI Ownership Lead day‑to‑day Process Integration execution for assigned DRAM modules within the Advanced Technology & Engineering (ATE) organization. Own yield ramp, stability, and integration readiness for assigned scope during technology transfer, pilot, and early HVM phases. Drive root cause investigations for top yield detractors using DOE, SPC/FDC, FMEA, 8D, and structured problem‑solving methodologies. Ensure process window margin, manufacturability, and reliability requirements are met and sustained. Champion adoption of Best‑Known Methods (BKM) and site‑to‑site learning to reduce variability and accelerate learning cycles. Technology Transfer & Ramp Support Execute DRAM technology transfer activities from TD or donor fabs to ID1 under guidance from M2/M3 leadership. Support new product introduction (NPI), process qualification, and customer ramp readiness. Coordinate inter‑fab learning reviews, gap assessments, and corrective action follow‑through. Support extended international assignments (3+ months) for training and technology transfer as required. People Leadership & Coaching Manage and develop a team of Process Integration engineers (NCG and experienced). Provide technical guidance, mentoring, and coaching on PI fundamentals, module ownership, and execution rigor. Set clear priorities, exp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: Lead design readiness activities for new DRAM products, including risk assessments, DFMEA development, validation planning, and readiness reviews Partner with cross-functional teams to identify product risks, define validation coverage, and prioritize debug activities Drive root-cause investigations of silicon findings through data analysis, experiment planning, evidence review, and corrective action development Influence product readiness decisions by connecting design intent, validation results, silicon behavior, manufacturing constraints, and customer quality expectations Mentor engineers and help improve technical practices, readiness processes, and organizational learning across DRAM programs Minimum Qualifications: Advanced degree in Electrical Engineering, Computer Engineering, Semiconductor Engineering, Applied Physics, Materials Science, or a related technical field, or equivalent industry experience Significant experience in semiconductor design, DRAM or memory technology, silicon validation, product engineering, device characterization, circuit debug, reliability, test development, or new product introduction Proven ability to analyze sophisticated technical problems using silicon data, validation results, circuit behavior, failure analysis

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Shift Process Engineer is responsible for improving process quality, working on yield and efficiency improvements, cost reduction, and resolving line issues in their assigned area to achieve area KPIs and optimize manufacturing wafer outs. They partner with equipment team members, leaders within the area, shift operations leaders, and periphery stakeholders to ensure critical area priorities are understood and executed on Responsibilities: Completes all required safety training and conducts all work in accordance with safety policies and regulations Ensures proper tool documentation/reaction mechanisms exist and submits updates to content Leads in expertise of executing area operations to ensure throughput needs are accomplished Resolves or escalates issues that

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Wet Etch Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our wet etching equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. This requisition is part of our talent pipeline for future opportunities. While we may not be actively hiring for this role today, we’re always looking to connect with gr

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the key talent within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will involve in both intrinsic and extrinsic reliability test program coding for Micron’s latest HBM products. Your responsibility is to develop new reliability test flow (eg: extended wafer level burn in, pWLRx, ELFR etc), both on DRAM and Interface die and a stacked product for extrinsic DPM (Time0 and Field DPM) and intrinsic reliability assessment to meet critical KPI’s Quality, Cost and Cycle Time. You will play pivotal role in ensuring the reliability and robustness of our products through advanced coding practices and comprehensive testing. This position demands a strong grasp of engineering principles, adept problem-solving skills, and a relentless dedication to maintaining high-quality standards. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating. Responsibilities: Reliability Test Program Coding: Writing and debugging test programs for HBM device and package qualification

