Dram Systems Architecture Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s DRAM Technology Development group, where engineers operate at the leading edge of semiconductor process and product innovation. This role sits at the intersection of process technology, product requirements, and manufacturing execution, and is critical to enabling next generation DRAM technology. As a Principal Node Development Product Engineer, you will play a technical role in driving product readiness through close engagement with process integration, device, yield, test, design, and manufacturing teams. You will own deep process‑aware product knowledge, identify node‑specific risks, and translate silicon behavior into actionable decisions that ensure robust, scalable next generation DRAM products. Responsibilities Serve as a technical contributor during development stage of next gen DRAM! Drive process‑aware product optimization, identifying sensitivities, interactions, and integration risks Analyze silicon data (electrical, parametric, yield, reliability) to identify systematic process or integration limiters Partner with design, process integration, test, and device teams to debug yield and performance issues and converge on root cause Collaborate closely with manufacturing and TD to enable smooth node readiness, learning cycles, and factory ramp Translate process changes into product impact assessments, including PPA, yield, reliability, and test coverage Guide test content and monitoring strategies to ensure early detection of process

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development Group, where we turn advanced materials into manufacturable memory technology. Our thin films teams work at the groundbreaking edge of DRAM scaling, partnering across R&D, manufacturing, and suppliers to enable future nodes. We operate in a fast paced, hands‑on environment where strong fundamentals and execution matter! As a Thin Films Engineer, you will develop and integrate deposition processes that directly enable Micron’s next-generation DRAM! This role owns thin film concepts from early development through high‑volume manufacturing, with a strong focus on EUV patterning films. You will work closely with cross‑functional teams and external partners to deliver robust, scalable processes that meet aggressive technology requirements. Responsibilities: Develop, optimize, and transfer thin film deposition processes for EUV‑enabled DRAM technology Lead process characterization, troubleshooting, and defect reduction through VME Drive thin film roadmap activities aligned to future technology nodes Collaborate with internal teams and suppliers to mature equipment, chemistries, and process solutions Analyze large physical and electrical datasets and communicate clear recommendations Minimum Qualifications: PhD or MS with 4+ years of semiconductor experience in materials or process development Strong foundation in materials science, chemical reaction engineering, and thin film physics H

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development Group, where we turn advanced materials into manufacturable memory technology. Our thin films teams work at the groundbreaking edge of DRAM scaling, partnering across R&D, manufacturing, and suppliers to enable future nodes. We operate in a fast paced, hands‑on environment where strong fundamentals and execution matter! As a Thin Films Engineer, you will develop and integrate deposition processes that directly enable Micron’s next-generation DRAM! This role owns thin film concepts from early development through high‑volume manufacturing, with a strong focus on EUV patterning films. You will work closely with multi-functional teams and external partners to deliver robust, scalable processes that meet aggressive technology requirements. Responsibilities: Develop, optimize, and transfer thin film deposition processes for EUV‑enabled DRAM technology Lead process characterization, troubleshooting, and defect reduction through VME Drive thin film roadmap activities aligned to future technology nodes Collaborate with internal teams and suppliers to mature equipment, chemistries, and process solutions Analyze large physical and electrical datasets and communicate clear recommendations Minimum Qualifications: PhD or MS with 4+ years of semiconductor experience in materials or process development Strong foundation in materials science, chemical reaction engineering, and thin film physics H

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Design and maintain standard cells for new DRAM products on new technology Closely collaborate with DTCO team to develop stdcells architecture for emerging technologies Characterization and modeling of Standard cells to provide timing/power model Quality Analysis of characterized liberty models in terms of performance, Power and Functionality Develop automation test bench/flow/tools to improve the work efficiency and help data analysis Co-work with international colleagues on developing new flows and tools for stdcells design Ability to identify stdcells design & char pain points suitable for AI-based automation and collaborate with cross‑functional teams to deploy scalable solutions. Requirements Good understanding of CMOS circuit design Good knowledge of CMOS device physics and layout Experience in total stdcells flow from DTCO development/ spec definition till lib release RTL/GDS flow setup, block level timing analysis, ICC2 experience. Preferred Synopsys EDA flow Finefet & planner experience required. Experience in any characterization tools (Siliconsmart/Liberate)and Cadence Virtuoso preferred. Experience in Primetime, Solido Analytics Familiar with analog/digital simulation tools, i.e. HSPICE, HSIM, VerilogHDL, FINESIM, Simvision Experience in Standard Cell design, layout and verification Experience in Skill, TCL, Per

