Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team defining the future of memory systems. Our DRAM Architecture organization works at the intersection of silicon, packaging, systems, and customers to build technologies that power next-generation platforms. If you enjoy solving ambiguous problems that matter at industry scale, this is the place. This role is a senior technical leadership position with broad architectural ownership. You will develop complete DRAM system architectures, impact industry direction, and engage directly with customers and executives to convert complex ideas into scalable products. Responsibilities: Define next-generation memory system builds focusing on performance, capacity, RAS, and telemetry Lead cross-stack co-optimization spanning silicon, package, module, board, and system Architect sophisticated RAS and telemetry features and translate system needs into silicon Drive long-range memory technology strategy and influence industry standards Act as a senior technical liaison to customers, executives, and partners <
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We're advancing some of the most important technologies in modern computing. Our memory solutions power AI, cloud, enterprise, mobile, and high-performance computing platforms around the world. The Memory Systems Architecture team explores complex technical challenges across the memory stack and turns them into practical product innovations, helping shape the future of memory technologies and industry standards. As a Technical Staff Member, you will provide systems-level architecture leadership for next-generation memory solutions. This role combines analytical modeling, architecture development, reliability strategy, and cross-functional influence to help define future products. You will work across engineering disciplines to evaluate tradeoffs, guide technical decisions, and develop differentiated solutions that deliver value to customers and platforms. Responsibilities: Define architectures for DDR, LPDDR, HBM, CXL-attached memory, and emerging memory technologies. Develop analytical and simulation-bas
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Systems & Architecture Lab researches next-generation memory architectures that enable future AI, machine learning, and high-performance computing systems. The team explores innovative memory technologies, system architectures, and hardware-software co-design approaches to improve performance, scalability, and efficiency for emerging AI workloads. As a Research Intern in the DRAM Systems & Architecture Lab, you will conduct research focused on next-generation memory systems for AI accelerators. You will investigate tiered memory architectures, analyze AI workload behavior, develop experimental prototypes, and evaluate architectural innovations across hardware, software, and system-level environments. This role offers the opportunity to contribute to research that may influence future product roadmaps, publications, and advanced memory system designs. Responsibilities Research and evaluate tiered memory architectures designed to improve performance and scalability for AI inference and large language model workloads.<
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Systems & Architecture Lab researches and develops next-generation memory architectures that enable future AI, cloud, data center, and high-performance computing platforms. By combining advanced modeling, simulation, AI-enabled workflows, and architectural innovation, the team evaluates emerging memory technologies and defines solutions that improve performance, scalability, and efficiency for future memory systems. As a DRAM Architecture Research Intern, you will develop software frameworks, automation tools, and AI-assisted workflows that accelerate memory architecture research and analysis. You will work closely with architects and researchers to evaluate next-generation memory technologies, build simulation environments, perform performance analysis, and apply advanced AI capabilities to automate architectural studies and design-space exploration. Responsibilities Develop and enhance software frameworks, simulation environments, and automation tools that support DRAM architecture research and evaluation.</li
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-bandwidth memory products. In Micron's High Bandwidth Memory Architecture organization, we partner closely with customers to deliver memory solutions purpose-built for emerging AI systems and applications. As a Senior Member of Technical Staff or Member of Technical Staff, DRAM Design Engineer in the next-generation HBM Architecture team, you will drive the architecture and optimization 3D-stacked, high-performance memories. Apply your knowledge to optimize DRAM designs and architectures for maximum performance, power, and area (PPA). This role is ideal for experienced DRAM designers who will identify, architect, design, and simulate next-generation architectures and memory features in collaboration with experts in stack architecture, memory systems architecture, and SoC microarchitecture. Responsibilities: Identify and develop novel DRAM circuit architectures that anticipate next-gener
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking an experience high-speed high-speed IO/Clocking Design Engineering at a Principal/Sr Member of Technical Staff (SMTS) level to join our DRAM IP Design team and contribute to the development of critical high-speed IP circuits used across Micron’s DRAM memory products. In this role, you will be responsible for the architecture, design, development, optimization, verification, and technical support of these high-speed IPs. You will focus on equalization and bandwidth extension to push the limits of circuit and process performance, analyze IO impairments as well as clock jitter and duty cycle distortion, and assess their impact on DRAM system timing. You will also develop core strategy and implement effective engineering solutions to address these challenges. Relocation to Micron headquarter in Boise, Idaho is required for this position. Responsibilities: Define, innovate, design, optimize and verify high-speed IO and clocking circuits used in new DRAM products. Apply
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron's DRAM Systems & Component Architecture team to develop next-generation software platforms and AI-enabled workflows for memory-system architecture research. This role combines computer architecture, DRAM systems, software development, and artificial intelligence to accelerate architecture exploration, simulation, data analysis, and technical decision making for future memory technologies. The US base salary range that Micron Technology estimates it could pay for this full-time position is: $35.96 - $43.15 an hour Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experienc