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving both intrinsic and extrinsic reliability test development and execution for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. Your responsibility is to drive extrinsic DPM reduction (Time 0 and Field DPM) and lead the intrinsic reliability charter, along with optimized Manufacturing Test Flow to meet critical KPI’s Quality, Cost and Cycle Time. You will be leading the team to characterize the products from reliability aspect, identify the reliability gaps, working on root cause and resolution of qual and RMA failures pertaining to defectivity and intrinsic reliability margin and drive fab process improvement driven by the qual failures. Additionally, your team will also be the key person in frontend process conversion, where you will work with Fab, TD, GQ teams to establish robust business process for process conversions to facilitate yield improvements, DPM and Cost Reduction. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容 先端DRAM半導体製品において、生産技術部門 DRYエッチプロセスの一員として、量産技術改善から生産技術・管理を横断的に担い、ものづくりを推進する役割になります。 業務詳細 安全トレーニングを受講し、マイクロンの安全ポリシーに従い業務を遂行してもらいます。 生産技術部門DRY グループ内において、Process＆Equipment担当エンジニアの役割を担います。 Process＆Equipment担当エンジニアは、より高い生産性と高品質の量産技術の確立に向けて、多角的に活動し、業務・改善を進めて行きます。 良品率の改善や管理システムの改善、生産性向上の改善を進めて行く必要があります。 また、新規最先端装置の導入や改修もサポートし、より生産計画の向上を進めて行きます。 開発製品の導入時には、製品や生産技術の問題点を洗い出し、関連部門と連携しながら、量産化を実現して行きます。 DRY内において、装置担当エンジニアや、他のプロセス担当エンジニア、そしてシフト勤務に従事するテクニシャンと、コミュニケーションをとり、改善活動を牽引する。 日々の問題から、長期的なプロジュクトまで参画しながら、上司、チームメンバーそして関係者への報告を行う。マイクロンの海外生産拠点と技術交流にも参加して、情報の共有から、標準化を進めて行きます。 要件（全て満たしている必要は無い） ・先端の技術に興味を持ち、仕事に前向きに取り組むことができる。 ・課題を整理し、解決できる能力を有する。 ・関係部門と協議しプロジェクトを補佐する能力を有する。 ・社内外の人とコミュニケーションを円滑に取ることができる。 ・Microsoft Office (Excel, PowerPoint, Word) などのソフトウェアを使用できる。 ・自己管理（業務、健康）ができる。 ・物理化学、機械、電気等の基礎知識について、大学卒業以上の知識を有することが望ましい。 About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ATE (Alpha Technology Engineering) - New Product Team Diffusion Process Engineer is responsible for the successful transfer and implementation of new technology nodes developed by the Technology Development team. The role focuses on improving manufacturing yield, enhancing operational efficiency, and supporting equipment capacity expansion through close collaboration with Technology Development, Fab15 departments, the global DRAM network, and manufacturing teams. Responsibilities also include maintaining a strong safety culture, supporting technology transfers to sister sites, and preparing for future technology node introductions. As one of our team members, you should Understand site, department, area goals and set individual goals to achieve them with discussion with your SV. You are required to take responsibility for process & workstation as owner and do all tasks assigned timely and accurately. You are also highly appreciated working positively and show your ownership of all the tasks you are assigned. Responsibilities and Tasks: Establish and improve process condition and technology. Upgrade process capability and r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Contribute to the development of new product opportunities by assisting with the overall design, layout, and optimization of DRAM Memory array/Peripheral Logic/Analog circuits Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate schematic optimization and design‑space exploration Assist in parasitic analysis, sensitivity studies, and corner coverage Improve debug efficiency across simulation and silicon learning loops Define semicustom methodology for memory design Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments. Oversee and manage the layout process including floor-planning, placement, and routing Perform circuit-level verification including functional, timing, power and reliability analysis using industry standard and Micron-specific simulators and tools. Contribute to cross-group communication to work towards standardization and group success Drive innovation into the future memory generations and design methodology within a dynamic work environment Minimum Qualifications Master’s degree in electrical or computer engineering with 15+ years of experience in vlsi design. Strong fundamentals in CMOS circuit design, device physics and memory operation. Proven lea

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Taiwan Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles. Job Description The F16N PEE PVD Manager is accountable for establishing and continuously improving the performance of the Section critical metrics to achieve Best-In-Class performance. This includes to achieve HVM performances in Safety, TTMCY, Maxout , CT and Cost. Your responsibilities also include establish collaboration between OMT and differnece divison and areas. As Section Leader, you will also partake in the selection, development and sustainability of a high value workforce, as well as technical and leadership development. The PVD Section Manager is also responsible for working with Technology d e ep learning , Operation efficiency and especial focus on big rock as Max Out, cost down, TTMCY and quality mindset. Responsibilities and Tasks Department Management Dri

