Hbm 3d Power Delivery Network Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description: New Product Operations (NPO) Product Manager (HBM) plays a critical role in driving successful planning and execution of early lifecycle phases for New Product Introduction (NPI) products and this role will support the enablement of industry leading High Performance memory products (HBM). This position ensures alignment across the value chain to achieve predictable manufacturing readiness and seamless transition to High Volume Manufacturing (HVM). Key Responsibilities: • Be the program Operations liaison in core HBM Product Development Teams (PDT’s) driving all Operations Requirements (Supply Chain, Manufacturing, Procurement, Compliance, Logistics) and representing Operations in executive reporting forums. • Participate early in the Product Lifecycle Management (PLM) process to address manufacturing operations and enterprise system concerns for new products. • Maintain schedules for ramp and a smooth transition to HVM, ensuring milestones are met. • Oversee sample processes, ensuring delivery meets specifications, customer expectations, and On-Time Delivery (OTD) performance metrics. • Ensure product Bill of Materials (BOM) complies with Design for Supply Chain (DfSC) and Bill of Material Risk Review (BRR) guidelines. Facilitat

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In HBM HIG (High Bandwidth Memory, Heterogeneous Integration Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most ambitious due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Design, implementation and integration of complex analog circuits such as CMOS Amplifiers, Comparators, Bandgap References, LDOs, Charge Pumps, Oscillators, DLL, IO Buffers, Analog Test Mux, Process Monitor, and Temperature sensors for advanced DRAM products. Design, implementation and integration of synchronous and asynchronous custom digital block Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Analog/Memory/Logic circuits. Parasitic modeling and design validation, reticle experiments and required tape-out revisions. Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Mentor and lead young designers. Usage & working with AI Skills is must Strong

STAFF ENG-HBM-LAYOUT — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Design layout for leaf cells, standard cells (Stdcell), or sub-blocks. Apply a systematic, meticulous, and methodical approach to IC layout design. Interpret DRC/LVS and other physical verification checks to ensure design accuracy. Demonstrate ownership and proactively plan work to meet project timelines. Collaborate effectively with internal teams to ensure successful layout project execution. Minimum Qualifications Bachelor’s, Master’s, or PhD in Electronics, Mechatronics, Robotics Engineering, Nanotechnology, or related fields. Graduation within the last 2 years (Bachelor’s, Master’s, or PhD). Strong knowledge of electronic circuit concepts. Experience using circuit simulation and design tools. Effective interpersonal and problem-solving skills. English communication skills (conversational level required). Self-motivated, enthusiastic, and collaborative standout colleague. Passion for technology and willingness to grow in the semiconductor industry. Preferred Qualifications Internship or academic project experience in pre-silicon circuit design. Understanding of pre-silicon development areas such as analog circuits and physical design. Basic knowledge of MOS concepts, semiconductor fabrication, and analog layout fundamentals. Strong interpersonal skills and goal-oriented perspective. Experience with programming or script

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Additional responsibilities include, but are not limited to: Responsibilities: Performs electrical or mechanical troubleshooting to determine problems in non-functioning electro-mechanical equipment used in the manufacturing process Dismantles, adjusts, repairs and assembles equipment according to layout plans, blueprints, operating or repair manuals, rough sketches or drawings Uses test and diagnostic equipment to perform checkouts. Rebuilds manufacturing equipment as required May perform equipment modifications as directed by engineers. Successful Candidates must have the following Qualifications: Knowledge of AC/DC circuits, including: fundamentals of electricity, and basic electronic components and circuits Strong mechanical aptitude with the ability to understand and fix mechanical systems Vacuum system knowledge and troubleshooting ability Ability to use schematic diagrams to troubleshoot systems to components level Intermediate PC skills including a familiarity with MS Office Suite. Understanding of the process flow related to area equipment Problem-solving skills and the ability to efficiently prioritize tasks Ability in multi-tasking complex projects and enjoy working in a fast pace environment Time management, organization, and prioritization skills Follows procedures and work with minimal supervision</li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Lead end-to-end layout execution of analog, mixed-signal, custom digital blocks and full-chip integration for HBM products. Own full-chip technical decisions covering analog, digital, memory, ESD, EM/IR and ensure optimal performance, power, and area (PPA). Technical Expertise : Hands-on experience in layout design of critical Memory /Analog and mixed-signal blocks such as: Array Layout, Decoder, Control logic , IOs , PLLs , ADCs, DACs, LDOs, Bandgaps, Reference Generators, Charge Pumps, Current Mirrors, Comparators, and Differential Amplifiers. Drive project planning and execution , including area/time estimation, scheduling, task delegation, and milestone tracking across multiple concurrent programs. Ensure timely delivery with quality , responsible for block-level and full-chip layouts meeting schedule commitments and quality expectations. Perform and oversee layout verification activities including LVS, DRC, Antenna checks, and ensure closure with proper documentation and audits. Lead and mentor the layout team , guiding junior engineers on sub-block execution, conducting design reviews, and enabling capability development. Drive innovation and productivity improvements , including adoption of AI/automation to reduce layout effort, improve turnaround time, and enhance quality. <li