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary We are seeking a motivated engineer to join the DRAM Systems Engineering team, focusing on the development, evaluation, and optimization of next-generation memory systems for AI accelerators. This role emphasizes research and development across hardware architecture, operating systems, and performance analysis to support Agentic AI inference workloads. If you are ambitious and eager to make an impact in the exciting world of AI and memory systems, this is the perfect opportunity for you! Responsibilities Characterize AI inference workloads and examine memory behavior Build and evaluate tiered memory hierarchies for AI accelerators Study KV cache lifecycles, MoE models, and data placement strategies Compare and optimize explicit versus hardware-assisted data movement</spa
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Design Engineering organization is dedicated to creating world‑class memory and storage solutions through sophisticated digital and analog circuit innovation. Our teams span the globe and collaborate across technology development, product design, systems architecture, and validation to deliver industry‑leading semiconductor products. The Principal Design Engineer plays a key role in developing, analyzing, and optimizing circuit designs that power Micron’s next‑generation memory technologies. This role partners closely with diverse teams—including Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing—to ensure best‑in‑class performance, quality, cost efficiency, and time‑to‑market. Responsibilities: Design and optimize memory circuits from gate‑level to full chip implementations. Lead development of schematic blocks such as memory arrays, control logic, address decode, datapath, and internal test logic. Perform advanced circuit simulations using industry tools (e.g., SPICE,
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Compute and Memory Business Unit (CMBU), driving the innovation behind Micron's next generation DRAM solutions for AI, data center, and client computing platforms. Our team collaborates across product architecture, design, validation, and system engineering to solve complex challenges in bandwidth, power, reliability, and scalability. Together, we help shape the future of memory technology for the world's most demanding compute environments. As a Product Architecture Engineer focused on Signal Integrity (SI) and Power Integrity (PI), you will define the electrical architecture that enables next-generation DRAM products. This highly visible role combines deep technical expertise with system-level thinking to influence product roadmaps, guide design decisions, and partner with industry-leading ecosystem stakeholders. Your work will help deliver memory solutions that power tomorrow's AI and high-performance computing platforms. Responsibilities: Lead SI/PI architecture pathfinding for next-generation DRAM products across
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions! In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction! Job Description As a Staff DRAM Design Engineer, you’ll play a critical role in shaping memory architectures and circuit innovations that directly impact product performance, power, and reliability. This is a hands-on design role where your expertis
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron's Boise R&D site, the DRAM Technology Development organization drives innovation in next-generation memory solutions. The team develops advanced DRAM cell architectures, access devices, materials systems, and integration technologies that enable future scaling, improved performance, enhanced reliability, and manufacturing readiness. Engineers work across device, materials, process integration, modeling, design, and product engineering teams to bring groundbreaking memory technologies from concept to production. As an intern in the Advanced DRAM Device & Cell Technology team, you will contribute to the development and characterization of future DRAM cell and access device technologies through experimental studies, data analysis, and collaboration with multidisciplinary engineering teams. This position combines semiconductor device physics, materials engineering, silicon experimentation, electrical characterization, and data-driven decision making to improve cell performance, density, retention, reliability, and manufacturability.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DASG Architecture Lab and Customer Enablement Lab (CEL) teams provide the infrastructure, platforms, and technical expertise required to accelerate technology pathfinding, AI and system workload analysis, memory subsystem characterization, FPGA/LPDRAM prototyping, and customer enablement initiatives. These teams play a critical role in enabling architecture exploration, validation, and teamwork across engineering organizations and external partners. AI Efficiency and Usage is a must. AI proficiency or AI‑enabled ways of working where applicable. Agentic AI and Generative AI usage model is a must. Responsibilities Own the day-to-day bring-up, readiness, maintenance, and operational support of lab systems, racks, benches, test equipment, and reference platforms used by DASG Architecture Lab and Customer Enablement Lab teams. Deploy, configure, and maintain server, GPU, FPGA, client AI, mobile AI, analyzer, and environmental test equipment supporting workload characterization and technology pathfinding activities.</li
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Architecture team is responsible for defining the system‑level and silicon‑level architectures that enable Micron’s memory products. The team works across technology generations and product lines, collaborating with design, product, systems, and ecosystem partners to deliver scalable, reliable, and high‑performance memory solutions aligned with customer and market needs. This role provides senior‑level architectural leadership to help shape Micron’s next‑generation DRAM products. As a Distinguished Member of Technical Staff, you will influence memory architecture decisions across semiconductor chips, assembly methods, component units, and system interfaces, contributing to both near‑term product execution and long‑term technology direction. This role requires AI proficiency or AI‑enabled ways of working. Responsibilities: • Define and evolve DRAM system architectures that address performance, capacity scaling, reliability (RAS), and observability requirements. • Collaborate across functions to evaluate arch
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Customer Engineering team at Micron, where we partner directly with leading datacenter customers to solve complex challenges and bring cutting-edge memory solutions to life. Our work sits at the intersection of innovation and real-world impact—enabling faster computing, smarter systems, and breakthroughs across industries. This role is a key bridge between Micron and our customers. As a Datacenter DRAM Customer Engineer, you’ll act as a primary technical advisor, helping customers design, qualify, and deploy memory solutions that power next-generation compute platforms. You’ll collaborate across engineering, sales, and product teams while influencing both customer success and Micron’s product direction. Responsibilities: Drive design wins and product qualifications for DRAM, HBM, SSD, and compute-focused solutions Partner with sales and cross-functional teams to execute strategic customer plans and track progress Resolve sy
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