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Taiwan Micron’s global footprint is designed to deliver comprehensive customer collaboration, support and quality around the world and throughout the product lifecycle. Taiwan plays a meaningful role in strengthening Micron’s position in leading-edge DRAM. The Center’s goal is to achieve the most efficient and effective technology transfer and manufacturing ramp by combining front- and back-end manufacturing, product engineering and technology development roles. Job Description The F16N PEE IMP Manager is accountable for establishing and continuously improving the performance of the Section critical metrics to achieve Best-In-Class performance. This includes to achieve HVM performances in Safety, TTMCY, Maxout , CT and Cost. Your responsibilities also include establish collaboration between OMT and differnece divison and areas. As Section Leader, you will also partake in the selection, development and sustainability of a high value workforce, as well as technical and leadership development. The PEE Section Manager is also responsible for working with Technology d e ep learning , Operation efficiency and especial focus on big rock as Max Out, cost down, TTMCY and quality mindset. Responsibilities and Tasks Department Management

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Lead Principal Engineer, Layout Design at Micron, you will be at the forefront of developing groundbreaking memory solutions! This role is an outstanding opportunity to lead the physical implementation of modern DRAM and mixed-signal circuits, turning schematics and specifications into flawless, manufacturable layouts. You will collaborate with a world-class team of Circuit Designers, Verification Engineers, CAD/Methodology experts, Process Integrators, Product Engineers, Test/Probe specialists, Assembly professionals, and Marketing strategists. Together, we will drive cost, quality, reliability, time-to-market, and customer happiness through outstanding layout and build. Key Responsibilities Lead the layout build and physical realization of new memory products. Interpret device and circuit specifications to implement custom layout solutions meeting PPA (power, performance, area) and reliability targets. Develop hierarchical layouts for analog, digital, and memory-array-related circuitry using industry-standard EDA tools. Build block and top-level floorplans optimizing placement, routing resources, signal integrity, power delivery, and manufacturability. Optimize layout for critical metrics such as die size/area efficiency, matching, coupling/noise, and timing. Produce layout collateral and documentation for cross-team integration. Physical Verification and Tapeout Signoff Run and debug physical verification flows and ensure closure using indust

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description For more than 47 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life for all. Become an Engineer CAD at Micron Technology in Guadalajara. Contribute to innovative memory designs impacting HBM, DRAM, and new technologies. Responsibilities: Provide day-to-day support for CAD tools, flows, and collateral, ensuring they meet the needs of HBM design teams at the Guadalajara Design Center. Collaborate closely with HBM design, layout, and verification methodology teams to propose and co-develop advanced capabilities, ensuring the deployment of outstanding practices and methodologies. Support all aspects of mixed-signal, transistor-level custom IC design, including logical design, custom layout, parameterized cells, automated place and route tools, physical design verification, ERC, Layout Parasitic Extraction, pre and post layout netlisting and simulation, digital and analog circuit simulation, timing and power analysis, reliability simulation and analysis, tape out, and mask generation. applying Artificial Intelligence Minimum Qualifications: Bachelor’s or preferably a Master’s/PhD in Computer Engineering, Computer Science, or Electrical Engineering. 5+ years of direct CAD or Design experience in mixed

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Wet Etch/CMP/Bond , you will play a critical role in enabling 24/7 process development for next-generation DRAM technologies within the Wet Etch/CMP/Bond Process Areas. This position operates on a 12-hour rotating shift schedule and serves as the primary engineering decision-maker for development activities occurring during off-hours for one of the three listed areas while also supporting the other two areas as needed. You will work closely with Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to ensure uninterrupted development execution, increase learning velocity, and support technology roadmap objectives. Unlike traditional manufacturing shift engineering roles, this MDE Shift Engineer operates in a highly dynamic development environment where process conditions, specifications, and experimental flows frequently evolve. This role requires strong engineering judgment to disposition development wafers, make real-time process decisions, troubleshooting process and equipment issues, and appropriately balance execution needs with development objectives. Responsibilities Serve as the primary off-shift engineering decision-maker for development activities, using sound engineering judgment to disposition wafers, release or hold tools, define actions on development targets, respond to process deviations, handle execution risk