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities Design and maintain standard cells for new DRAM products on new technology Closely collaborate with DTCO team to develop stdcells architecture for emerging technologies Characterization and modeling of Standard cells to provide timing/power model Quality Analysis of characterized liberty models in terms of performance, Power and Functionality Develop automation test bench/flow/tools to improve the work efficiency and help data analysis Co-work with international colleagues on developing new flows and tools for stdcells design Ability to identify stdcells design & char pain points suitable for AI-based automation and collaborate with cross‑functional teams to deploy scalable solutions. Requirements Good understanding of CMOS circuit design Good knowledge of CMOS device physics and layout Experience in total stdcells flow from DTCO development/ spec definition till lib release RTL/GDS flow setup, block level timing analysis, ICC2 experience. Preferred Synopsys EDA flow Finefet & planner experience required. Experience in any characterization tools (Siliconsmart/Liberate)and Cadence Virtuoso preferred. Experience in Primetime, Solido Analytics Familiar with analog/digital simulation tools, i.e. HSPICE, HSIM, VerilogHDL, FINESIM, Simvision Experience in Standard Cell design, layout and verification Experience in Skill, TCL, Per

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The DRAM Technology group at Micron Technology develops and validates advanced memory solutions that enable the transformation of information into intelligence. The team operates in a collaborative, inclusive, and globally distributed environment, partnering closely with design, product, test, process, manufacturing, and quality organizations to deliver industry‑leading DRAM technologies. The Design Validation Product Engineer supports the validation of new DRAM products by focusing on real‑silicon behavior through bring‑up, characterization, and debug. This role builds a strong technical foundation in DRAM architecture, semiconductor devices, and validation methodologies while working closely with multi-functional engineering teams. Responsibilities Support DRAM design validation through silicon bring‑up, characterization, and validation testing of new memory products Analyze electrical and functional data to identify trends, marginalities, and failure mechanisms Assist with debug of validation issues using simulations, test results, and laboratory measurements Use engineering lab equipment and testers to characterize device behavior and performance Document validation results, test coverage, and observed behaviors while collaborating with design, test, manufacturing, and quality teams Minimum Qualifications Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field Strong fundamentals in digital logic,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Establish and improve process condition and technology. • Upgrade process capability and reduce production cost. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact <a target="_blank" href="mailto:hrsupport_jp&#64;micron.c

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Engineer at Micron Technology, Inc., your primary responsibility will be establishing quality criteria and monitoring quality indices based on FE and BE signals from NPI to high-volume manufacturing (HVM). You will define, lead and drive key action to bring Micron product quality to be the best in class and to prevent quality and reliability related issues from repeat occurrence. Meanwhile, you will involve in developing and supporting qualification stress flows and characterization for HBM and other high performance memory solutions. You will be driving the following: Collaborate with collaborators to define, deploy and monitor outgoing quality and reliability (OQR) metrics based on FE and BE production signals as well as reliability test results Partner with package development engineer and product engineer on latest products and technologies to define quality and reliability fail modes Proactively work to evaluate, characterize, and mitigate Quality and Reliability risks and fail modes for BE new products and HVM Collaborate with MFG Quality Assurance and Quality Engineer teams to improve QR fail mode list for HVM products. Engage with key teams to set and validate OQR specifications and address recognized and potential Quality and Reliability issues Dispo deviation material based on production signals and reliability test results with quick turnaround ti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13&#43; years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Frontend Central Product Integration Engineering (PIE) team drives leading-edge process capability, best-in-class yield (bits per wafer), high product quality, and rapid time to maturity through innovation and strong cross-functional collaboration. Supporting a global DRAM and NAND technology portfolio across development and manufacturing sites in the U.S., Japan, Taiwan, and Singapore, the team ensures consistent execution of manufacturing excellence worldwide! As a Frontend Central Process Integration Senior Engineer, you will identify, align, and deploy best-known methods across the global network and develop optimized processes to achieve product maturity and sustainable performance improvement. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline transparency to enable fast yield ramp and minimize excursion. Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network. Travel to Micron sites as necessary for face to face collaboration. </li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here! This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost. Responsibilities: Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness Minimum Qualifications: Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field 13&#43; years of semiconductor R&D experience, incl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Hands on experience in SV, UVM based Verification. Good scripting skills using perl, python is a plus Good understanding of digital / mixed signal circuits and experience in Digital /Mixed signal Verification. Understand the usage of industry standard tools like Virtuoso, Xcellium, Simvision, vsim, Waveview, Finseim, Hspice and Micron-specific simulators Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments and contribute to cross-group communication to work towards standardization and group success About