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Highly motivated with passion, detail oriented, systematic and methodical approach in IC layout design Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Demonstrate leadership Skill in planning, area/time estimation, scheduling, delegation and execution to meet project schedule/milestones in multiple project environment. Lead the layout design and development of complex analog, mixed-signal, and digital blocks and full chip level integration Ensure timely delivery of high-quality block-level layouts, meeting project milestones and design specifications. Perform layout verification including LVS, DRC, and antenna checks, along with thorough quality reviews and documentation. Collaborate with global engineering teams to ensure successful execution and integration of layout projects. Provide technical guidance and mentorship to junior team members, reviewing sub-block layouts and supporting their development. Demonstrate leadership in planning, time estimation, scheduling, and execution across multiple projects. Contribute actively to project management and cross-functional coordination. Proven experience in IC layout design with a systematic and methodical approach. Strong attention to detail and a passion for high-quality design. Excellent communication and collaboration

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertise :

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. We are hiring a Layout Engineer for Micron Technology’s HBM Team in Hyderabad, India. In this role, you will contribute to advanced applications including artificial intelligence and high-performance computing solutions with High Bandwidth Memory. You will coordinate with peer groups across Micron's worldwide locations on multiple projects, providing an exceptional chance for career development! Role and Responsibilities Build and develop critical analog, mixed-signal, custom digital blocks, and provide full chip level integration support. Build and tapeout PWF Reticles. Collaborate with the Scribe Build team to implement and review Advanced Packaging requirements. Engage in TSV build with HIG-HBM DTPCO teams, ensuring flawless electrical, thermal, and mechanical performance. Exhibit a highly motivated, diligent, meticulous, and methodical approach in IC layout development. Perform layout verification like LVS/DRC/Antenna checks, quality control, and documentation. Ensure timely delivery of block-level layouts with outstanding qual

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a DRAM and Emerging Memory Quality and Reliability Assurance (DEMQRA) High Bandwidth Memory (HBM) Engineer at Micron Technology, Inc., your primary responsibility will be establishing quality criteria and monitoring quality indices based on FE and BE signals from NPI to high-volume manufacturing (HVM). You will define, lead and drive key action to bring Micron product quality to be the best in class and to prevent quality and reliability related issues from repeat occurrence. Meanwhile, you will involve in developing and supporting qualification stress flows and characterization for HBM and other high performance memory solutions. You will be driving the following: Collaborate with collaborators to define, deploy and monitor outgoing quality and reliability (OQR) metrics based on FE and BE production signals as well as reliability test results Partner with package development engineer and product engineer on latest products and technologies to define quality and reliability fail modes Proactively work to evaluate, characterize, and mitigate Quality and Reliability risks and fail modes for BE new products and HVM Collaborate with MFG Quality Assurance and Quality Engineer teams to improve QR fail mode list for HVM products. Engage with key teams to set and validate OQR specifications and address recognized and potential Quality and Reliability issues Dispo deviation material based on production signals and reliability test results with quick turnaround ti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. What’s Encouraged Daily: Contribute to the development of new HBM products by assisting with the overall design, and layout. · Interpret product specifications and design circuits to meet the required functionality. · Design, implementation, and improvement of Complex Analog Mixed Circuits such as CMOS Amplifiers, Comparators, Bandgap references, V2I converters, LDOs, charge pumps, Oscillators , DLL, IO circuits (DDR/LPDDR), Delays, Process and temperature sensors in advanced semiconductor process nodes for advanced High Bandwidth Memory ( HBM ) products · Integration of modules with Power delivery network and propose design solution for optimum performance · Deep understanding of Array and its peripheral circuits. · Driving innovation into the future Memory generations within a dynamic work environment · Validate & optimize design for reliability (Device stress, Aging effect) · EM/IR simulation, optimize layout to achieve best circuit performance ·

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life. As a Principal/MTS Engineer, you will be an integral part of our HIG HBM Team in Hyderabad, India, responsible for designing and developing complex Application-Specific Integrated Circuits to meet our product's specifications and requirements for High Bandwidth Memories, working for intensive applications such as artificial intelligence and high performance computing solution. Your expertise will contribute to the successful realization of pioneering semiconductor products, enabling our company to maintain its competitive edge in the industry. Role and Responsibilities Must have a solid understanding of die design . This includes knowledge of various die components, their functions, and how they interact within the overall tool. Familiarity with the principles of die design is essential to create effective and efficient layouts. Industry Involvement : You actively participate in standards committees, representing Micron and staying informed about industry developments. Leading Project Layout Team : You lead the establishment and growth of a layout team to meet Micron’s global HBM layout requirements. Technical Expertis