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Hands on experience in SV, UVM based Verification. Good scripting skills using perl, python is a plus Good understanding of digital / mixed signal circuits and experience in Digital /Mixed signal Verification. Understand the usage of industry standard tools like Virtuoso, Xcellium, Simvision, vsim, Waveview, Finseim, Hspice and Micron-specific simulators Collaborate with CAD, EDA, and software teams to integrate AI‑driven flows into simulation, verification, and design sign‑off environments and contribute to cross-group communication to work towards standardization and group success About M

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: Drive best-in-class product maturity which includes bits per wafers (yield), product grades (Repair Density and DPM) at the fastest speed and cycle of learning. In depth knowledge of processes across different loops or functions (FEOL, MOL, CELL, BEOL) to identify best optimum process integration solution to achieve the goal, knowledge on product and circuit design will be plus. Collaborate with YE, Device, RDA, Metrology team to resolve top yield issues, develop inline visibility to enable fast yield ramp and minimize excursion. Identify best known method and business process from DRAM/NAND sites and drive for alignment and standardize across network. Travel to Micron sites as necessary for face to face collaboration. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people creat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務内容&#xff08;Job Description&#xff09; Micronのテクノロジー開発&#xff08;Technology Development&#xff09;グループに所属する DRAMプロセスインテグレーション・パスファインディングエンジニアとして、次世代DRAMテクノロジーノードに向けたモジュール開発を主導していただきます。 モジュールオーナーとして、1つまたは複数のモジュールに対する構造的および電気的要件を定義し、ユニットプロセス部門や支援チーム、ならびに他のモジュールオーナーと連携しながら、モジュールをプロセス全体に統合します。 また、多分野のエンジニアからなるチームと協働し、新しいアーキテクチャ、デバイス、技術、材料を評価することで、今後5年以上を見据えた技術開発の方向性を検証します。 主な業務内容&#xff08;Responsibilities&#xff09; 電気特性、インライン指標、ユニットプロセス、デザインルールに基づき、構造仕様を策定する 構造‐電気特性の相関に基づき、エンジニアリング仕様を満たすための実験を設計・実行・解析する モデルベースのアプローチで問題解決を行い、プロセス改善、特許、技術論文を通じて技術革新を推進する 1つまたは複数のプロセスモジュールについて、デザインルール、構造仕様、電気仕様を含めて開発・維持・改善する&#xff08;代替フロー含む&#xff09; 既存プロセスフローを最適化し、製品要件を満たす創造的な解決策を開発する JMPなどの統計解析ソフトウェアを用いて、実験の設計・実行および結果解析を行う 結果を製品側へフィードバックし、歩留まり改善に貢献する インラインデータ、欠陥データ、パラメータデータ、プローブデータを抽出・監視・解析し、 歩留まり問題の解決、性能・信頼性向上、プロセスマージン拡大、コスト削減を推進する 設計、製品技術、モデリング、歩留まり改善、電気・物理的故障解析、欠陥解析、パラメータ、品質チームと部門横断的に連携し、課題・目標・優先順位を理解する 複雑な問題を要約し、対応策を導出・説明し、チームの実行を牽引する 担当モジュール内におけるサブマイルストーンを定義する プロセスインテグレーション、プロセス開発、パイロットファブ間の円滑なコミュニケーションを維持・徹底する 製造移管に向けて、R&D活動の適時なドキュメンテーションを確実に行う 学歴・経験要件&#xff08;Education and Experience&#xff09; 修士号または博士号 &#xff08;電気工学、マイクロエレクトロニクス、物理学、材料科学&#xff09; または 学士号&#xff0b;業界経験5年以上 必要スキル・知識 半導体デバイス物理および電気特性評価に関する知識 材料科学および半導体プロセス基礎に関する知識 JMP、Python、またはその他のデータ解析&#xff0f;データエンジニアリングソフトを用いたデータ解析スキル 英語による対人・口頭・文書コミュニケーション能力 歓迎要件&#xff08;Preferred Experience&#xff09; プロセスインテグレーション、またはそれと密接に関わる職務における業界経験5年以上 DRAM製